B24B 37 - Lapping machines or devices; Accessories

Patents for B24B 37 - Lapping machines or devices; Accessories (20,836)
11/2002
11/28/2002	US20020177386 Chemical mechanical processing system with mobile load cup
11/28/2002	US20020177320 Method and apparatus for polishing a substrate while washing a polishing pad of the apparatus with at least one free-flowing vertical stream of liquid
11/28/2002	US20020174605 Polishing compound for sheet metal coating
11/28/2002	DE10123386A1 Test station for polishing head of chemical-mechanical polishing arrangement has indicator showing status representing reliability of polishing head
11/27/2002	EP1259661A1 Pad designs and structures for a versatile materials processing apparatus
11/27/2002	EP1112145B1 Polishing pad for a semiconductor substrate
11/26/2002	US6485358 Wafer polishing device
11/26/2002	US6485356 Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates with metal compound abrasives
11/26/2002	US6485355 Method to increase removal rate of oxide using fixed-abrasive
11/21/2002	WO2002057071A3 Catalytic reactive pad for metal cmp
11/21/2002	US20020173256 Polishing machine
11/21/2002	US20020173255 Chemical mechanical polishing retaining ring
11/21/2002	US20020173254 Chemical Mechanical polishing apparatus
11/21/2002	US20020173253 Wafer carrier structure for chemical-mechanical polisher
11/21/2002	US20020173252 Chemical mechanical polishing
11/21/2002	US20020173249 Dynamic slurry distribution control for cmp
11/21/2002	US20020173248 Method and apparatus for releasably attaching a polishing pad to a chemical-mechanical planarization machine
11/21/2002	US20020173245 Method and apparatus for planarizing and cleaning microelectronic substrates
11/21/2002	US20020173243 Polishing composition having organic polymer particles
11/21/2002	US20020173242 Chemical mechanical polishing head assembly having floating wafer carrier and retaining ring
11/21/2002	US20020173240 Chemical mechanical polishing apparatus having edge, center and annular zone control of material removal
11/21/2002	US20020173238 Jet-induced finishing of a substrate surface
11/21/2002	US20020173237 Apparatus and method for planarizing a workpiece and a workpiece handling wand for use in the method
11/21/2002	US20020173235 Methods for break-in and conditioning a fixed abrasive polishing pad
11/21/2002	US20020173234 Diamond grid CMP pad dresser
11/21/2002	US20020173233 Modular controlled platen preparation system and method
11/21/2002	US20020173232 Multizone slurry delivery for chemical mechanical polishing tool
11/21/2002	US20020173231 Polishing pad for semiconductor wafer and laminated body for polishing of semiconductor wafer equipped with the same as well as method for polishing of semiconductor wafer
11/21/2002	US20020173229 Wafer planarization apparatus
11/21/2002	US20020173227 Embedded lapping guide
11/21/2002	US20020173225 Chemical mechanical polishing endpoint detection
11/21/2002	US20020173223 Method and apparatus for polishing control with signal peak analysis
11/21/2002	US20020173222 Polishing process for glass or ceramic disks used in disk drive data storage devices
11/21/2002	US20020173221 Method and apparatus for two-step polishing
11/21/2002	US20020173171 Pattern over impervious film; confining fluid flow; pattern reproduction
11/21/2002	US20020173121 Process for the production of electric parts
11/21/2002	US20020173115 Wet etching; cleaning, planarizing wafer
11/21/2002	US20020170237 Polishing slurry for the chemical-mechanical polishing of silica films
11/20/2002	EP1258317A1 A carrier head with flexible membrane for a chemical mechanical polishing system
11/20/2002	EP1257386A1 Polishing pad with a transparent portion
11/20/2002	EP1126950B1 Apparatuses and methods for polishing semiconductor wafers
11/20/2002	EP1035945A4 Manufacturing a memory disk or semiconductor device using an abrasive polishing system, and polishing pad
11/19/2002	US6482743 Method of forming a semiconductor device using CMP to polish a metal film
11/19/2002	US6482325 Apparatus and process for separation and recovery of liquid and slurry abrasives used for polishing
11/19/2002	US6482290 Sweeping slurry dispenser for chemical mechanical polishing
11/19/2002	US6482077 Method and apparatus for releasably attaching a polishing pad to a chemical-mechanical planarization machine
11/19/2002	US6482074 Apparatus and method for transferring a torque from a rotating hub frame to a hub shaft
11/19/2002	US6482073 Translation mechanism for a chemical mechanical planarization system and method therefor
