| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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| 10/10/2002 | WO2002079887A2 Apparatus and methods with resolution enhancement feature for improving accuracy of conversion of required chemical mechanical polishing pressure to force to be applied by polishing head to wafer |
| 10/10/2002 | WO2002078905A1 Method and apparatus for end point triggering with integrated steering |
| 10/10/2002 | WO2002078904A1 Support for a polishing belt |
| 10/10/2002 | WO2002078903A2 Method and apparatus for avoiding particle accumulation during an electrochemical process |
| 10/10/2002 | WO2002078902A1 Reinforced polishing pad with a shaped or flexible window structure |
| 10/10/2002 | WO2002078901A1 A chemical mechanical planarization system with an adjustable force applying air platen |
| 10/10/2002 | WO2002078900A2 Apparatus and methods for aligning a surface of an active retainer ring with a wafer surface for chemical mechanical polishing |
| 10/10/2002 | WO2002078899A1 Chemical mechanical polishing apparatus having edge, center and annular zone control of material removal |
| 10/10/2002 | WO2002065529A3 Chemical-mechanical planarization using ozone |
| 10/10/2002 | WO2002049082A3 Process of shaping a semiconductor substrate and/or a lithographic mask |
| 10/10/2002 | WO2001085392A3 Metal chemical mechanical polishing process for minimizing dishing during semiconductor wafer fabrication |
| 10/10/2002 | US20020146973 Composite polishing pad for chemical-mechanical polishing |
| 10/10/2002 | US20020146972 Apparatus for controlling leading edge and trailing edge polishing |
| 10/10/2002 | US20020146969 CD refacing system |
| 10/10/2002 | US20020146966 Method for optimizing the planarizing length of a polishing pad |
| 10/10/2002 | US20020146907 Method and apparatuses for making and using bi-modal abrasive slurries for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies |
| 10/10/2002 | US20020146877 Method of simultaneously polishing a plurality of objects of a similar type, in particular silicon wafers, on a polishing installation |
| 10/10/2002 | US20020144985 Method of manufacturing a polishing pad using a beam |
| 10/10/2002 | US20020144780 Apparatus and method for reducing removal forces for CMP pads |
| 10/10/2002 | US20020144710 Method for cleaning semiconductor wafer after chemical mechanical polishing on copper wiring |
| 10/10/2002 | US20020144372 Polishing pad and system |
| 10/10/2002 | US20020144371 Polishing pad and system |
| 10/10/2002 | DE10132504C1 Method for simultaneously polishing both sides of semiconductor wafer mounted on cogwheel between central cogwheel and annulus uses upper and lower polishing wheel |
| 10/09/2002 | EP1247616A1 Method and arrangement for conditioning a polishing pad surface |
| 10/09/2002 | EP1246879A1 A ta barrier slurry containing an organic additive |
| 10/09/2002 | CN1373499A Device and method of chip using chemicomechanical polishing finishing for joining |
| 10/09/2002 | CN1373025A Ground matter retaining component and making method thereof |
| 10/08/2002 | US6462409 Semiconductor wafer polishing apparatus |
| 10/08/2002 | US6462402 Microelectronic substrate comprised of etch stop layer, stiffening layer, and endpointing layer |
| 10/08/2002 | US6462305 Method of manufacturing a polishing pad using a beam |
| 10/08/2002 | US6461965 Method for effecting a finishing operation on a semiconductor workpiece |
| 10/08/2002 | US6461964 Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies |
| 10/08/2002 | US6461230 Chemical-mechanical polishing method |
| 10/08/2002 | US6461226 Wafer is polished against an outer portion of a polishing pad; next, the wafer is polished against an inner portion of the polishing pad. the inner portion of the polishing pad has a second hardness that is less than the first hardness. |
| 10/08/2002 | US6461224 Off-diameter method for preparing semiconductor wafers |
| 10/08/2002 | US6461222 Planarizing and polishing apparatus and planarizing and polishing method |
| 10/03/2002 | WO2002077705A1 Methods and apparatus for polishing and planarization |
| 10/03/2002 | WO2002077327A2 Mask plate design |
| 10/03/2002 | WO2002076674A2 Rigid polishing pad conditioner for chemical mechanical polishing tool |
| 10/03/2002 | WO2002060643A3 Spherical drive assembly for chemical mechanical planarization |
| 10/03/2002 | WO2001004226A3 Cmp composition containing silane modified abrasive particles |
| 10/03/2002 | WO2000026609A3 Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing |
| 10/03/2002 | US20020142711 Chemical mechanical polishing apparatus |
| 10/03/2002 | US20020142710 Adjustable force applying air platen and spindle system, and methods for using the same |
| 10/03/2002 | US20020142706 Method and configuration for conditioning a polishing pad surface |
| 10/03/2002 | US20020142704 Linear chemical mechanical polishing apparatus equipped with programmable pneumatic support platen and method of using |
| 10/03/2002 | US20020142703 Polishing apparatus |
| 10/03/2002 | US20020142600 Abrasive composition for the integrated circuits electronics industry |
| 10/03/2002 | US20020139682 Applying a reverse bias that will cause removal of, or reduction in the size of, conductive particles on the work-piece-surface-influencing device; brushes rotating in a different direction during electrodeposition; wafers/circuits |
