| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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| 01/15/2003 | CN1098746C Chemical mechanical polishing apparatus and method of chemical mechanical polishing |
| 01/14/2003 | US6506682 Non-selective slurries for chemical mechanical polishing of metal layers and method for manufacturing thereof |
| 01/14/2003 | US6506679 Deadhesion method and mechanism for wafer processing |
| 01/14/2003 | US6506341 Chemiluminescence detection apparatus |
| 01/14/2003 | US6506105 System and method for pneumatic diaphragm CMP head having separate retaining ring and multi-region wafer pressure control |
| 01/14/2003 | US6506104 Carrier head with a flexible membrane |
| 01/14/2003 | US6506102 System for magnetorheological finishing of substrates |
| 01/14/2003 | US6506101 Method and apparatus for releasably attaching a polishing pad to a chemical-mechanical planarization machine |
| 01/14/2003 | US6506099 Driving a carrier head in a wafer polishing system |
| 01/14/2003 | US6506098 Self-cleaning slurry arm on a CMP tool |
| 01/14/2003 | US6506097 Reflectance traces indicate that oxide layer has been completely exposed; |
| 01/14/2003 | US6505636 Apparatus for wafer carrier in-process clean and rinse |
| 01/14/2003 | US6505635 Lifting and rinsing a wafer |
| 01/09/2003 | WO2003003422A2 In-situ end point detection for semiconductor wafer polishing |
| 01/09/2003 | WO2003002302A1 Method and apparatus for distributing fluid to a polishing surface during chemical mechanical polishing |
| 01/09/2003 | WO2003002301A1 End point detection system for chemical mechanical polishing applications |
| 01/09/2003 | WO2003002300A1 Apparatus and method for polishing multiple semiconductor wafers in parallel |
| 01/09/2003 | WO2003002299A2 Carrier head with porose retainer ring |
| 01/09/2003 | US20030008602 Method and apparatus of sealing wafer backside for full-face electrochemical plating |
| 01/09/2003 | US20030008600 Method and apparatus for chemical-mechanical polishing |
| 01/09/2003 | US20030008599 Method for chemical mechanical polishing (CMP) with altering the concentration of oxidizing agent in slurry |
| 01/09/2003 | US20030008598 Wafer holding plate for wafer grinding apparatus and method for manufacturing the same |
| 01/09/2003 | US20030008597 Dual detection method for end point in chemical mechanical polishing |
| 01/09/2003 | US20030008508 Deadhesion method and mechanism for wafer processing |
| 01/09/2003 | US20030006147 Method and apparatus for electro-chemical mechanical deposition |
| 01/08/2003 | EP1274122A1 Chemical-mechanical polishing device, damascene wiring forming device, and damascene wiring forming method |
| 01/08/2003 | EP1272580A2 System for the preferential removal of silicon oxide |
| 01/08/2003 | EP1272579A2 Method for polishing a memory or rigid disk with an amino acid-containing composition |
| 01/08/2003 | EP1272311A1 Integrated chemical-mechanical polishing |
| 01/08/2003 | CN1390248A Composition and method for planarizing surfaces |
| 01/08/2003 | CN1098142C Carrier head for polishing tool, polishing tool and method for polishing body |
| 01/07/2003 | US6503839 Endpoint stabilization for polishing process |
| 01/07/2003 | US6503767 Process for monitoring a process, planarizing a surface, and for quantifying the results of a planarization process |
| 01/07/2003 | US6503766 Method and system for detecting an exposure of a material on a semiconductor wafer during chemical-mechanical polishing |
| 01/07/2003 | US6503418 Ta barrier slurry containing an organic additive |
| 01/07/2003 | US6503414 Fluid comprising such as polytetrofluoroethylene protective coated carbonyl iron magnetic particles, cerium oxide abrasive particles, stabilizer and water or glycerin which may be automatically and accurately controlled |
| 01/07/2003 | US6503361 Polishing method and polishing apparatus using the same |
| 01/07/2003 | US6503134 Carrier head for a chemical mechanical polishing apparatus |
| 01/07/2003 | US6503131 Integrated platen assembly for a chemical mechanical planarization system |
| 01/07/2003 | US6503130 Adsorption means applying a vacuum to a part of a protective film adhered in an electrical circuit patterned side of a wafer, and separating the part of the protective film from the patterned side of the wafer; and peeling pressing |
| 01/07/2003 | US6503129 Activated slurry CMP system and methods for implementing the same |
| 01/07/2003 | US6503127 Apparatus and methods for substantial planarization of solder bumps |
| 01/07/2003 | US6503124 Method for endpoint detection for copper CMP |
| 01/03/2003 | WO2003001582A2 Microelectronic substrate having conductive material with blunt cornered apertures, and associated methods for removing conductive material |
| 01/03/2003 | WO2003001581A2 Methods and apparatus for electrical, mechanical and/or chemical removal of conductive material from a microelectronic substrate |
| 01/03/2003 | WO2003000462A1 Arrangement and method for conditioning a polishing pad |
| 01/03/2003 | WO2003000460A1 Method of making light transmitting optical fluoride crystals |
