B24B 37 - Lapping machines or devices; Accessories

Patents for B24B 37 - Lapping machines or devices; Accessories (20,836)
10/2002
10/31/2002	WO2002085570A2 Conductive polishing article for electrochemical mechanical polishing
10/31/2002	WO2002057382A3 A cmp polishing pad including a solid catalyst
10/31/2002	WO2002043129A3 Method for determinating an endpoint during cmp of a semiconductor wafer
10/31/2002	WO2002018099A3 Slurry for use with fixed-abrasive polishing pads in polishing semiconductor device conductive structures that include copper and tungsten and polishing methods
10/31/2002	US20020160702 Abrasive machine
10/31/2002	US20020160698 Electro-chemical machining apparatus
10/31/2002	US20020160697 Workpiece holder for polishing, polishing apparatus and polishing method
10/31/2002	US20020160696 Method and apparatus for polishing workpiece
10/31/2002	US20020160693 Wafer polishing method and wafer polishing device
10/31/2002	US20020160692 Method for planarizing organosilicate layers
10/31/2002	US20020160691 Planarization apparatus and method
10/31/2002	US20020160689 Method of polishing disks
10/31/2002	US20020160685 Glass powders, methods for producing glass powders and devices fabricated from same
10/31/2002	US20020160608 Copper-based metal polishing composition, method for manufacturing a semiconductor device, polishing composition, aluminum-based metal polishing composition, and tungsten-based metal polishing composition
10/31/2002	US20020160150 Polished-piece holder and manufacturing method thereof
10/31/2002	US20020159626 Detection of an end point of polishing a substrate
10/30/2002	EP1252974A2 Abrasive plate holder
10/30/2002	EP1252973A1 Polishing pad for a semiconductor wafer which has light transmitting properties
10/30/2002	EP1252651A2 Chemical-mechanical polishing method
10/30/2002	EP1252629A2 Reduced voltage input/reduced voltage output repeaters for high resistance or high capacitance signal lines and methods therefor
10/30/2002	EP1252628A2 Full swing voltage input/full swing voltage output bi-directional repeaters for high resistance or high capacitance bi-directional signal lines and methods therefor
10/30/2002	EP1252248A1 Polishing compositions for noble metals
10/30/2002	EP1252247A1 Polishing compositions for semiconductor substrates
10/30/2002	EP1251998A1 Endpoint monitoring with polishing rate change
10/30/2002	EP1131186B1 Lapping and polishing device
10/30/2002	CN1377395A CMP products
10/30/2002	CN1376950A Photosensitive object regenerative method and device, photosensitive object, image forming device
10/29/2002	WO2001021547A1 A12O3/SiC NANOCOMPOSITE ABRASIVE GRAINS, METHOD FOR PRODUCING THEM AND THEIR USE
10/29/2002	US6472325 Method and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies
10/29/2002	US6471884 Abrading with persulfate and/or peroxide oxidizing agents, an amino acid abrasive and water providing high removal rate while minimizing surface defects
10/29/2002	US6471735 Slurry of abrasive particles, suspension medium, peroxygen compound, etching agent and an alkyl ammonium hydroxide; increased silicon oxide to silicon nitride polish rate selectivity
10/29/2002	US6471571 Substrate supporting carrier pad
10/29/2002	US6471566 Sacrificial retaining ring CMP system and methods for implementing the same
10/29/2002	CA2407736A1 A12o3/sic nanocomposite abrasive grains, method for producing them and their use
10/24/2002	WO2002083804A1 Polishing composition having a surfactant
10/24/2002	WO2002083757A1 Polyurethane composition and polishing pad
10/24/2002	US20020155801 Polishing pads and methods relating thereto
10/24/2002	US20020155797 Retaining ring of a wafer carrier
10/24/2002	US20020155795 Optical endpoint detection for buff module on CMP tool
10/24/2002	US20020155794 Recession control via thermal expansion coefficient differences in recording heads during lapping
10/24/2002	US20020155793 Silicon wafer polishing holder and method of use thereof
10/24/2002	US20020155791 Polishing holder for silicon wafers and method of use thereof
10/24/2002	US20020155789 Learning method and apparatus for predictive determination of endpoint during chemical mechanical planarization using sparse sampling
10/24/2002	US20020155788 Method and apparatus for using optical reflection data to obtain a continuous predictive signal during cmp
10/24/2002	US20020155720 Fluid flow variations; rotation; calibration
10/24/2002	US20020155718 Silicon wafer polisher
10/24/2002	US20020155707 Overcoating substrate with frozen and liquid mixture; polishing, cleaning
10/24/2002	US20020155650 Reducing defects by polishing with aqueous solvents
10/24/2002	US20020153794 Motor
10/24/2002	US20020153347 Pressure suppression device for chemical mechanical polishing machine and method thereof
10/24/2002	US20020153256 Method and apparatus for depositing and controlling the texture of a thin film
10/23/2002	EP1250390A1 Composition and method for planarizing surfaces
10/23/2002	EP1250215A1 System and method for controlled polishing and planarization of semiconductor wafers
10/23/2002	EP0723653B1 Polishing device with specimen-holder
10/23/2002	CN2517541Y Optical fiber grinder
10/22/2002	US6468913 Ready-to-use stable chemical-mechanical polishing slurries
10/22/2002	US6468912 Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies
10/22/2002	US6468911 Method of chemical/mechanical polishing of the surface of semiconductor device
10/22/2002	US6468139 Polishing apparatus and method with a refreshing polishing belt and loadable housing
10/22/2002	US6468137 Method for polishing a memory or rigid disk with an oxidized halide-containing polishing system
10/22/2002	US6468136 Employing a retaining ring having a mechanical hardness greater than about 85 durometer and a relatively soft polishing pad.
