| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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| 05/01/2003 | US20030082904 Chemical mechanical polishing of copper-oxide damascene structures |
| 05/01/2003 | US20030082867 Endpoint stabilization for polishing process |
| 05/01/2003 | US20030082844 System and method of determining a polishing endpoint by monitoring signal intensity |
| 05/01/2003 | US20030079836 Carrier head for chemical mechanical polishing |
| 05/01/2003 | US20030079828 Tool for applying an insert or tape to chucks or wafer carriers used for grinding, polishing, or planarizing wafers |
| 05/01/2003 | US20030079416 Chemical mechanical polishing compositions for metal and associated materials and method of using same |
| 04/30/2003 | CN2547460Y Lapping machine apparatus of seal surface for safety valve |
| 04/29/2003 | US6555475 Arrangement and method for polishing a surface of a semiconductor wafer |
| 04/29/2003 | US6555022 Oxygen-containing, such as metal oxides, silicates, borates or titanates, small particle size, narrow particle size distribution; displays |
| 04/29/2003 | US6554951 Chemical-mechanical polishing pad conditioning system and method |
| 04/29/2003 | US6554690 Drive device for a grinding, lapping or buffing-tool body |
| 04/29/2003 | US6554689 Work holding member for mechanical abrasion, abrading method, and abrading machine |
| 04/29/2003 | US6554688 Method and apparatus for conditioning a polishing pad with sonic energy |
| 04/29/2003 | US6554467 Process and apparatus for blending and distributing a slurry solution |
| 04/24/2003 | WO2003033208A1 Assembly system for stationing semiconductor wafer and process f or manufacturing semiconductor wafer |
| 04/24/2003 | WO2002085570A3 Conductive polishing article for electrochemical mechanical polishing |
| 04/24/2003 | US20030077995 Chemical mechanical polishing slurry |
| 04/24/2003 | US20030077989 Polishing system with air exhaust system |
| 04/24/2003 | US20030077988 Activated slurry CMP system and methods for implementing the same |
| 04/24/2003 | US20030077986 Front-reference carrier on orbital solid platen |
| 04/24/2003 | US20030077985 Boron-containing polishing system and method |
| 04/24/2003 | US20030077982 Method of producing a glass substrate for a magnetic recording medium and method of producing a magnetic recording medium |
| 04/24/2003 | US20030077981 Composition and a method for defect reduction |
| 04/24/2003 | US20030077904 Polishing method and polishing apparatus permitting control of polishing time at a high accuracy |
| 04/24/2003 | US20030077436 Method of altering and preserving the surface properties of a polishing pad and specific applications therefor |
| 04/24/2003 | US20030075523 Grinding-and-etching system for plate-like objects |
| 04/23/2003 | EP1303381A2 Grooved polishing pads and methods of use |
| 04/23/2003 | EP1303379A2 Multi-chamber carrier head with a flexible membrane |
| 04/23/2003 | CN1412823A Polishing method and device capable of high precision controlling polishing time |
| 04/23/2003 | CN1411955A Polishing equipment |
| 04/23/2003 | CN1106634C Manufacturing method for magnetic heads |
| 04/22/2003 | US6552408 Methods, apparatuses, and substrate assembly structures for fabricating microelectronic components using mechanical and chemical-mechanical planarization processes |
| 04/22/2003 | US6551933 Abrasive finishing with lubricant and tracking |
| 04/22/2003 | US6551179 Hard polishing pad for chemical mechanical planarization |
| 04/22/2003 | US6551176 Pad conditioning disk |
| 04/22/2003 | US6551175 Polishing composition |
| 04/22/2003 | US6551174 Supplying slurry to a polishing pad in a chemical mechanical polishing system |
| 04/22/2003 | US6551173 Process and apparatus for finishing a magnetic slider |
| 04/22/2003 | US6551172 Polishing apparatus and polishing method |
| 04/17/2003 | WO2003032379A1 Polishing pad for cmp, method for polishing substrate using it and method for producing polishing pad for cmp |
| 04/17/2003 | WO2003032374A2 Workpiece carrier with adjustable pressure zones and barriers |
| 04/17/2003 | WO2003031119A1 Chemical mechanical polishing endpoint detection |
| 04/17/2003 | US20030074098 Integrated equipment set for forming an interconnect on a substrate |
| 04/17/2003 | US20030073393 Polishing plate |
| 04/17/2003 | US20030073391 Ultrasonic conditioning device cleaner for chemical mechanical polishing systems |
| 04/17/2003 | US20030073390 Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies of planarizing pads |
| 04/17/2003 | US20030073389 Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads |
| 04/17/2003 | US20030073388 Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads |
| 04/17/2003 | US20030073387 Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads |
| 04/17/2003 | US20030073386 Chemical mechanical polishing compositions for metal and associated materials and method of using same |
| 04/17/2003 | US20030073384 System for real-time control of semiconductor wafer polishing |
| 04/17/2003 | US20030073383 Polishing platen of chemical mechanical polishing apparatus and planarization method using the same |
