Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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02/05/2003 | EP1281476A2 Method for polishing workpieces and apparatus therefor |
02/05/2003 | EP1281199A2 Metal chemical mechanical polishing process for minimizing dishing during semiconductor wafer fabrication |
02/05/2003 | EP1281197A1 Method of modifying the surface of a semiconductor wafer |
02/05/2003 | CN1395295A Method for producing semiconductor device and used slurry |
02/05/2003 | CN1394718A Method for repairing and maintaining grinding board by using double-board grinding machine |
02/05/2003 | CN1394717A Panel grinding device for cathode-ray tube |
02/04/2003 | US6515493 Chemical mechanical planarization |
02/04/2003 | US6515475 Determination of track width of magnetoresistive sensors during magnetic head fabrication using magnetic fields |
02/04/2003 | US6514864 Fabrication method for semiconductor integrated circuit device |
02/04/2003 | US6514863 Method and apparatus for slurry distribution profile control in chemical-mechanical planarization |
02/04/2003 | US6514862 Particles, solvent and a quaternary ammonium compound such as (2-hydroxyethyl)trimethylammonium chloride; improved removal selectivity between a layer to be polished and a silicon nitride stop layer |
02/04/2003 | US6514861 Manufacturing a semiconductor wafer according to the process time by process tool |
02/04/2003 | US6514858 Test structure for providing depth of polish feedback |
02/04/2003 | US6514775 In-situ end point detection for semiconductor wafer polishing |
02/04/2003 | US6514673 Rule to determine CMP polish time |
02/04/2003 | US6514301 Foam semiconductor polishing belts and pads |
02/04/2003 | US6514130 Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates |
02/04/2003 | US6514129 Multi-action chemical mechanical planarization device and method |
02/04/2003 | US6514127 Conditioner set for chemical-mechanical polishing station |
02/04/2003 | US6514126 Pad conditioner coupling and end effector for a chemical mechanical planarization system and method therefor |
02/04/2003 | US6514125 Method and apparatus for releasably attaching a polishing pad to a chemical-mechanical planarization machine |
02/04/2003 | US6514124 Carrier head for chemical mechanical polishing a substrate |
02/04/2003 | US6514123 Semiconductor polishing pad alignment device for a polishing apparatus and method of use |
02/04/2003 | US6514121 Polishing chemical delivery for small head chemical mechanical planarization |
01/30/2003 | WO2003009362A1 Polishing element, cmp polishing device and productionj method for semiconductor device |
01/30/2003 | WO2003008151A1 Fixed abrasive articles with wear indicators |
01/30/2003 | US20030022611 Method for attaching web based polishing materials together on a polishing tool |
01/30/2003 | US20030022609 Carrier head with a flexible membrane to form multiple chambers |
01/30/2003 | US20030022607 Single drive system for a bi-directional linear chemical mechanical polishing apparatus |
01/30/2003 | US20030022606 Ultrasonic conditioning device cleaner for chemical mechanical polishing systems |
01/30/2003 | US20030022605 Polishing apparatus and method with belt drive system adapted to extend the lifetime of a refreshing polishing belt provided therein |
01/30/2003 | US20030022603 Method for global die thinning and polishing of flip-chip packaged integrated circuits |
01/30/2003 | US20030022600 Method of producing magnetic hard disk substrate with textured surface |
01/30/2003 | US20030022599 Pad tensioning method and system in a bi-directional linear polisher |
01/30/2003 | US20030022598 Abrasive article having a window system for polishing wafers, and methods |
01/30/2003 | US20030022596 Method for characterizing the planarizing properties of an expendable material combination in a chemical-mechanical polishing process; simulation technique; and polishing technique |
01/30/2003 | US20030022595 Wafer pressure regulation system for polishing machine |
01/30/2003 | US20030022594 Polishing assistant apparatus of polishing assistant system |
01/30/2003 | US20030022593 Semiconductor workpiece processing methods, a method of preparing semiconductor workpiece process fluid, and a method of delivering semiconductor workpiece process fluid to a semiconductor processor |
01/30/2003 | US20030022502 Chemical mechanical polishing slurry containing abrasive particles exhibiting photocatalytic function |
01/30/2003 | US20030022501 Method and apparatus for chemical mechanical polishing of semiconductor substrates |
01/30/2003 | US20030022499 Chemical/mechanical polishing slurry, and chemical mechanical polishing process and shallow trench isolation process employing the same |
01/30/2003 | US20030022498 CMP system and method for efficiently processing semiconductor wafers |
01/30/2003 | US20030022497 Method of chemical mechanical polishing with high throughput and low dishing |
01/30/2003 | US20030022400 Method and apparatus for measuring thickness of thin film and device manufacturing method using same |
01/30/2003 | US20030021980 Method of altering and preserving the surface properties of a polishing pad and specific applications therefor |