| 01/02/2003 | US20030003857 Polishing pad, and method and apparatus for polishing |
| 01/02/2003 | US20030003852 Apparatus and method for polishing multiple semiconductor wafers in parallel |
| 01/02/2003 | US20030003851 Method and apparatus for recycling slurry |
| 01/02/2003 | US20030003850 Method and apparatus for distributing fluid to a polishing surface during chemical mechanical polishing |
| 01/02/2003 | US20030003848 Edge contact loadcup |
| 01/02/2003 | US20030003847 Automated polishing apparatus and method of polishing |
| 01/02/2003 | US20030003846 Material for use in carrier and polishing pads |
| 01/02/2003 | US20030003845 Optical monitoring in a two-step chemical mechanical polishing process |
| 01/02/2003 | US20030003747 Slurry of ceric ammonium nitrate ((NH4)2Ce(NO3)6) providing improved polishing speed under low pressure in one step; deposited as a barrier film for a capacitor using barium strontium titanate as a dielectric layer; semiconductors |
| 01/02/2003 | US20030003743 Method and apparatus for cleaning a web-based chemical mechanical planarization system |
| 01/02/2003 | US20030003718 Methods for fabricating a semiconductor device |
| 01/02/2003 | US20030003605 In-situ end point detection for semiconductor wafer polishing |
| 01/02/2003 | US20030000150 Cerium based abrasive material and method for producing cerium based abrasive material |
| 01/02/2003 | EP1270148A1 Arrangement and method for conditioning a polishing pad |
| 01/02/2003 | EP1268134A1 Method of manufacturing a polymer or polymer composite polishing pad |
| 01/02/2003 | EP1268133A1 Polishing head for wafer, and method for polishing |
| 01/02/2003 | EP1268132A1 Method and apparatus for fixed-abrasive substrate manufacturing and wafer polishing in a single process path |
| 01/02/2003 | EP1268131A2 Carrier head providing uniform upward and downward force on a wafer |
| 01/02/2003 | EP1268130A1 Fixed abrasive linear polishing belt and system using the same |
| 01/02/2003 | EP1268129A1 Method of polishing wafers |
| 01/01/2003 | CN1388187A Compound for metal plate coating |
| 12/31/2002 | US6500764 Method for thinning a semiconductor substrate |
| 12/31/2002 | US6500059 Apparatus and method for mounting a wafer in a polishing machine |
| 12/31/2002 | US6500056 Linear reciprocating disposable belt polishing method and apparatus |
| 12/31/2002 | US6500055 Oscillating orbital polisher and method |
| 12/31/2002 | US6500054 Chemical-mechanical polishing pad conditioner |
| 12/31/2002 | US6500053 Polishing pads and methods relating thereto |
| 12/31/2002 | US6500051 Polishing apparatus and method |
| 12/31/2002 | US6500049 Lapping oil composition for finish-grinding |
| 12/27/2002 | WO2002103779A1 In situ sensor based control of semiconductor processing procedure |
| 12/27/2002 | WO2002103778A2 Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing |
| 12/27/2002 | WO2002103777A1 Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles |
| 12/27/2002 | WO2002103776A2 Method for relating photolithography overlay target damage and chemical mechanical planarization (cmp) fault detection to cmp tool identification |
| 12/27/2002 | WO2002103771A1 Electrolytic processing device and substrate processing apparatus |
| 12/27/2002 | WO2002102920A1 A silica and a silica-based slurry |
| 12/27/2002 | WO2002102919A1 Polishing slurry for use in texturing surface of glass substrate and method |
| 12/27/2002 | WO2002102910A1 A silica-based slurry |
| 12/27/2002 | WO2002102549A1 Feedforward and feedback control for conditioning of chemical mechanical polishing pad |
| 12/27/2002 | WO2002102548A1 Control of chemical mechanical polishing pad conditioner directional velocity to improve pad life |
| 12/27/2002 | WO2002102547A1 Polishing apparatus that provides a window |
| 12/27/2002 | WO2002102546A1 Polishing apparatus and polishing pad |
| 12/27/2002 | WO2001074537A9 Method and apparatus for fixed-abrasive substrate manufacturing and wafer polishing in a single process path |
| 12/26/2002 | US20020199082 Method, system and medium for process control for the matching of tools, chambers and/or other semiconductor-related entities |
| 12/26/2002 | US20020197946 Multi-phase polishing pad |
| 12/26/2002 | US20020197937 Method to increase removal rate of oxide using fixed-abrasive |
| 12/26/2002 | US20020197935 Method of polishing a substrate |
| 12/26/2002 | US20020197934 Control of chemical mechanical polishing pad conditioner directional velocity to improve pad life |
| 12/26/2002 | US20020197872 Process and device for the abrasive machining of surfaces, in particular semiconductor wafers |
| 12/26/2002 | US20020197871 Method of polishing a film |
| 12/26/2002 | US20020197855 Chemical mechanical polishing slurry and process for ruthenium films |
| 12/26/2002 | US20020197745 Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles |
| 12/26/2002 | US20020195424 Method of and apparatus for chemical mechanical polishing, and slurry supplying device |
| 12/26/2002 | US20020195421 In preference to silicon nitride; includes abrasives and amino acids; semiconductors |