10/22/2002	US6468135 Method and apparatus for multiphase chemical mechanical polishing
10/22/2002	US6468134 Method and apparatus for slurry distribution
10/22/2002	US6468131 Method to mathematically characterize a multizone carrier
10/17/2002	WO2002081584A1 Polishing composition having organic polymer particles
10/17/2002	WO2002081149A1 Polishing pad and system
10/17/2002	WO2001056744A9 Endpoint monitoring with polishing rate change
10/17/2002	US20020151264 Conditioning tool
10/17/2002	US20020151259 Polishing apparatus
10/17/2002	US20020151257 Carrier head for holding a wafer and allowing processing on a front face thereof to occur
10/17/2002	US20020151256 Apparatus for edge polishing uniformity control
10/17/2002	US20020151255 Chemical mechanical polishing method and apparatus for removing material from a surface of a workpiece that includes low-k material
10/17/2002	US20020151254 Apparatus and methods for aligning a surface of an active retainer ring with a wafer surface for chemical mechanical polishing
10/17/2002	US20020151253 Polishing pad and method of use thereof
10/17/2002	US20020151252 Polishing composition and polishing method employing it
10/17/2002	US20020151251 Method of chemical mechanical polishing with controllable pressure and loading area
10/17/2002	US20020151127 Optically-based method and apparatus for detecting and characterizing surface pits in a metal film during chemical mechanical polish
10/17/2002	US20020148997 Slurry for CMP and CMP method
10/17/2002	DE10214522A1 Poliervorrichtung Polishing apparatus
10/17/2002	DE10160174A1 Chemical/mechanical polishing slurry, used in producing shallow trench insulation in silicon wafer with oxide and nitride coatings, comprises abrasive particles in aqueous solution containing two different passivating agents
10/17/2002	DE10117612A1 Verfahren zum gleichzeitigen Polieren mehrerer gleichartiger Objekte, insbesondere Silizium-Wafer, auf einer Polieranlage Method for simultaneous polishing of several similar objects, in particular silicon wafer on a polishing system
10/17/2002	DE10115801A1 Platform for chemical-mechanical wafer polishing has device with diamond particles in contact with pad to maintain surface roughness, device for cleaning particle residues from pad
10/16/2002	EP1089851B1 Wafer edge polishing method and apparatus
10/16/2002	EP1001864B1 A carrier head with local pressure control for a chemical mechanical polishing apparatus
10/16/2002	CN2516311Y Electric valve lapping machine
10/16/2002	CN1092544C Apparatus for dispensing slurry
10/15/2002	US6465357 Fabricating structures using chemo-mechanical polishing and chemically-selective endpoint detection
10/15/2002	US6464855 Method and apparatus for electrochemical planarization of a workpiece
10/15/2002	US6464824 Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies
10/15/2002	US6464741 CMP polishing slurry dewatering and reconstitution
10/15/2002	US6464576 Stacked polishing pad having sealed edge
10/15/2002	US6464574 Pad quick release device for chemical mechanical planarization
10/15/2002	US6464571 Polishing apparatus and method with belt drive system adapted to extend the lifetime of a refreshing polishing belt provided therein
10/15/2002	US6464566 Apparatus and method for linearly planarizing a surface of a semiconductor wafer
10/15/2002	US6464564 System for real-time control of semiconductor wafer polishing
10/15/2002	US6464563 Method and apparatus for detecting dishing in a polished layer
10/15/2002	US6464562 System and method for in-situ monitoring slurry flow rate during a chemical mechanical polishing process
10/15/2002	US6464561 System for real-time control of semiconductor wafer polishing
10/15/2002	US6464560 System for real-time control of semiconductor wafer polishing
10/10/2002	WO2002080639A1 Multilayer wiring board, method for producing multilayer wiring board, polisher for multilayer wiring board, and metal sheet for producing wiring board

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