Patents for B24B 37 - Lapping machines or devices; Accessories (20,836)
02/2003
02/25/2003US6523215 Polishing pad and system
02/25/2003CA2248386C Liquid dispensing apparatus and method
02/20/2003WO2003015148A1 Slurry composition for use in chemical mechanical polishing of metal wiring
02/20/2003WO2003015147A1 Wafer holding ring for chemical and mechanical polisher
02/20/2003WO2003013788A1 Platen assembly having a topographically altered platen surface
02/20/2003WO2003013689A1 No drip valve
02/20/2003WO2002100594A8 Improved method and apparatus for bi-directionally polishing a workpiece
02/20/2003US20030036343 Machining strain removal apparatus
02/20/2003US20030036340 Method for polishing angular substrates
02/20/2003US20030036338 Ductile grinding processing for the diamond or diamond film
02/20/2003US20030035940 Via thermoplastic foam polymers; for semiconductor wafer or integrated circuits; smoothness
02/20/2003US20030035730 Method and a pump apparatus for the generation of an adjustable, substantially constant volume flow of a fluid and a use of this method
02/20/2003US20030034131 Chemical mechanical polishing pad having wave shaped grooves
02/20/2003US20030034110 Method and device for producing an adhesive-bonded connection between a semiconductor wafer and a carrier plate
02/19/2003EP1284370A1 Method for delivering variable amounts of flow, and dosing pump using this method
02/19/2003EP1284369A1 Method for delivering variable amounts of flow, and dosing pumping using this method
02/19/2003EP1009588B1 Polishing pad and method for making polishing pad with elongated microcolumns
02/19/2003CN1398213A Abrasive cloth and grinding method thereof
02/18/2003USRE37997 Polishing pad with controlled abrasion rate
02/18/2003US6521536 Planarization process
02/18/2003US6521535 Insitu oxidation for polishing non-oxide ceramics
02/18/2003US6521079 Linear CMP tool design with closed loop slurry distribution
02/18/2003US6520847 Polishing pad having a grooved pattern for use in chemical mechanical polishing
02/18/2003US6520843 High planarity chemical mechanical planarization
02/18/2003US6520841 Apparatus and methods for chemical mechanical polishing with an incrementally advanceable polishing sheet
02/18/2003US6520840 CMP slurry for planarizing metals
02/18/2003US6520839 Load and unload station for semiconductor wafers
02/18/2003US6520835 Polishing system, polishing method, polishing pad, and method of forming polishing pad
02/18/2003US6520834 Methods and apparatuses for analyzing and controlling performance parameters in mechanical and chemical-mechanical planarization of microelectronic substrates
02/18/2003US6520833 Oscillating fixed abrasive CMP system and methods for implementing the same
02/13/2003WO2003012846A1 Chemical mechanical polishing pad with micro-holes
02/13/2003WO2003012000A2 Abrasive particles, and methods of making and using the same
02/13/2003WO2003011999A2 Abrasive particles, abrasive articles, and methods of making and using the same
02/13/2003WO2003011786A1 Glass-ceramics
02/13/2003WO2003011785A2 Abrasive particles and methods of making and using the same
02/13/2003WO2003011784A2 Ceramic materials, abrasive particles, abrasive articles, and methods of making and using the same
02/13/2003WO2003011783A2 Method of making amorphous materials and ceramics
02/13/2003WO2003011782A2 Alumina-zirconia, and methods of making and using the same
02/13/2003WO2003011523A1 Multiport polishing fluid delivery system
02/13/2003WO2003011522A1 Method for fabricating polishing pad using laser beam and mask
02/13/2003WO2003011520A1 Method for fabricating chemical mechanical polishing pad using laser
02/13/2003WO2003011518A1 Cmp system and method for efficiently processing semiconductor wafers
02/13/2003WO2003011479A1 Selective electroless deposition and interconnects made therefrom
02/13/2003WO2002044293A3 Method and composition for the removal of residual materials during substrate planarization
02/13/2003WO2002024413A3 Polishing by cmp for optimized planarization
02/13/2003US20030032567 Cleaning solutions including nucleophilic amine compound having reduction and oxidation potentials
02/13/2003US20030032382 Grinding wheel
02/13/2003US20030032380 Polishing media stabilizer
02/13/2003US20030032379 Platen assembly having a topographically altered platen surface
