Patents for B24B 37 - Lapping machines or devices; Accessories (20,836)
02/2003
02/05/2003EP1281476A2 Method for polishing workpieces and apparatus therefor
02/05/2003EP1281199A2 Metal chemical mechanical polishing process for minimizing dishing during semiconductor wafer fabrication
02/05/2003EP1281197A1 Method of modifying the surface of a semiconductor wafer
02/05/2003CN1395295A Method for producing semiconductor device and used slurry
02/05/2003CN1394718A Method for repairing and maintaining grinding board by using double-board grinding machine
02/05/2003CN1394717A Panel grinding device for cathode-ray tube
02/04/2003US6515493 Chemical mechanical planarization
02/04/2003US6515475 Determination of track width of magnetoresistive sensors during magnetic head fabrication using magnetic fields
02/04/2003US6514864 Fabrication method for semiconductor integrated circuit device
02/04/2003US6514863 Method and apparatus for slurry distribution profile control in chemical-mechanical planarization
02/04/2003US6514862 Particles, solvent and a quaternary ammonium compound such as (2-hydroxyethyl)trimethylammonium chloride; improved removal selectivity between a layer to be polished and a silicon nitride stop layer
02/04/2003US6514861 Manufacturing a semiconductor wafer according to the process time by process tool
02/04/2003US6514858 Test structure for providing depth of polish feedback
02/04/2003US6514775 In-situ end point detection for semiconductor wafer polishing
02/04/2003US6514673 Rule to determine CMP polish time
02/04/2003US6514301 Foam semiconductor polishing belts and pads
02/04/2003US6514130 Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates
02/04/2003US6514129 Multi-action chemical mechanical planarization device and method
02/04/2003US6514127 Conditioner set for chemical-mechanical polishing station
02/04/2003US6514126 Pad conditioner coupling and end effector for a chemical mechanical planarization system and method therefor
02/04/2003US6514125 Method and apparatus for releasably attaching a polishing pad to a chemical-mechanical planarization machine
02/04/2003US6514124 Carrier head for chemical mechanical polishing a substrate
02/04/2003US6514123 Semiconductor polishing pad alignment device for a polishing apparatus and method of use
02/04/2003US6514121 Polishing chemical delivery for small head chemical mechanical planarization
01/2003
01/30/2003WO2003009362A1 Polishing element, cmp polishing device and productionj method for semiconductor device
01/30/2003WO2003008151A1 Fixed abrasive articles with wear indicators
01/30/2003US20030022611 Method for attaching web based polishing materials together on a polishing tool
01/30/2003US20030022609 Carrier head with a flexible membrane to form multiple chambers
01/30/2003US20030022607 Single drive system for a bi-directional linear chemical mechanical polishing apparatus
01/30/2003US20030022606 Ultrasonic conditioning device cleaner for chemical mechanical polishing systems
01/30/2003US20030022605 Polishing apparatus and method with belt drive system adapted to extend the lifetime of a refreshing polishing belt provided therein
01/30/2003US20030022603 Method for global die thinning and polishing of flip-chip packaged integrated circuits
01/30/2003US20030022600 Method of producing magnetic hard disk substrate with textured surface
01/30/2003US20030022599 Pad tensioning method and system in a bi-directional linear polisher
01/30/2003US20030022598 Abrasive article having a window system for polishing wafers, and methods
01/30/2003US20030022596 Method for characterizing the planarizing properties of an expendable material combination in a chemical-mechanical polishing process; simulation technique; and polishing technique
01/30/2003US20030022595 Wafer pressure regulation system for polishing machine
01/30/2003US20030022594 Polishing assistant apparatus of polishing assistant system
01/30/2003US20030022593 Semiconductor workpiece processing methods, a method of preparing semiconductor workpiece process fluid, and a method of delivering semiconductor workpiece process fluid to a semiconductor processor
01/30/2003US20030022502 Chemical mechanical polishing slurry containing abrasive particles exhibiting photocatalytic function
01/30/2003US20030022501 Method and apparatus for chemical mechanical polishing of semiconductor substrates
01/30/2003US20030022499 Chemical/mechanical polishing slurry, and chemical mechanical polishing process and shallow trench isolation process employing the same
01/30/2003US20030022498 CMP system and method for efficiently processing semiconductor wafers
01/30/2003US20030022497 Method of chemical mechanical polishing with high throughput and low dishing
01/30/2003US20030022400 Method and apparatus for measuring thickness of thin film and device manufacturing method using same
01/30/2003US20030021980 Method of altering and preserving the surface properties of a polishing pad and specific applications therefor