| 10/03/2002 | US20020139055 Polishing composition and polishing method employing it |
| 10/02/2002 | EP1244907A1 In-situ metalization monitoring using eddy current measurements and optical measurements |
| 10/02/2002 | CN1091673C Polishing device having pad which has grooves and holes |
| 10/01/2002 | US6459945 System and method for facilitating determining suitable material layer thickness in a semiconductor device fabrication process |
| 10/01/2002 | US6458704 Light sensitive chemical-mechanical polishing method |
| 10/01/2002 | US6458688 Semiconductor wafer with improved flatness, and process for producing the semiconductor wafer |
| 10/01/2002 | US6458291 Light sensitive chemical-mechanical polishing aggregate |
| 10/01/2002 | US6458289 CMP slurry for polishing semiconductor wafers and related methods |
| 10/01/2002 | US6458023 Multi characterized chemical mechanical polishing pad and method for fabricating the same |
| 10/01/2002 | US6458020 Slurry recirculation in chemical mechanical polishing |
| 10/01/2002 | US6458017 Planarizing method |
| 10/01/2002 | US6458016 Polishing fluid, polishing method, semiconductor device and semiconductor device fabrication method |
| 10/01/2002 | US6458015 Chemical-mechanical planarization machine and method for uniformly planarizing semiconductor wafers |
| 10/01/2002 | US6458014 Polishing body, polishing apparatus, polishing apparatus adjustment method, polished film thickness or polishing endpoint measurement method, and semiconductor device manufacturing method |
| 10/01/2002 | US6458013 Method of chemical mechanical polishing |
| 10/01/2002 | US6458012 Polishing apparatus |
| 09/26/2002 | WO2002075804A2 Planarization of substrates using electrochemical mechanical polishing |
| 09/26/2002 | WO2002075792A2 Method of sealing wafer backside for full-face electronchemical plating |
| 09/26/2002 | WO2002074491A1 In situ detection of a thin metal-interface using optical interference during a cmp process |
| 09/26/2002 | WO2002074490A1 Fixed abrasive article for use in modifying a semiconductor wafer |
| 09/26/2002 | WO2002002273A3 Carrier head with reduced moment wear ring |
| 09/26/2002 | US20020137450 Polishing pad having a grooved pattern for use in chemical mechanical polishing apparatus |
| 09/26/2002 | US20020137448 Apparatus and method for chemical mechanical polishing of substrates |
| 09/26/2002 | US20020137440 Polishing apparatus |
| 09/26/2002 | US20020137438 Method and apparatus for planarizing a microelectronic substrate with a tilted planarizing surface |
| 09/26/2002 | US20020137437 Method and apparatus for planarizing a microelectronic substrate with a tilted planarizing surface |
| 09/26/2002 | US20020137436 System and method for controlled polishing and planarization of semiconductor wafers |
| 09/26/2002 | US20020137435 Ventilated platen/polishing pad assembly for chemical mechanical polishing and method of using |
| 09/26/2002 | US20020137434 Method and apparatus for measuring properties of a polishing pad |
| 09/26/2002 | US20020137431 Methods and apparatus for polishing and planarization |
| 09/26/2002 | US20020137313 Method for producing semiconductor wafer and semiconductor wafer |
| 09/26/2002 | US20020136565 Photoreceptor regenerating apparatus and image forming apparatus using regenerated photoreceptor and method of regenerating photoreceptor |
| 09/25/2002 | EP1243973A1 Photoreceptor regenerating apparatus and image forming apparatus using regenerated photoreceptor and method of regenerating photoreceptor |
| 09/25/2002 | EP1243633A1 Cerium based abrasive material and method for producing cerium based abrasive material |
| 09/25/2002 | EP1242557A1 Method of polishing or planarizing a substrate |
| 09/24/2002 | US6454821 Polishing composition and method |
| 09/24/2002 | US6454820 Comprising silica particles, water, and an iron and/or aluminum salt of a polyaminocarboxylic acid such as edta for improving surface smoothness of substrates such as magnetic disk substrates |
| 09/24/2002 | US6454644 Polisher and method for manufacturing same and polishing tool |
| 09/24/2002 | US6454641 Hydrostatic fluid bearing support with adjustable inlet heights |
| 09/24/2002 | US6454637 Edge instability suppressing device and system |
| 09/24/2002 | US6454635 Method and apparatus for a wafer carrier having an insert |
| 09/24/2002 | US6454634 Polishing pads for chemical mechanical planarization |
| 09/24/2002 | US6454633 Polishing pads of flocked hollow fibers and methods relating thereto |
| 09/24/2002 | US6454630 Rotatable platen having a transparent window for a chemical mechanical polishing apparatus and method of making the same |
| 09/24/2002 | US6454517 Wafer carrier device |
| 09/24/2002 | US6454514 Microelectronic workpiece support and apparatus using the support |
| 09/19/2002 | WO2002073681A1 Method and composition for polishing by cmp |
| 09/19/2002 | WO2002072726A1 Cerium based abrasive material and abrasive material slurry, and method for producing cerium based abrasive material |
| 09/19/2002 | WO2002072311A2 Method for thinning and polishing the die of integrated circuits |
| 09/19/2002 | WO2002061008A3 Alkali metal-containing polishing system and method |
| 09/19/2002 | WO2002053273A3 Process and apparatus for blending and distributing a slurry solution |