Patents for B24B 37 - Lapping machines or devices; Accessories (20,836)
04/2003
04/08/2003US6544435 Composition and method of formation and use therefor in chemical-mechanical polishing
04/08/2003US6544373 Polishing pad for a chemical mechanical polishing process
04/08/2003US6544307 Polishing composition and manufacturing and polishing methods
04/08/2003US6544111 Polishing apparatus and polishing table therefor
04/08/2003US6544109 Slurry delivery and planarization systems
04/08/2003US6544107 Composite polishing pads for chemical-mechanical polishing
04/08/2003US6544104 Polishing pad and polisher
04/08/2003US6544103 Method to determine optimum geometry of a multizone carrier
04/08/2003US6543267 Apparatus and methods for substantial planarization of solder bumps
04/03/2003WO2003028080A1 Processing device, processing method, and method of manufacturing semiconductor device
04/03/2003WO2003028048A2 Low-force electrochemical mechanical processing method and apparatus
04/03/2003WO2003027201A1 Rare earth salt/oxidizer-based cmp method
04/03/2003WO2003026847A1 A method and apparatus for inline measurement of material removal during a polishing or grinding process
04/03/2003WO2003016070A3 Method and apparatus for supporting a polishing web
04/03/2003WO2002076674A3 Rigid polishing pad conditioner for chemical mechanical polishing tool
04/03/2003US20030064902 Apparatus and process for producing polished semiconductor wafers
04/03/2003US20030064669 Low-force electrochemical mechanical processing method and apparatus
04/03/2003US20030064663 Abrasive article having a window system for polishing wafers, and methods
04/03/2003US20030064596 Method of polishing a semiconductor wafer surface
04/03/2003US20030064595 Chemical mechanical polishing defect reduction system and method
04/03/2003US20030064594 Process for chemical mechanical polishing
04/03/2003US20030062346 Method of vacuum holes formation on carrier film of chemical mechanical polishing machine
04/03/2003US20030062335 Process for smoothing a rough surface on a substrate by dry etching
04/03/2003US20030062269 Electrochemical mechanical planarization
04/03/2003US20030061865 Method for assembling a polishing head and apparatus for detecting air leakage in the polishing head while assembling the same
04/03/2003US20030061766 Polishing agent and method for producing planar layers
04/02/2003EP1298713A1 Semiconductor wafer thinning method, and thin semiconductor wafer
04/02/2003EP1200352B1 Improved ceria powder
04/02/2003CN1408124A Chemical-mechanical polishing method
04/02/2003CN1407606A Grinding pad
04/02/2003CN1407605A Device for eliminating stress by machining
04/02/2003CN1407241A Pump device and method for generating adjustable constant fluid volume flow and its application
04/02/2003CN1407050A Grinding composition and its grinding method
04/02/2003CN1407045A 抛光组合物 The polishing composition
04/02/2003CN1406716A Multi-position micro-hole machining method and apparatus
04/01/2003US6541383 Apparatus and method for planarizing the surface of a semiconductor wafer
04/01/2003US6541381 Finishing method for semiconductor wafers using a lubricating boundary layer
04/01/2003US6541135 Seal rings with improved friction and wear properties
04/01/2003US6540935 Chemical/mechanical polishing slurry, and chemical mechanical polishing process and shallow trench isolation process employing the same
04/01/2003US6540595 Chemical-Mechanical polishing apparatus and method utilizing an advanceable polishing sheet
04/01/2003US6540594 Carrier head with a flexible membrane for a chemical mechanical polishing system
04/01/2003US6540593 Fixed abrasive polishing pad
04/01/2003US6540592 Carrier head with reduced moment wear ring
04/01/2003US6540591 Method and apparatus for post-polish thickness and uniformity control
04/01/2003US6540590 Chemical mechanical polishing apparatus and method having a rotating retaining ring
04/01/2003US6540587 Infrared end-point detection system
03/2003
03/27/2003WO2003026001A2 Integrated equipment set for forming an interconnect on a substrate
03/27/2003WO2003025996A1 Cmp apparatus and method for polishing multiple semiconductor wafers on a single polishing pad using multiple slurry delivery lines
03/27/2003WO2003025085A1 Cerium-based abrasive material slurry and method for producing cerium-based abrasive material slurry
03/27/2003WO2003024666A1 Wafer based temperature sensors for characterizing chemical mechanical polishing processes
03/27/2003WO2002077327B1 Mask plate design
03/27/2003WO2002024410A9 Cmp apparatus and methods to control the tilt of the carrier head, the retaining ring and the pad conditioner