02/13/2003US20030032378 Polishing surface constituting member and polishing apparatus using the polishing surface constituting member
02/13/2003US20030032377 Measuring apparatus
02/13/2003US20030032374 Apparatus and method for transferring a torque from a rotating hub frame to a one-piece hub shaft
02/13/2003US20030032373 Fabrication of semiconductor interconnect structures
02/13/2003US20030032372 Substrate polishing apparatus
02/13/2003US20030032371 Chemical mechanical polishing compositions and methods relating thereto
02/13/2003US20030031890 Angular substrates
02/13/2003US20030031876 Thermal management with filled polymeric polishing pads and applications therefor
02/13/2003US20030029939 No drip valve
02/13/2003US20030029841 Method and apparatus for polishing metal and dielectric substrates
02/13/2003US20030029840 Polishing systems, methods of polishing substrates, and methods of cleaning polishing slurry from substrate surfaces
02/13/2003CA2455952A1 Abrasive particles and methods of making and using the same
02/13/2003CA2454646A1 Ceramic materials, abrasive particles, abrasive articles, and methods of making and using the same
02/13/2003CA2454079A1 Glass-ceramics
02/13/2003CA2454076A1 Method of making amorphous materials and ceramics
02/12/2003EP1283551A2 Angular substrates
02/12/2003EP1283250A1 Polishing composition and polishing method employing it
02/12/2003EP1283090A2 Method for polishing angular substrates
02/12/2003EP1283089A2 Wafer holding plate for wafer grinding apparatus and method for manufacturing the same
02/12/2003EP1282482A2 Multilayer retaining ring for chemical mechanical polishing
02/12/2003CN1396632A Method for cutting material on two-sided of semiconductor piece
02/11/2003US6518188 Apparatus and methods for chemical-mechanical polishing of semiconductor wafers
02/11/2003US6518172 Method for applying uniform pressurized film across wafer
02/11/2003US6517668 Method and apparatus for endpointing a chemical-mechanical planarization process
02/11/2003US6517667 Apparatus for polishing a semiconductor wafer
02/11/2003US6517591 Apparatus and method for treating a cathode material provided on a thin-film substrate
02/11/2003US6517426 Composite polishing pad for chemical-mechanical polishing
02/11/2003US6517425 Fixed abrasive polishing pad
02/11/2003US6517424 Chromium and amorphous diamond or chromium nitride, bonding strength
02/11/2003US6517422 Polishing apparatus and method thereof
02/11/2003US6517421 Polishing head of a chemical and mechanical polishing apparatus for polishing a wafer
02/11/2003US6517420 Wafer surface machining apparatus
02/11/2003US6517419 Shaping polishing pad for small head chemical mechanical planarization
02/11/2003US6517418 Method of transporting a semiconductor wafer in a wafer polishing system
02/11/2003US6517417 Polishing pad with a transparent portion
02/11/2003US6517416 Chemical mechanical polisher including a pad conditioner and a method of manufacturing an integrated circuit using the chemical mechanical polisher
02/11/2003US6517415 Carrier head with a substrate detection mechanism for a chemical mechanical polishing system
02/11/2003US6517414 Method and apparatus for controlling a pad conditioning process of a chemical-mechanical polishing apparatus
02/11/2003US6517413 Method for a copper CMP endpoint detection system
02/06/2003WO2003010807A1 Method of manufacturing semiconductor integrated circuit device
02/06/2003WO2003009966A1 Ultrasonic conditioning device cleaner for chemical mechanical polishing systems
02/06/2003US20030027506 Apparatus for distributing a fluid through a polishing pad
02/06/2003US20030027505 Multiport polishing fluid delivery system
02/06/2003US20030027504 Chemical mechanical polish pad conditioning device
02/06/2003US20030027500 Polishing pads for chemical mechanical planarization
02/06/2003US20030027499 Composition and method for polishing rigid disks
02/06/2003US20030027498 Retaining ring with active edge-profile control by piezoelectric actuator/sensors
02/06/2003US20030027424 Feedforward and feedback control for conditioning of chemical mechanical polishing pad
02/06/2003US20030025200 Process of manufacturing semiconductor device and slurry used therefor
02/06/2003US20030024582 Valve for a slurry outlet opening of a chemical mechanical polishing device and chemical mechanical polishing device having a valve
02/05/2003EP1281477A1 Polishing pads