| 04/17/2003 | US20030073381 Workpiece carrier with adjustable pressure zones and barriers |
| 04/17/2003 | US20030073319 Chemical mechanical polishing endpoint detection |
| 04/17/2003 | US20030070757 Method and apparatus for two-part CMP retaining ring |
| 04/17/2003 | US20030070756 Wafer carrier used for chemical mechanic polishing |
| 04/17/2003 | DE10212266C1 Production of microtiter plates comprises forming microwells in chemically resistant glass wafers by ultrasonic lapping using mold, larger plate then being cut into individual microtiter plates |
| 04/16/2003 | EP1302522A2 Gel-free colloidal abrasive and polishing compositions and methods of using them |
| 04/15/2003 | US6548408 Method of minimizing repetitive chemical-mechanical polishing scratch marks, method of processing a semiconductor wafer outer surface, method of minimizing undesired node-to-node shorts of a length less than or equal to 0.3 micron, and semiconductor processing method |
| 04/15/2003 | US6548407 Method and apparatus for controlling chemical interactions during planarization of microelectronic substrates |
| 04/15/2003 | US6547961 Grinding slurry recycling apparatus |
| 04/15/2003 | US6547842 Polishing material, grinding particle body for abrasion-grinding, method for producing a polishing material, and method for polishing or grinding, and polishing apparatus |
| 04/15/2003 | US6547652 Linear CMP tool design using in-situ slurry distribution and concurrent pad conditioning |
| 04/15/2003 | US6547651 Subaperture chemical mechanical planarization with polishing pad conditioning |
| 04/15/2003 | US6547650 Polishing apparatus |
| 04/15/2003 | US6547647 Method of wafer reclaim |
| 04/15/2003 | US6547646 Method for supplying slurry to a semiconductor processing machine |
| 04/15/2003 | US6547644 Metathesis ring-opening polymerization; polishing glass sheet |
| 04/15/2003 | US6547640 Devices and methods for in-situ control of mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies |
| 04/15/2003 | US6547638 Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device |
| 04/15/2003 | US6547637 Chemical/mechanical polishing endpoint detection device and method |
| 04/15/2003 | US6546939 Removal residues from copper or aluminum surfaces; polishing with aqueous acidity solution containing buffers |
| 04/15/2003 | CA2260484C Method and apparatus for polishing ophthalmic lenses |
| 04/10/2003 | WO2003030233A1 Method and device for simulation, method and device for polishing, method and device for preparing control parameter or control program, polishing system, recording medium, and method of manufacturing semiconductor device |
| 04/10/2003 | WO2003030232A1 Grinding work holding disk, work grinding device and grinding method |
| 04/10/2003 | WO2003028951A1 Apparatus and process for producing polished semiconductor wafers |
| 04/10/2003 | WO2003028950A1 Multizone carrier with process monitoring system for chemical-mechanical planarization tool |
| 04/10/2003 | WO2002078900A3 Apparatus and methods for aligning a surface of an active retainer ring with a wafer surface for chemical mechanical polishing |
| 04/10/2003 | US20030068966 Vibration damping in a carrier head |
| 04/10/2003 | US20030068965 Polishing tool used for CMP |
| 04/10/2003 | US20030068964 Polishing apparatus |
| 04/10/2003 | US20030068963 Pad conditioner coupling and end effector for a chemical mechanical planarization system and method therefor |
| 04/10/2003 | US20030068962 Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads |
| 04/10/2003 | US20030068961 Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads |
| 04/10/2003 | US20030068960 Polymeric polishing pad having continuously regenerated work surface |
| 04/10/2003 | US20030068959 Slurry distributor for chemical mechanical polishing apparatus and method of using the same |
| 04/10/2003 | US20030068958 Polishing apparatus, polishing head and method |
| 04/10/2003 | US20030068893 Fused alumina and metal oxide abrasive particles bonded together via vitrified bonding material, comprising silica, alumina, and boria |
| 04/10/2003 | US20030068889 Polishing method, polishing system and process-managing system |
| 04/10/2003 | US20030068888 Method of manufacturing a semiconductor device |
| 04/10/2003 | US20030066604 Integrated platen assembly for a chemical mechanical planarization |
| 04/10/2003 | US20030066548 Inline monitoring of pad loading for CuCMP and developing an endpoint technique for cleaning |
| 04/09/2003 | EP1299490A1 Silane containing polishing composition for cmp |
| 04/09/2003 | EP1299489A1 Cmp polishing composition for metal |
| 04/09/2003 | EP1299210A1 Polishing pad grooving method and apparatus |
| 04/09/2003 | EP1090334B1 System and method for controlling a multi-arm polishing tool |
| 04/09/2003 | CN1409749A Method for polishing or planarizing substrate |
| 04/08/2003 | US6546306 Method for adjusting incoming film thickness uniformity such that variations across the film after polishing minimized |
| 04/08/2003 | US6545299 Structures using chemo-mechanical polishing and chemically-selective endpoint detection |
| 04/08/2003 | US6544892 In preference to silicon nitride; includes abrasives and amino acids; semiconductors |