01/30/2003 | US20030020510 Evaluating pattern for measuring an erosion of a semiconductor wafer polished by a chemical mechanical polishing |
01/30/2003 | US20030020009 Monitor, method of monitoring, polishing device, and method of manufacturing semiconductor wafer |
01/30/2003 | US20030019577 Differential pressure application apparatus for use in polishing layers of semiconductor device structures and methods |
01/30/2003 | US20030019570 Polishing pad for a chemical mechanical polishing process |
01/29/2003 | EP1279713A1 Polishing compound and method for preparation thereof, and polishing method |
01/29/2003 | EP1279708A1 Polishing composition and polishing method employing it |
01/29/2003 | EP1278936A1 Tubing hanger with annulus bore |
01/29/2003 | EP1278935A1 Tubing head seal assembly |
01/29/2003 | CN1394229A Cerium based abrasive material and method for producing cerium based abrasive material |
01/29/2003 | CN1099939C 抛光垫及抛光装置 Polishing pad and polishing equipment |
01/28/2003 | US6511576 System for planarizing microelectronic substrates having apertures |
01/28/2003 | US6511368 Spherical drive assembly for chemical mechanical planarization |
01/28/2003 | US6511367 Carrier head with local pressure control for a chemical mechanical polishing apparatus |
01/28/2003 | US6511365 Lapping machine |
01/28/2003 | US6511363 Polishing end point detecting device for wafer polishing apparatus |
01/28/2003 | US6511362 Polishing apparatus and polishing method |
01/23/2003 | WO2003007360A1 Method for chemical mechanical polishing (cmp) with altering the concentration of oxidizing agent in slurry |
01/23/2003 | WO2003006206A1 Substrate polishing machine |
01/23/2003 | WO2003006205A2 Barrier removal at low polish pressure |
01/23/2003 | WO2002018101A3 Chemical mechanical polishing (cmp) head, apparatus, and method and planarized semiconductor wafer produced thereby |
01/23/2003 | US20030017787 Polishing system including a hydrostatic fluid bearing support |
01/23/2003 | US20030017786 CMP slurry and method for manufacturing a semiconductor device |
01/23/2003 | US20030017784 Method for improving thickness uniformity on a semiconductor wafer during chemical mechanical polishing |
01/23/2003 | US20030017706 Method and apparatus for cleaning a web-based chemical mechanical planarization system |
01/23/2003 | US20030017693 Method of manufacturing semiconductor device for protecting Cu layer from post chemical mechanical polishing-corrosion and chemical mechanical polishing equipment used in the same |
01/23/2003 | US20030015289 Method and apparatus for cleaning a web-based chemical mechanical planarization system |
01/23/2003 | US20030015215 Polishing pad conditioner and application thereof |
01/22/2003 | EP1276826A2 Slurries of abrasive inorganic oxide particles and method for polishing copper containing surfaces |
01/22/2003 | CN1392215A Metal grinding liquid material, metal grinding liquid, its producing method and grinding method using it |
01/21/2003 | US6509269 Elimination of pad glazing for Al CMP |
01/21/2003 | US6508953 Slurry for chemical-mechanical polishing copper damascene structures |
01/21/2003 | US6508952 Chemical mechanical abrasive composition for use in semiconductor processing |
01/21/2003 | US6508697 Polishing pad conditioning system |
01/21/2003 | US6508696 Wafer-polishing head and polishing apparatus having the same |
01/21/2003 | US6508694 Multi-zone pressure control carrier |
01/16/2003 | WO2003005431A1 Chemical mechanical polishing slurry for semiconductor integrated circuit, polishing method and semiconductor integrated circuit |
01/16/2003 | WO2003005421A2 Fabricating structures using chemo-mechanical polishing and chemically-selective endpoint detection |
01/16/2003 | US20030013398 Reinforced polishing pad for linear chemical mechanical polishing and method for forming |
01/16/2003 | US20030013397 Polishing pad of polymer coating |
01/16/2003 | US20030013391 Polishing apparatus |
01/16/2003 | US20030013389 Process for the abrasive machining of surfaces, in particular of semiconductor wafers |
01/16/2003 | US20030013387 Barrier removal at low polish pressure |
01/16/2003 | US20030013386 Chemical mechanical polishing compositions and methods relating thereto |
01/16/2003 | US20030013384 Method and apparatus for chemical mechanical polishing |
01/16/2003 | US20030013383 System and method for reducing surface defects in integrated circuits |
01/16/2003 | US20030013382 Abrasive cloth and polishing method |
01/16/2003 | US20030013381 Polishing pad conditioning system |
01/16/2003 | US20030013306 Barrier to prevent copper diffusion; polishing using reducing agent |
01/16/2003 | US20030010887 Method and apparatus for automatically loading a double-sided polishing machine with wafer crystals |
01/16/2003 | US20030010648 Electrochemically assisted chemical polish |
01/15/2003 | EP1274807A2 Polishing agent and method for producing planar layers |
01/15/2003 | EP1274542A1 Process for reducing surface variations for polished wafer |
01/15/2003 | EP1274540A1 Polishing method using a rehydrated dry particulate polishing composition |
01/15/2003 | CN1099127C Method of modifying exposed surface of semiconductor wafer |