Patents
Sitemap › B24 - Grinding; Polishing › B24B - Machines, devices, or processes for grinding or polishing; Dressing or conditioning of abrading surfaces; Feeding of grinding, polishing, or lapping agents › B24B 37 - Lapping machines or devices; Accessories
Patents for B24B 37 - Lapping machines or devices; Accessories (20,836)
05/2003
05/22/2003US20030094721 Foamed polishing sheet and method of producing same
05/22/2003US20030094593 Silica and a silica-based slurry
05/22/2003US20030094364 Method and apparatus for electro-chemical mechanical deposition
05/21/2003EP1312112A2 Method for preventing damage to wafers in a sequential multiple steps polishing process
05/21/2003EP1311366A2 Cmp apparatus with an oscillating polishing pad rotating in the opposite direction of the wafer
05/21/2003EP1068047B1 Apparatus and method for film thickness measurement integrated into a wafer load/unload unit
05/21/2003CN2551400Y Improved structure for internal diameter lapping machine
05/21/2003CN1419269A Abrading head for chemical mechanical abrading
05/20/2003US6566286 Polished-piece holder
05/20/2003US6566268 Method and apparatus for planarizing a wafer surface of a semiconductor wafer having an elevated portion extending therefrom
05/20/2003US6566267 Inexpensive process for producing a multiplicity of semiconductor wafers
05/20/2003US6565705 Wafer carrier used for chemical mechanic polishing
05/20/2003US6565619 Mixture of colloidal silica, acid and water
05/20/2003US6565618 Heat treatment in presenc eof acid
05/20/2003US6565423 Apparatus and method for polishing a ferrule end face for an optical connector
05/20/2003US6565422 Polishing apparatus using substantially abrasive-free liquid with mixture unit near polishing unit, and plant using the polishing apparatus
05/20/2003US6565416 Laser interferometry endpoint detection with windowless polishing pad for chemical mechanical polishing process
05/20/2003US6564812 Used for removing photoresist or other residue from a substrate, such as an integrated circuit
05/15/2003WO2003041126A2 Electrochemical mechanical processing with advancible sweeper
05/15/2003WO2003039812A1 Method of fabricating a polishing pad having an optical window
05/15/2003WO2002053490A3 Method of making optical fluoride laser crystal components
05/15/2003US20030092371 Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus
05/15/2003US20030092363 Method and apparatus for controlling slurry distribution
05/15/2003US20030092362 Powder for disks
05/15/2003US20030092358 Workpiece handling end-effector and a method for processing workpieces using a workpiece handling end-effector
05/15/2003US20030092269 Method and apparatus for endpoint detection during chemical mechanical polishing
05/15/2003US20030092265 Comprises acrylic acid-maleic acid copolymer and sodium hydroxide; for chemical mechanical polishing of semiconductors
05/15/2003US20030092261 Substrate processing method
05/15/2003US20030092246 Comprises ceramic holding block and aqueous adhesive composition comprising polyoxyethylene glycol release agent and polyvinyl acetate
05/15/2003US20030089456 Apparatus and method for supplying chemicals in chemical mechanical polishing systems
05/14/2003EP1309424A2 Abrasive pad for cmp
05/14/2003EP1309422A1 Retaining ring for chemical-mechanical polishing head, polishing apparatus, slurry cycle system, and method
05/13/2003US6562719 Solution which contains an oxidizer, phosphoric acid, organic acid, a chemical to form inhibition layer, and water.
