Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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03/20/2003 | US20030054739 Method for apparatus for polishing outer peripheral chamfered part of wafer |
03/20/2003 | US20030054735 Pad for chemical mechanical polishing |
03/20/2003 | US20030054734 Preparation of high performance silica slurry using a centrifuge |
03/20/2003 | US20030054729 Methods and apparatus for electromechanically and/or electrochemically-mechanically removing conductive material from a microelectronic substrate |
03/20/2003 | US20030054651 Methods, apparatuses and substrate assembly structures for fabricating microelectronic components using mechanical and chemical-mechanical planarization processes |
03/20/2003 | US20030054650 Process for material-removing machining of both sides of semiconductor wafers |
03/20/2003 | US20030054648 CMP apparatus and method for polishing multiple semiconductor wafers on a single polishing pad using multiple slurry delivery lines |
03/20/2003 | US20030054644 Method of estimation of wafer polish rates |
03/20/2003 | US20030053042 Method and apparatus for optical endpoint detection during chemical mechanical polishing |
03/20/2003 | US20030051812 Method and apparatus for polishing a substrate |
03/20/2003 | US20030051413 Silicon dioxide or aluminum oxide abrasive; polyether; citric acid, oxalic acid, tartaric acid, glycine, alpha -alanine or histidine accelerant; benzotriazole, benzimidazole, triazole, imidazole or tolyltriazole stabilizer; H2O2 and water |
03/20/2003 | DE10162597C1 Polished semiconductor disc manufacturing method uses polishing between upper and lower polishing plates |
03/19/2003 | EP1293297A1 Polishing pad |
03/19/2003 | EP1292428A1 A multi-zone grinding and/or polishing sheet |
03/18/2003 | US6534407 Method for reducing dishing effects during a chemical mechanical polishing process |
03/18/2003 | US6534328 Method of modeling and controlling the endpoint of chemical mechanical polishing operations performed on a process layer, and system for accomplishing same |
03/18/2003 | US6533893 Method and apparatus for chemical-mechanical planarization of microelectronic substrates with selected planarizing liquids |
03/18/2003 | US6533832 For semiconductors; mixture of abrasive and alkanolamine |
03/18/2003 | US6533647 Method for controlling a selected temperature of a planarizing surface of a polish pad. |
03/18/2003 | US6533646 Polishing head with removable subcarrier |
03/18/2003 | US6533645 Substrate polishing article |
03/18/2003 | US6533644 Method of texturing and agent therefor |
03/13/2003 | WO2003021651A1 Polishing fluid for metallic film and method for producing semiconductor substrate using the same |
03/13/2003 | WO2003021641A2 Method and apparatus for sensing a wafer in a carrier |
03/13/2003 | WO2003020471A1 Laminated wear ring |
03/13/2003 | WO2002066206A3 Wafer carrier and method of material removal from a semiconductor wafer |
03/13/2003 | US20030051035 Control system for in-situ feeding back a polish profile |
03/13/2003 | US20030049997 Chemical mechanical polishing tool, apparatus and method |
03/13/2003 | US20030049993 Semiconductor polishing apparatus and method of detecting end point of polishing semiconductor |
03/12/2003 | EP1291132A2 Semiconductor wafer polishing apparatus and polishing method |
03/12/2003 | EP1015176B1 Improved polishing pads and methods relating thereto |
03/12/2003 | CN2539600Y Contact roller curve grinder |
03/12/2003 | CN1402312A Method and device for mfg. adhesion bound joint between semiconductor wafer and carrier disk |
03/11/2003 | USRE38029 Wafer polishing and endpoint detection |
03/11/2003 | US6531401 Method of cleaning a substrate surface using a frozen material |
03/11/2003 | US6531397 Method and apparatus for using across wafer back pressure differentials to influence the performance of chemical mechanical polishing |
03/11/2003 | US6530968 Chemical mechanical polishing slurry |
03/11/2003 | US6530829 CMP pad having isolated pockets of continuous porosity and a method for using such pad |
03/11/2003 | US6530826 Removing haze following epitaxially coating |
03/11/2003 | US6530822 Improving accuracy and quality |
03/11/2003 | US6530397 Multi-channel rotary joint |
03/06/2003 | WO2003019638A1 Constant ph polish and scrub |
03/06/2003 | WO2003019627A2 Cmp process involving frequency analysis-based monitoring |
03/06/2003 | WO2003019251A1 Method and device for polishing optical fiber connectors |
03/06/2003 | WO2003018258A1 Short cmp polish method by maintaining a high ph at the wafer suface |
03/06/2003 | WO2003018256A1 Method and apparatus for chemical mechanical planarization end-o f-polish optimization |
03/06/2003 | WO2003018252A2 Metal polishing |
03/06/2003 | US20030045220 Polishing head for pressurized delivery of slurry |
03/06/2003 | US20030045219 Pedestal of a load-cup which supports wafers loaded/unloaded onto/from a chemical mechanical polishing apparatus |