11/19/2002	US6482072 Method and apparatus for providing and controlling delivery of a web of polishing material
11/14/2002	WO2002090050A1 Wafer polishing method and wafer polishing device
11/14/2002	WO2002090049A1 Abrasive foam sheet and production method thereof
11/14/2002	WO2002089951A1 Process for regenerating a filtration cartridge for filtering a slurry
11/14/2002	WO2001023141A9 Polishing pad
11/13/2002	EP1005626B1 Method and apparatus for detecting the endpoint in chemical-mechanical polishing of semiconductor wafers
11/13/2002	CN1379803A Improved CMP products
11/13/2002	CN1379446A Chemicomechanical grinding method combined with rotary coating
11/13/2002	CN1379074A Composition for grinding and manufacturing method of storage hard disk using said composition
11/12/2002	US6480017 Evaluating pattern for measuring an erosion of a semiconductor wafer polished by a chemical mechanical polishing
11/12/2002	US6479386 Process for reducing surface variations for polished wafer
11/12/2002	US6478977 Polishing method and apparatus
11/12/2002	US6478914 Method for attaching web-based polishing materials together on a polishing tool
11/12/2002	US6478836 Cerium oxide slurry for polishing, process for preparing the slurry, and process for polishing with the slurry
11/12/2002	US6478834 Slurry for chemical mechanical polishing
11/12/2002	US6478659 Chemical mechanical polishing method for slurry free fixed abrasive pads
11/12/2002	US6477926 Polishing pad
11/12/2002	US6477825 Flattening and machining method and apparatus
11/07/2002	WO2002087826A1 Method for controlling a process in a multi-zonal apparatus
11/07/2002	WO2002087825A1 Integrated endpoint detection system with optical and eddy current monitoring
11/07/2002	WO2002072311A3 Method for thinning and polishing the die of integrated circuits
11/07/2002	WO2002017381A3 Method for preventing damage to wafers in a sequential multiple steps polishing process
11/07/2002	US20020164939 Quick coupler for mounting a rotational disk
11/07/2002	US20020164938 Carrier head with a compressible film
11/07/2002	US20020164936 Chemical mechanical polisher with grooved belt
11/07/2002	US20020164928 Method and apparatus for conditioning a polishing pad
11/07/2002	US20020164927 Chemical-mechanical polishing methods
11/07/2002	US20020164926 Retainer ring and method for polishing a workpiece
11/07/2002	US20020164925 Integrated endpoint detection system with optical and eddy current monitoring
11/07/2002	US20020164924 Method for controlling a process in a multi-zonal apparatus
11/07/2002	US20020164876 Method for finishing polysilicon or amorphous substrate structures
11/07/2002	US20020164875 Concurrent heating, pressurization
11/07/2002	US20020162996 Chemical mechanical polishing system and method for planarizing substrates in fabricating semiconductor devices
11/06/2002	EP1255286A1 Monitor, method of monitoring, polishing device, and method of manufacturing semiconductor wafer
11/06/2002	EP1254743A2 Polishing machine
11/06/2002	EP1254742A2 Thermal mechanical planarization in intergrated circuits
11/06/2002	EP1253993A1 Interface assembly for lapping control feedback
11/06/2002	EP1097026B1 Polishing pads for a semiconductor substrate
11/06/2002	EP1011922B1 Polishing pad for a semiconductor substrate
11/06/2002	CN1093790C Polishing method of substrate and polishing device therefor
11/05/2002	US6477447 Methods to generate numerical pressure distribution data for developing pressure related components
11/05/2002	US6476921 In-situ method and apparatus for end point detection in chemical mechanical polishing
11/05/2002	US6475914 Method of manufacturing semiconductor device for protecting Cu layer from post chemical mechanical polishing-corrosion
11/05/2002	US6475638 Electrodeposited copper foil with its surface prepared, process for producing the same and use thereof
11/05/2002	US6475332 Interlocking chemical mechanical polishing system
11/05/2002	US6475293 Rotating belt wafer edge cleaning apparatus
11/05/2002	US6475072 Method of wafer smoothing for bonding using chemo-mechanical polishing (CMP)
11/05/2002	US6475070 Chemical mechanical polishing with a moving polishing sheet
11/05/2002	US6475069 Control of removal rates in CMP
11/05/2002	US6475068 Wafer holding plate for wafer grinding apparatus and method for manufacturing the same
11/05/2002	US6475064 Multipoint bending apparatus for lapping heads of a data storage device
11/05/2002	US6475062 Film thickness measuring method, polishing method, fabrication method of thin film magnetic head and substrate for forming the thin film magnetic head

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