B24B 37 - Lapping machines or devices; Accessories

Patents for B24B 37 - Lapping machines or devices; Accessories (20,836)
12/2002
12/26/2002	US20020194790 Method for fabricating diamond conditioning disc and disc fabricated
12/26/2002	US20020194789 Polishing composition
12/25/2002	CN1387556A Use of CsOH in dielectric CMP slurry
12/24/2002	US6498101 Planarizing pads, planarizing machines and methods for making and using planarizing pads in mechanical and chemical-mechanical planarization of microelectronic device substrate assemblies
12/24/2002	US6497613 Methods and apparatus for chemical mechanical planarization using a microreplicated surface
12/24/2002	US6497612 System and method for reducing surface defects in integrated circuits
12/24/2002	US6497611 Method of polishing a magnetic head slider
12/19/2002	WO2002100963A1 Use of a gettering agent in a chemical mechanical polishing and rinsing operation and apparatus therefor
12/19/2002	WO2002100595A1 Polishing sheet and method of manufacturing the sheet
12/19/2002	WO2002100594A1 Improved method and apparatus for bi-directionally polishing a workpiece
12/19/2002	WO2002100593A2 Polishing pads with polymer filled fibrous web, and methods for fabricating and using same
12/19/2002	WO2002100592A1 Apparatus and method for measuring tool degradation
12/19/2002	WO2001068322A9 Window portion with an adjusted rate of wear
12/19/2002	US20020193902 Integrating tool, module, and fab level control
12/19/2002	US20020193899 Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing
12/19/2002	US20020193059 Stacked polishing pad having sealed edge
12/19/2002	US20020193058 Polishing apparatus that provides a window
12/19/2002	US20020193054 Apparatus and methods for multi-step chemical mechanical polishing
12/19/2002	US20020193051 Apparatus and method for producing substrate with electrical wire thereon
12/19/2002	US20020193050 Apparatus for enhanced rate chemcial mechanical polishing with adjustable selectivity
12/19/2002	US20020192966 In situ sensor based control of semiconductor processing procedure
12/19/2002	US20020192965 Apparatus and methods with resolution enhancement feature for improving accuracy of conversion of required chemical mechanical polishing pressure to force to be applied by polishing head to wafer
12/19/2002	US20020192962 Method of chemical/mechanical polishing of the surface of semiconductor device
12/19/2002	US20020189813 Flow completion system
12/19/2002	US20020189169 Poly(meth)acrylic acid with average molecular weight of 20000-1500000, 1-15% of an oxidizer, 50-5000 ppm of a corrosion inhibitor, </=3% of a complexing agent, .1-5% of a surfactant; chemical mechanical polishing of a semiconductor
12/19/2002	CA2441419A1 Polishing pads with polymer filled fibrous web, and methods for fabricating and using same
12/18/2002	EP1137514B1 Modular machine for polishing and planing substrates
12/18/2002	EP0998536B1 Polishing agent for semiconductor substrates
12/17/2002	US6495465 Method for appraising the condition of a semiconductor polishing cloth
12/17/2002	US6495463 Method for chemical mechanical polishing
12/17/2002	US6494985 Method and apparatus for polishing a substrate
12/17/2002	US6494928 Surfactant and ceramics powder; shortening a stain removing process of a coated surface in reparative sheet metal coating work of cars
12/17/2002	US6494774 Carrier head with pressure transfer mechanism
12/17/2002	US6494768 Wafer polishing apparatus
12/17/2002	US6494766 Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing
12/17/2002	US6494765 Method and apparatus for controlled polishing
12/17/2002	US6494257 Flow completion system
12/12/2002	WO2002098676A1 Polishing device
12/12/2002	WO2002098609A1 Pad conditioner
12/12/2002	WO2002098608A1 Chemical mechanical polishing apparatus and method having a retaining ring with a contoured surface
12/12/2002	US20020187735 Polishing apparatus
12/12/2002	US20020187732 Method and apparatus for planarizing a microelectronic substrate with a tilted planarizing surface
12/12/2002	US20020187731 In-situ pad and wafer cleaning during chemical mechanical polishing
12/12/2002	US20020187728 Polishing device and method
12/12/2002	US20020187637 Polishing method using ceria slurry, and method of manufacturing semiconductor device
12/12/2002	US20020186370 Apparatus and method for measuring the degradation of a tool
12/12/2002	US20020185628 Composition and method of formation and use therefor in chemical-mechanical polishing
12/12/2002	US20020185467 Interlocking chemical mechanical polishing system
12/12/2002	US20020185224 Chemical mechanical polishing system and method for planarizing substrates in fabricating semiconductor devices
12/12/2002	US20020185223 Apparatus and method for conditioning polishing pad in a chemical mechanical planarization process
