Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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04/08/2003 | US6544435 Composition and method of formation and use therefor in chemical-mechanical polishing |
04/08/2003 | US6544373 Polishing pad for a chemical mechanical polishing process |
04/08/2003 | US6544307 Polishing composition and manufacturing and polishing methods |
04/08/2003 | US6544111 Polishing apparatus and polishing table therefor |
04/08/2003 | US6544109 Slurry delivery and planarization systems |
04/08/2003 | US6544107 Composite polishing pads for chemical-mechanical polishing |
04/08/2003 | US6544104 Polishing pad and polisher |
04/08/2003 | US6544103 Method to determine optimum geometry of a multizone carrier |
04/08/2003 | US6543267 Apparatus and methods for substantial planarization of solder bumps |
04/03/2003 | WO2003028080A1 Processing device, processing method, and method of manufacturing semiconductor device |
04/03/2003 | WO2003028048A2 Low-force electrochemical mechanical processing method and apparatus |
04/03/2003 | WO2003027201A1 Rare earth salt/oxidizer-based cmp method |
04/03/2003 | WO2003026847A1 A method and apparatus for inline measurement of material removal during a polishing or grinding process |
04/03/2003 | WO2003016070A3 Method and apparatus for supporting a polishing web |
04/03/2003 | WO2002076674A3 Rigid polishing pad conditioner for chemical mechanical polishing tool |
04/03/2003 | US20030064902 Apparatus and process for producing polished semiconductor wafers |
04/03/2003 | US20030064669 Low-force electrochemical mechanical processing method and apparatus |
04/03/2003 | US20030064663 Abrasive article having a window system for polishing wafers, and methods |
04/03/2003 | US20030064596 Method of polishing a semiconductor wafer surface |
04/03/2003 | US20030064595 Chemical mechanical polishing defect reduction system and method |
04/03/2003 | US20030064594 Process for chemical mechanical polishing |
04/03/2003 | US20030062346 Method of vacuum holes formation on carrier film of chemical mechanical polishing machine |
04/03/2003 | US20030062335 Process for smoothing a rough surface on a substrate by dry etching |
04/03/2003 | US20030062269 Electrochemical mechanical planarization |
04/03/2003 | US20030061865 Method for assembling a polishing head and apparatus for detecting air leakage in the polishing head while assembling the same |
04/03/2003 | US20030061766 Polishing agent and method for producing planar layers |
04/02/2003 | EP1298713A1 Semiconductor wafer thinning method, and thin semiconductor wafer |
04/02/2003 | EP1200352B1 Improved ceria powder |
04/02/2003 | CN1408124A Chemical-mechanical polishing method |
04/02/2003 | CN1407606A Grinding pad |
04/02/2003 | CN1407605A Device for eliminating stress by machining |
04/02/2003 | CN1407241A Pump device and method for generating adjustable constant fluid volume flow and its application |
04/02/2003 | CN1407050A Grinding composition and its grinding method |
04/02/2003 | CN1407045A 抛光组合物 The polishing composition |
04/02/2003 | CN1406716A Multi-position micro-hole machining method and apparatus |
04/01/2003 | US6541383 Apparatus and method for planarizing the surface of a semiconductor wafer |
04/01/2003 | US6541381 Finishing method for semiconductor wafers using a lubricating boundary layer |
04/01/2003 | US6541135 Seal rings with improved friction and wear properties |
04/01/2003 | US6540935 Chemical/mechanical polishing slurry, and chemical mechanical polishing process and shallow trench isolation process employing the same |
04/01/2003 | US6540595 Chemical-Mechanical polishing apparatus and method utilizing an advanceable polishing sheet |
04/01/2003 | US6540594 Carrier head with a flexible membrane for a chemical mechanical polishing system |
04/01/2003 | US6540593 Fixed abrasive polishing pad |
04/01/2003 | US6540592 Carrier head with reduced moment wear ring |
04/01/2003 | US6540591 Method and apparatus for post-polish thickness and uniformity control |
04/01/2003 | US6540590 Chemical mechanical polishing apparatus and method having a rotating retaining ring |
04/01/2003 | US6540587 Infrared end-point detection system |
03/27/2003 | WO2003026001A2 Integrated equipment set for forming an interconnect on a substrate |
03/27/2003 | WO2003025996A1 Cmp apparatus and method for polishing multiple semiconductor wafers on a single polishing pad using multiple slurry delivery lines |
03/27/2003 | WO2003025085A1 Cerium-based abrasive material slurry and method for producing cerium-based abrasive material slurry |
03/27/2003 | WO2003024666A1 Wafer based temperature sensors for characterizing chemical mechanical polishing processes |
03/27/2003 | WO2002077327B1 Mask plate design |
03/27/2003 | WO2002024410A9 Cmp apparatus and methods to control the tilt of the carrier head, the retaining ring and the pad conditioner |