05/13/2003US6562185 Wafer based temperature sensors for characterizing chemical mechanical polishing processes
05/13/2003US6562184 Planarization system with multiple polishing pads
05/13/2003US6562182 Method and apparatus for endpointing a chemical-mechanical planarization process
05/13/2003US6561891 Eliminating air pockets under a polished pad
05/13/2003US6561890 For use in chemical mechanical polishing; abrasive fine inorganic powder and reinforcing fine silica powder dispersed in silicone rubber
05/13/2003US6561889 Methods for making reinforced wafer polishing pads and apparatuses implementing the same
05/13/2003US6561884 Web lift system for chemical mechanical planarization
05/13/2003US6561883 Method of polishing
05/13/2003US6561880 Apparatus and method for cleaning the polishing pad of a linear polisher
05/13/2003US6561878 Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads
05/13/2003US6561877 Apparatus and method for retaining moisture on a polishing pad
05/13/2003US6561876 CMP method and semiconductor manufacturing apparatus
05/13/2003US6561875 Apparatus and method for producing substrate with electrical wire thereon
05/13/2003US6561873 Method and apparatus for enhanced CMP using metals having reductive properties
05/13/2003US6561870 Adjustable force applying air platen and spindle system, and methods for using the same
05/13/2003US6561868 System and method for controlling a polishing machine
05/08/2003WO2003038883A1 Polishing fluid and polishing method
05/08/2003WO2003038882A1 Method and pad for polishing wafer
05/08/2003WO2003038862A2 Pads for cmp and polishing substrates
05/08/2003WO2003038858A2 A semiconductor manufacturing apparatus having a built-in inspection apparatus and method therefor
05/08/2003WO2003037567A1 Polishing apparatus
05/08/2003WO2003037566A1 Method and apparatus for controlling cmp pad surface finish
05/08/2003WO2003037565A2 Polishing pads and manufacturing methods
05/08/2003WO2002039485A3 Platen for retaining polishing material
05/08/2003US20030087594 Polishing silicon wafers
05/08/2003US20030087591 Methods of working, especially polishing, inhomogeneous materials
05/08/2003US20030087590 Method of planarization
05/08/2003US20030087586 Chemical mechanical polishing endpoinat detection
05/08/2003US20030087585 Magnetorheological polishing devices and methods
05/08/2003US20030087459 Flexible snapshot in endpoint detection
05/08/2003US20030084998 Semiconductor device fabricating method
05/08/2003US20030084997 Punching apparatus for backing-films of CMP machines and preventive maintenance method for the same
05/08/2003US20030084894 Brazed diamond tools and methods for making the same
05/08/2003US20030084815 Polishing composition and polishing method employing it
05/08/2003US20030084774 Method of fabricating a polishing pad having an optical window
05/07/2003EP1308243A1 Polishing method
05/07/2003EP1308242A1 Processing of inhomogeneous material
05/07/2003EP1308240A1 Dispersion, containing abrasive,by pyrogenesis produced particles containing superparamagnetic domains
05/07/2003EP1307321A2 Method for processing a semiconductor wafer using double-side polishing
05/07/2003EP1307320A1 Apparatus and method for chemical mechanical polishing of substrates
05/07/2003EP1307319A2 Chemical mechanical planarization of metal substrates
05/07/2003EP1090082B1 Cmp slurry containing a solid catalyst
05/06/2003US6559056 Aqueous dispersion for chemical mechanical polishing
05/06/2003US6559054 Methods of treating surfaces of substrates
05/06/2003US6558570 Polishing slurry and method for chemical-mechanical polishing
05/06/2003US6558238 Apparatus and method for reclamation of used polishing slurry
05/06/2003US6558236 Method and apparatus for chemical mechanical polishing
05/06/2003US6558234 Method and apparatus for supporting a polishing pad during chemical-mechanical planarization of microelectronic substrates
05/06/2003US6558232 System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal control
05/06/2003US6558229 Polishing apparatus
05/06/2003US6558228 Method of unloading substrates in chemical-mechanical polishing apparatus
05/06/2003US6558227 Method for polishing a work and an apparatus for polishing a work
05/06/2003US6558226 Polishing apparatus
05/06/2003US6557608 Method for attaching web based polishing materials together on a polishing tool
05/02/2003EP1306415A2 Composition for the chemical mechanical polishing of metal- and metal-dielectric structures with a high selectivity
05/02/2003EP1306163A1 Window member for chemical mechanical polishing and polishing pad
05/02/2003EP1306162A1 Polishing sheet and method of manufacturing the sheet
05/02/2003EP1305139A2 Fluid dispensing fixed abrasive polishing pad
05/01/2003WO2003036705A1 Polishing compound, method for production thereof and polishing method
05/01/2003WO2003035782A1 Boron-containing polishing system and method
05/01/2003WO2003034804A2 Preparation of high performance silica slurry using a centrifuge
05/01/2003WO2002053322A3 System and method for polishing and planarization of semiconductor wafers using reduced surface area polishing pads
05/01/2003WO2002015247A3 Method and apparatus for processing a semiconductor wafer using novel final polishing method
05/01/2003US20030083003 Polishing pads and manufacturing methods
05/01/2003US20030082998 Alkali metal-containing polishing system and method
05/01/2003US20030082997 Method and apparatus for controlling CMP pad surface finish
05/01/2003US20030082996 Determining an endpoint in a polishing process
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