12/12/2002	DE10224559A1 Polierverfahren zur Entfernung von Eckmaterial von einem Halbleiterwafer A polishing method for removing corner material from a semiconductor wafer
12/12/2002	DE10202701A1 Semiconductor wafer polishing device, has chemical/mechanical polishing device with polishing head
12/11/2002	EP1263906A1 Polishing composition
12/11/2002	EP1263548A1 Window portion with an adjusted rate of wear
12/11/2002	EP0999918B1 Polishing semiconductor wafers
12/11/2002	CN1384860A Ta barrier slurry containing organic additive
12/11/2002	CN1384170A Grinding fluid composition
12/10/2002	US6492311 Ethyenediaminetetraacetic acid or its ammonium salt semiconductor process residue removal composition and process
12/10/2002	US6492274 Slurries of abrasive inorganic oxide particles and method for adjusting the abrasiveness of the particles
12/10/2002	US6492273 Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies
12/10/2002	US6491843 Amino acid or carboxylic acid with halide functional group
12/10/2002	US6491837 Mixture of particles; nitric acid or aluminum-, nickel-, magnesium-, zinc-, or ammonium nitrate oxidizer; co-oxidizer; and water; nickel-plated hard disk drives
12/10/2002	US6491570 Polishing media stabilizer
12/10/2002	US6491569 Method and apparatus for using optical reflection data to obtain a continuous predictive signal during CMP
12/05/2002	WO2002096999A1 Cerium oxide slurry, and method of manufacturing substrate
12/05/2002	WO2002096601A1 Polishing apparatus and polishing method
12/05/2002	WO2002096600A1 A cmp polisher substrate removal control mechanism and method
12/05/2002	US20020183963 Method of characterizing a semiconductor surface
12/05/2002	US20020183219 Used for removing photoresist or other residue from a substrate, such as an integrated circuit
12/05/2002	US20020182996 Methods for carrier head with multi-part flexible membrane
12/05/2002	US20020182995 Chemical mechanical polishing carrier head
12/05/2002	US20020182994 Retaining ring with wear pad for use in chemical mechanical planarization
12/05/2002	US20020182986 Polishing pad with wear indicator for profile monitoring and controlling and method and apparatus for polishing using said pad
12/05/2002	US20020182985 Polishing method for removing corner material from a semi-conductor wafer
12/05/2002	US20020182982 Additives for pressure sensitive polishing compositions
12/05/2002	US20020182978 Method of and apparatus for chemical-mechanical polishing
12/05/2002	US20020182868 Reduction of surface roughness during chemical mechanical planarization (CMP)
12/05/2002	US20020182867 Chemical mechanical polishing apparatus and method having a retaining ring with a contoured surface
12/05/2002	US20020182866 Off-concentric polishing system design
12/05/2002	US20020182401 Pad conditioner with uniform particle height
12/05/2002	US20020179251 Substrate retainer
12/05/2002	DE10218483A1 Device for processing a workpiece on both sides simultaneously and for removing material from it polishes items by rotating them and applying polishing substances.
12/04/2002	EP1263026A2 Wafer planarization apparatus
12/04/2002	EP1261530A1 Package with multiple chambers and valves
12/04/2002	EP1073542B1 Chemical mechanical polishing with multiple polishing pads
12/04/2002	CN2523557Y Apparatus for repairing anvil wheels
12/03/2002	US6489243 Method for polishing semiconductor device
12/03/2002	US6488575 Polishing pads and planarizing machines for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies, and methods for making and using such pads and machines
12/03/2002	US6488571 Apparatus for enhanced rate chemical mechanical polishing with adjustable selectivity
12/03/2002	US6488570 Method relating to a polishing system having a multi-phase polishing layer
12/03/2002	US6488569 Method and apparatus for detecting micro-scratches in semiconductor wafers during polishing process
12/03/2002	US6488568 Optical view port for chemical mechanical planarization endpoint detection
12/03/2002	US6488566 System for real-time control of semiconductor wafer polishing
12/03/2002	US6488565 Apparatus for chemical mechanical planarization having nested load cups
11/2002
11/28/2002	WO2002094957A2 Chemical mechanical polishing compositions and methods relating thereto
11/28/2002	WO2002094503A1 Delivery system for magnetorheological fluid
11/28/2002	WO2002056351A3 Polishing of semiconductor substrates
11/28/2002	US20020177395 Polishing head of a chemical and mechanical polishing apparatus for polishing a wafer
11/28/2002	US20020177392 Delivery system for magnetorheological fluid
11/28/2002	US20020177390 Methods and apparatuses for planarizing microelectronic substrate assemblies

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