03/27/2003 | US20030060151 CMP pad having isolated pockets of continuous porosity and a method for using such pad |
03/27/2003 | US20030060145 Multi-step polishing system and process of using same |
03/27/2003 | US20030060144 Apparatus and method for conditioning a contact surface of a processing pad used in processing microelectronic workpieces |
03/27/2003 | US20030060143 Chemical mechanical polishing apparatus with rotating belt |
03/27/2003 | US20030060140 Web-format polishing pads and methods for manufacturing and using web-format polishing pads in mechanical and chemical-mechanical planarization of microelectronic substrates |
03/27/2003 | US20030060139 Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates with metal compound abrasives |
03/27/2003 | US20030060138 Polishing pad for semiconductor wafer and polishing process using thereof |
03/27/2003 | US20030060137 CMP pad having isolated pockets of continuous porosity and a method for using such pad |
03/27/2003 | US20030060135 Rare earth salt/oxidizer-based cmp method |
03/27/2003 | US20030060134 Platen with peripheral frame for supporting a web of polishing material in a chemical mechanical planarization system |
03/27/2003 | US20030060130 Method and apparatus for conditioning a chemical-mechanical polishing pad |
03/27/2003 | US20030060128 Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization |
03/27/2003 | US20030060127 Sensor for in-situ pad wear during CMP |
03/27/2003 | US20030060126 System and method of defect optimization for chemical mechanical planarization of polysilicon |
03/27/2003 | US20030060050 Semiconductor wafer with improved local flatness, and method for its production |
03/27/2003 | US20030060047 Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies |
03/27/2003 | US20030060046 Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies |
03/27/2003 | US20030060020 Method and apparatus for finishing substrates for wafer to wafer bonding |
03/27/2003 | US20030059963 Method of estimation of wafer-to-wafer thickness |
03/27/2003 | US20030057185 Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies |
03/27/2003 | US20030056822 Flushing a multi-port valve manifold |
03/26/2003 | EP1295682A1 Abrasive material |
03/26/2003 | EP1295680A2 Polishing pad for semiconductor wafer |
03/26/2003 | EP1295322A2 Two step chemical mechanical polishing process |
03/26/2003 | EP1294537A1 Wafer carrier with groove for decoupling retainer ring from wafer |
03/26/2003 | EP1294536A2 Base-pad for a polishing pad |
03/26/2003 | EP1294535A1 Oscillating fixed abrasive cmp system and methods for implementing the same |
03/26/2003 | EP1294534A1 In-situ endpoint detection and process monitoring method and apparatus for chemical mechanical polishing |
03/26/2003 | EP0907460B1 Method for chemical-mechanical planarization of stop-on-feature semiconductor wafers |
03/26/2003 | CN1405850A System for controlling instant-compensuted grinded curved surface |
03/26/2003 | CN1405838A Semiconductor device manufacture method |
03/25/2003 | US6539277 Lapping surface patterning system |
03/25/2003 | US6537915 Methods of treating surfaces of substrates |
03/25/2003 | US6537190 Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates |
03/25/2003 | US6537144 Method and apparatus for enhanced CMP using metals having reductive properties |
03/25/2003 | US6537143 Pedestal of a load-cup which supports wafers loaded/unloaded onto/from a chemical mechanical polishing apparatus |
03/25/2003 | US6537137 Methods for chemical-mechanical polishing of semiconductor wafers |
03/25/2003 | US6537136 Web-format polishing pads and methods for manufacturing and using web-format polishing pads in mechanical and chemical-mechanical planarization of microelectronic substrates |
03/25/2003 | US6537135 Curvilinear chemical mechanical planarization device and method |
03/25/2003 | US6537134 Polishing pad comprising a filled translucent region |
03/25/2003 | US6537133 Method for in-situ endpoint detection for chemical mechanical polishing operations |
03/20/2003 | WO2003023537A1 An integrated micro-optical and photonics elements batch preparation, polishing, cleaning and inspection system and method therefore |
03/20/2003 | WO2003022519A2 Slurry distributor for chemical mechanical polishing apparatus and method of using the same |
03/20/2003 | WO2003022518A2 Chemical mechanical polishing tool, apparatus and method |
03/20/2003 | WO2003011784A8 Ceramic materials, abrasive particles, abrasive articles, and methods of making and using the same |
03/20/2003 | WO2002078903A3 Method and apparatus for avoiding particle accumulation during an electrochemical process |
03/20/2003 | WO2002059947A3 Carrier head for holding a wafer and allowing processing on a front face thereof to occur |
03/20/2003 | US20030055526 Wafer based temperature sensors for characterizing chemical mechanical polishing processes |