01/30/2003US20030020510 Evaluating pattern for measuring an erosion of a semiconductor wafer polished by a chemical mechanical polishing
01/30/2003US20030020009 Monitor, method of monitoring, polishing device, and method of manufacturing semiconductor wafer
01/30/2003US20030019577 Differential pressure application apparatus for use in polishing layers of semiconductor device structures and methods
01/30/2003US20030019570 Polishing pad for a chemical mechanical polishing process
01/29/2003EP1279713A1 Polishing compound and method for preparation thereof, and polishing method
01/29/2003EP1279708A1 Polishing composition and polishing method employing it
01/29/2003EP1278936A1 Tubing hanger with annulus bore
01/29/2003EP1278935A1 Tubing head seal assembly
01/29/2003CN1394229A Cerium based abrasive material and method for producing cerium based abrasive material
01/29/2003CN1099939C 抛光垫及抛光装置 Polishing pad and polishing equipment
01/28/2003US6511576 System for planarizing microelectronic substrates having apertures
01/28/2003US6511368 Spherical drive assembly for chemical mechanical planarization
01/28/2003US6511367 Carrier head with local pressure control for a chemical mechanical polishing apparatus
01/28/2003US6511365 Lapping machine
01/28/2003US6511363 Polishing end point detecting device for wafer polishing apparatus
01/28/2003US6511362 Polishing apparatus and polishing method
01/23/2003WO2003007360A1 Method for chemical mechanical polishing (cmp) with altering the concentration of oxidizing agent in slurry
01/23/2003WO2003006206A1 Substrate polishing machine
01/23/2003WO2003006205A2 Barrier removal at low polish pressure
01/23/2003WO2002018101A3 Chemical mechanical polishing (cmp) head, apparatus, and method and planarized semiconductor wafer produced thereby
01/23/2003US20030017787 Polishing system including a hydrostatic fluid bearing support
01/23/2003US20030017786 CMP slurry and method for manufacturing a semiconductor device
01/23/2003US20030017784 Method for improving thickness uniformity on a semiconductor wafer during chemical mechanical polishing
01/23/2003US20030017706 Method and apparatus for cleaning a web-based chemical mechanical planarization system
01/23/2003US20030017693 Method of manufacturing semiconductor device for protecting Cu layer from post chemical mechanical polishing-corrosion and chemical mechanical polishing equipment used in the same
01/23/2003US20030015289 Method and apparatus for cleaning a web-based chemical mechanical planarization system
01/23/2003US20030015215 Polishing pad conditioner and application thereof
01/22/2003EP1276826A2 Slurries of abrasive inorganic oxide particles and method for polishing copper containing surfaces
01/22/2003CN1392215A Metal grinding liquid material, metal grinding liquid, its producing method and grinding method using it
01/21/2003US6509269 Elimination of pad glazing for Al CMP
01/21/2003US6508953 Slurry for chemical-mechanical polishing copper damascene structures
01/21/2003US6508952 Chemical mechanical abrasive composition for use in semiconductor processing
01/21/2003US6508697 Polishing pad conditioning system
01/21/2003US6508696 Wafer-polishing head and polishing apparatus having the same
01/21/2003US6508694 Multi-zone pressure control carrier
01/16/2003WO2003005431A1 Chemical mechanical polishing slurry for semiconductor integrated circuit, polishing method and semiconductor integrated circuit
01/16/2003WO2003005421A2 Fabricating structures using chemo-mechanical polishing and chemically-selective endpoint detection
01/16/2003US20030013398 Reinforced polishing pad for linear chemical mechanical polishing and method for forming
01/16/2003US20030013397 Polishing pad of polymer coating
01/16/2003US20030013391 Polishing apparatus
01/16/2003US20030013389 Process for the abrasive machining of surfaces, in particular of semiconductor wafers
01/16/2003US20030013387 Barrier removal at low polish pressure
01/16/2003US20030013386 Chemical mechanical polishing compositions and methods relating thereto
01/16/2003US20030013384 Method and apparatus for chemical mechanical polishing
01/16/2003US20030013383 System and method for reducing surface defects in integrated circuits
01/16/2003US20030013382 Abrasive cloth and polishing method
01/16/2003US20030013381 Polishing pad conditioning system
01/16/2003US20030013306 Barrier to prevent copper diffusion; polishing using reducing agent
01/16/2003US20030010887 Method and apparatus for automatically loading a double-sided polishing machine with wafer crystals
01/16/2003US20030010648 Electrochemically assisted chemical polish
01/15/2003EP1274807A2 Polishing agent and method for producing planar layers
01/15/2003EP1274542A1 Process for reducing surface variations for polished wafer
01/15/2003EP1274540A1 Polishing method using a rehydrated dry particulate polishing composition
01/15/2003CN1099127C Method of modifying exposed surface of semiconductor wafer