03/06/2003 | US20030045216 End face polishing apparatus |
03/06/2003 | US20030045210 CMP pad having isolated pockets of continuous porosity and a method for using such pad |
03/06/2003 | US20030045209 Multistage fine hole machining method and device |
03/06/2003 | US20030045208 System and method for chemical mechanical polishing using retractable polishing pads |
03/06/2003 | US20030045207 Apparatus and method for enhanced processing of microelectronic workpieces |
03/06/2003 | US20030045206 Chemical mechanical polishing system and process |
03/06/2003 | US20030045205 Method and apparatus for sensing a wafer in a carrier |
03/06/2003 | US20030045106 Cmp pad having isolated pockets of continuous porosity and a method for using such pad |
03/06/2003 | US20030045100 In-situ method and apparatus for end point detection in chemical mechanical polishing |
03/06/2003 | US20030045097 Method of making <200nm light transmitting optical fluoride crystals for transmitting less than 200nm light |
03/06/2003 | US20030045089 Semiconductor wafer with improved flatness, and process for producing the semiconductor wafer |
03/06/2003 | US20030045073 Process for lapping wafer and method for processing backside of wafer using the same |
03/06/2003 | US20030041967 Laminated wear ring |
03/06/2003 | DE10137577C1 Ventilmittel für eine Slurry-Auslassöffnung einer Vorrichtung für Chemisch-Mechanisches Polieren Valve means for a slurry outlet port of a device for chemical-mechanical polishing |
03/05/2003 | EP1287088A1 Polishing composition |
03/05/2003 | EP1286808A2 A chemical-mechanical polishing system for the manufacture of semiconductor devices |
03/05/2003 | CN1400636A Composite grinding pad for grinding semiconductor wafer and its production method |
03/04/2003 | US6527817 Composition and method for planarizing surfaces |
03/04/2003 | US6527626 Fixed abrasive polishing pad |
03/04/2003 | US6527625 Chemical mechanical polishing apparatus and method having a soft backed polishing head |
03/04/2003 | US6527624 Carrier head for providing a polishing slurry |
03/04/2003 | US6527622 CMP method for noble metals |
02/27/2003 | WO2003017348A1 Chemical mechanical polishing pad having holes and/or grooves |
02/27/2003 | WO2003017347A1 Chemical mechanical polishing pad having wave-shaped grooves |
02/27/2003 | WO2003017330A2 Forming a semiconductor structure using a combination of planarizing methods and electropolishing |
02/27/2003 | WO2003016424A1 Polishing slurry comprising silica-coated ceria |
02/27/2003 | WO2003016070A2 Method and apparatus for supporting a polishing web |
02/27/2003 | WO2003015981A2 Improved chemical mechanical polishing compositions for metal and associated materials and method of using same |
02/27/2003 | WO2003003422A3 In-situ end point detection for semiconductor wafer polishing |
02/27/2003 | WO2002077327A3 Mask plate design |
02/27/2003 | WO2002062528A3 Chemical mechanical machining and surface finishing |
02/27/2003 | WO2001028739A8 Device for polishing outer peripheral edge of semiconductor wafer |
02/27/2003 | US20030040263 End face polishing apparatus and method |
02/27/2003 | US20030040261 Polishing apparatus and a method of polishing and cleaning and drying a wafer |
02/27/2003 | US20030040259 For narrow recesses spacings; solidification of fluid containing abrasive particles |
02/27/2003 | US20030040257 Pin adapter for air bearing surface ( ABS ) lapping and method for using the same |
02/27/2003 | US20030040182 Methods and compositions for chemical mechanical polishing |
02/27/2003 | US20030039452 Method and device for polishing optical fiber connectors |
02/27/2003 | CA2456225A1 Forming a semiconductor structure using a combination of planarizing methods and electropolishing |
02/26/2003 | EP1284842A1 Polishing pads for chemical mechanical planarization |
02/26/2003 | EP1284841A1 Grooved polishing pads for chemical mechanical planarization |
02/26/2003 | EP1284840A2 Pneumatic diaphragm head having an independent retaining ring and multi-region pressure control, and method to use the same |
02/26/2003 | CN1399668A Composition and method for planarizing surfaces |
02/26/2003 | CN1398939A Polishing composition and its polishing method |
02/25/2003 | US6524961 Semiconductor device fabricating method |
02/25/2003 | US6524959 Chemical mechanical polish (CMP) planarizing method employing derivative signal end-point monitoring and control |
02/25/2003 | US6524523 Method for forming dresser of chemical mechanical polishing pad |
02/25/2003 | US6524176 Polishing pad |
02/25/2003 | US6524165 Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing |
02/25/2003 | US6524164 Polishing pad with transparent window having reduced window leakage for a chemical mechanical polishing apparatus |
02/25/2003 | US6524163 Method and apparatus for controlling a polishing process based on scatterometry derived film thickness variation |