Patents
Sitemap › B24 - Grinding; Polishing › B24B - Machines, devices, or processes for grinding or polishing; Dressing or conditioning of abrading surfaces; Feeding of grinding, polishing, or lapping agents › B24B 37 - Lapping machines or devices; Accessories
Patents for B24B 37 - Lapping machines or devices; Accessories (20,836)
03/2003
03/20/2003US20030054739 Method for apparatus for polishing outer peripheral chamfered part of wafer
03/20/2003US20030054735 Pad for chemical mechanical polishing
03/20/2003US20030054734 Preparation of high performance silica slurry using a centrifuge
03/20/2003US20030054729 Methods and apparatus for electromechanically and/or electrochemically-mechanically removing conductive material from a microelectronic substrate
03/20/2003US20030054651 Methods, apparatuses and substrate assembly structures for fabricating microelectronic components using mechanical and chemical-mechanical planarization processes
03/20/2003US20030054650 Process for material-removing machining of both sides of semiconductor wafers
03/20/2003US20030054648 CMP apparatus and method for polishing multiple semiconductor wafers on a single polishing pad using multiple slurry delivery lines
03/20/2003US20030054644 Method of estimation of wafer polish rates
03/20/2003US20030053042 Method and apparatus for optical endpoint detection during chemical mechanical polishing
03/20/2003US20030051812 Method and apparatus for polishing a substrate
03/20/2003US20030051413 Silicon dioxide or aluminum oxide abrasive; polyether; citric acid, oxalic acid, tartaric acid, glycine, alpha -alanine or histidine accelerant; benzotriazole, benzimidazole, triazole, imidazole or tolyltriazole stabilizer; H2O2 and water
03/20/2003DE10162597C1 Polished semiconductor disc manufacturing method uses polishing between upper and lower polishing plates
03/19/2003EP1293297A1 Polishing pad
03/19/2003EP1292428A1 A multi-zone grinding and/or polishing sheet
03/18/2003US6534407 Method for reducing dishing effects during a chemical mechanical polishing process
03/18/2003US6534328 Method of modeling and controlling the endpoint of chemical mechanical polishing operations performed on a process layer, and system for accomplishing same
03/18/2003US6533893 Method and apparatus for chemical-mechanical planarization of microelectronic substrates with selected planarizing liquids
03/18/2003US6533832 For semiconductors; mixture of abrasive and alkanolamine
03/18/2003US6533647 Method for controlling a selected temperature of a planarizing surface of a polish pad.
03/18/2003US6533646 Polishing head with removable subcarrier
03/18/2003US6533645 Substrate polishing article
03/18/2003US6533644 Method of texturing and agent therefor
03/13/2003WO2003021651A1 Polishing fluid for metallic film and method for producing semiconductor substrate using the same
03/13/2003WO2003021641A2 Method and apparatus for sensing a wafer in a carrier
03/13/2003WO2003020471A1 Laminated wear ring
03/13/2003WO2002066206A3 Wafer carrier and method of material removal from a semiconductor wafer
03/13/2003US20030051035 Control system for in-situ feeding back a polish profile
03/13/2003US20030049997 Chemical mechanical polishing tool, apparatus and method
03/13/2003US20030049993 Semiconductor polishing apparatus and method of detecting end point of polishing semiconductor
03/12/2003EP1291132A2 Semiconductor wafer polishing apparatus and polishing method
03/12/2003EP1015176B1 Improved polishing pads and methods relating thereto
03/12/2003CN2539600Y Contact roller curve grinder
03/12/2003CN1402312A Method and device for mfg. adhesion bound joint between semiconductor wafer and carrier disk
03/11/2003USRE38029 Wafer polishing and endpoint detection
03/11/2003US6531401 Method of cleaning a substrate surface using a frozen material
03/11/2003US6531397 Method and apparatus for using across wafer back pressure differentials to influence the performance of chemical mechanical polishing
03/11/2003US6530968 Chemical mechanical polishing slurry
03/11/2003US6530829 CMP pad having isolated pockets of continuous porosity and a method for using such pad
03/11/2003US6530826 Removing haze following epitaxially coating
03/11/2003US6530822 Improving accuracy and quality
03/11/2003US6530397 Multi-channel rotary joint
03/06/2003WO2003019638A1 Constant ph polish and scrub
03/06/2003WO2003019627A2 Cmp process involving frequency analysis-based monitoring
03/06/2003WO2003019251A1 Method and device for polishing optical fiber connectors
03/06/2003WO2003018258A1 Short cmp polish method by maintaining a high ph at the wafer suface
03/06/2003WO2003018256A1 Method and apparatus for chemical mechanical planarization end-o f-polish optimization
03/06/2003WO2003018252A2 Metal polishing
03/06/2003US20030045220 Polishing head for pressurized delivery of slurry