03/27/2003US20030060151 CMP pad having isolated pockets of continuous porosity and a method for using such pad
03/27/2003US20030060145 Multi-step polishing system and process of using same
03/27/2003US20030060144 Apparatus and method for conditioning a contact surface of a processing pad used in processing microelectronic workpieces
03/27/2003US20030060143 Chemical mechanical polishing apparatus with rotating belt
03/27/2003US20030060140 Web-format polishing pads and methods for manufacturing and using web-format polishing pads in mechanical and chemical-mechanical planarization of microelectronic substrates
03/27/2003US20030060139 Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates with metal compound abrasives
03/27/2003US20030060138 Polishing pad for semiconductor wafer and polishing process using thereof
03/27/2003US20030060137 CMP pad having isolated pockets of continuous porosity and a method for using such pad
03/27/2003US20030060135 Rare earth salt/oxidizer-based cmp method
03/27/2003US20030060134 Platen with peripheral frame for supporting a web of polishing material in a chemical mechanical planarization system
03/27/2003US20030060130 Method and apparatus for conditioning a chemical-mechanical polishing pad
03/27/2003US20030060128 Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization
03/27/2003US20030060127 Sensor for in-situ pad wear during CMP
03/27/2003US20030060126 System and method of defect optimization for chemical mechanical planarization of polysilicon
03/27/2003US20030060050 Semiconductor wafer with improved local flatness, and method for its production
03/27/2003US20030060047 Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies
03/27/2003US20030060046 Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies
03/27/2003US20030060020 Method and apparatus for finishing substrates for wafer to wafer bonding
03/27/2003US20030059963 Method of estimation of wafer-to-wafer thickness
03/27/2003US20030057185 Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies
03/27/2003US20030056822 Flushing a multi-port valve manifold
03/26/2003EP1295682A1 Abrasive material
03/26/2003EP1295680A2 Polishing pad for semiconductor wafer
03/26/2003EP1295322A2 Two step chemical mechanical polishing process
03/26/2003EP1294537A1 Wafer carrier with groove for decoupling retainer ring from wafer
03/26/2003EP1294536A2 Base-pad for a polishing pad
03/26/2003EP1294535A1 Oscillating fixed abrasive cmp system and methods for implementing the same
03/26/2003EP1294534A1 In-situ endpoint detection and process monitoring method and apparatus for chemical mechanical polishing
03/26/2003EP0907460B1 Method for chemical-mechanical planarization of stop-on-feature semiconductor wafers
03/26/2003CN1405850A System for controlling instant-compensuted grinded curved surface
03/26/2003CN1405838A Semiconductor device manufacture method
03/25/2003US6539277 Lapping surface patterning system
03/25/2003US6537915 Methods of treating surfaces of substrates
03/25/2003US6537190 Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates
03/25/2003US6537144 Method and apparatus for enhanced CMP using metals having reductive properties
03/25/2003US6537143 Pedestal of a load-cup which supports wafers loaded/unloaded onto/from a chemical mechanical polishing apparatus
03/25/2003US6537137 Methods for chemical-mechanical polishing of semiconductor wafers
03/25/2003US6537136 Web-format polishing pads and methods for manufacturing and using web-format polishing pads in mechanical and chemical-mechanical planarization of microelectronic substrates
03/25/2003US6537135 Curvilinear chemical mechanical planarization device and method
03/25/2003US6537134 Polishing pad comprising a filled translucent region
03/25/2003US6537133 Method for in-situ endpoint detection for chemical mechanical polishing operations
03/20/2003WO2003023537A1 An integrated micro-optical and photonics elements batch preparation, polishing, cleaning and inspection system and method therefore
03/20/2003WO2003022519A2 Slurry distributor for chemical mechanical polishing apparatus and method of using the same
03/20/2003WO2003022518A2 Chemical mechanical polishing tool, apparatus and method
03/20/2003WO2003011784A8 Ceramic materials, abrasive particles, abrasive articles, and methods of making and using the same
03/20/2003WO2002078903A3 Method and apparatus for avoiding particle accumulation during an electrochemical process
03/20/2003WO2002059947A3 Carrier head for holding a wafer and allowing processing on a front face thereof to occur
03/20/2003US20030055526 Wafer based temperature sensors for characterizing chemical mechanical polishing processes