03/06/2003US20030045219 Pedestal of a load-cup which supports wafers loaded/unloaded onto/from a chemical mechanical polishing apparatus
03/06/2003US20030045216 End face polishing apparatus
03/06/2003US20030045210 CMP pad having isolated pockets of continuous porosity and a method for using such pad
03/06/2003US20030045209 Multistage fine hole machining method and device
03/06/2003US20030045208 System and method for chemical mechanical polishing using retractable polishing pads
03/06/2003US20030045207 Apparatus and method for enhanced processing of microelectronic workpieces
03/06/2003US20030045206 Chemical mechanical polishing system and process
03/06/2003US20030045205 Method and apparatus for sensing a wafer in a carrier
03/06/2003US20030045106 Cmp pad having isolated pockets of continuous porosity and a method for using such pad
03/06/2003US20030045100 In-situ method and apparatus for end point detection in chemical mechanical polishing
03/06/2003US20030045097 Method of making <200nm light transmitting optical fluoride crystals for transmitting less than 200nm light
03/06/2003US20030045089 Semiconductor wafer with improved flatness, and process for producing the semiconductor wafer
03/06/2003US20030045073 Process for lapping wafer and method for processing backside of wafer using the same
03/06/2003US20030041967 Laminated wear ring
03/06/2003DE10137577C1 Ventilmittel für eine Slurry-Auslassöffnung einer Vorrichtung für Chemisch-Mechanisches Polieren Valve means for a slurry outlet port of a device for chemical-mechanical polishing
03/05/2003EP1287088A1 Polishing composition
03/05/2003EP1286808A2 A chemical-mechanical polishing system for the manufacture of semiconductor devices
03/05/2003CN1400636A Composite grinding pad for grinding semiconductor wafer and its production method
03/04/2003US6527817 Composition and method for planarizing surfaces
03/04/2003US6527626 Fixed abrasive polishing pad
03/04/2003US6527625 Chemical mechanical polishing apparatus and method having a soft backed polishing head
03/04/2003US6527624 Carrier head for providing a polishing slurry
03/04/2003US6527622 CMP method for noble metals
02/2003
02/27/2003WO2003017348A1 Chemical mechanical polishing pad having holes and/or grooves
02/27/2003WO2003017347A1 Chemical mechanical polishing pad having wave-shaped grooves
02/27/2003WO2003017330A2 Forming a semiconductor structure using a combination of planarizing methods and electropolishing
02/27/2003WO2003016424A1 Polishing slurry comprising silica-coated ceria
02/27/2003WO2003016070A2 Method and apparatus for supporting a polishing web
02/27/2003WO2003015981A2 Improved chemical mechanical polishing compositions for metal and associated materials and method of using same
02/27/2003WO2003003422A3 In-situ end point detection for semiconductor wafer polishing
02/27/2003WO2002077327A3 Mask plate design
02/27/2003WO2002062528A3 Chemical mechanical machining and surface finishing
02/27/2003WO2001028739A8 Device for polishing outer peripheral edge of semiconductor wafer
02/27/2003US20030040263 End face polishing apparatus and method
02/27/2003US20030040261 Polishing apparatus and a method of polishing and cleaning and drying a wafer
02/27/2003US20030040259 For narrow recesses spacings; solidification of fluid containing abrasive particles
02/27/2003US20030040257 Pin adapter for air bearing surface ( ABS ) lapping and method for using the same
02/27/2003US20030040182 Methods and compositions for chemical mechanical polishing
02/27/2003US20030039452 Method and device for polishing optical fiber connectors
02/27/2003CA2456225A1 Forming a semiconductor structure using a combination of planarizing methods and electropolishing
02/26/2003EP1284842A1 Polishing pads for chemical mechanical planarization
02/26/2003EP1284841A1 Grooved polishing pads for chemical mechanical planarization
02/26/2003EP1284840A2 Pneumatic diaphragm head having an independent retaining ring and multi-region pressure control, and method to use the same
02/26/2003CN1399668A Composition and method for planarizing surfaces
02/26/2003CN1398939A Polishing composition and its polishing method
02/25/2003US6524961 Semiconductor device fabricating method
02/25/2003US6524959 Chemical mechanical polish (CMP) planarizing method employing derivative signal end-point monitoring and control
02/25/2003US6524523 Method for forming dresser of chemical mechanical polishing pad
02/25/2003US6524176 Polishing pad
02/25/2003US6524165 Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing
02/25/2003US6524164 Polishing pad with transparent window having reduced window leakage for a chemical mechanical polishing apparatus
02/25/2003US6524163 Method and apparatus for controlling a polishing process based on scatterometry derived film thickness variation
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