Patents
Sitemap › B24 - Grinding; Polishing › B24B - Machines, devices, or processes for grinding or polishing; Dressing or conditioning of abrading surfaces; Feeding of grinding, polishing, or lapping agents › B24B 37 - Lapping machines or devices; Accessories
Patents for B24B 37 - Lapping machines or devices; Accessories (20,836)
06/2003
06/12/2003US20030109208 Low friction gimbaled substrate holder for CMP apparatus
06/12/2003US20030109200 Constant pH polish and scrub
06/12/2003US20030109199 Seal rings with improved friction and wear properties
06/12/2003US20030109197 Polishing pad with transparent window having reduced window leakage for a chemical mechanical polishing apparatus
06/12/2003US20030109195 Oscillating fixed abrasive CMP system and methods for implementing the same
06/12/2003US20030109194 Technique for noise reduction in a torque-based chemical-mechanical polishing endpoint detection system
06/12/2003US20030109139 Silicon semiconductor wafer, and process for producing a multiplicity of semiconductor wafers
06/12/2003US20030107736 Apparatus for inspecting pattern on semiconductor substrate
06/12/2003US20030106807 Semiconductors; integrated circuits
06/11/2003EP1318306A1 Device for dispensing a liquid
06/11/2003CN1423307A Chemical solution conveying device and method for preparing suspension liquid
06/11/2003CN1422922A Polishing composition of magnetic disk substrate and polishing method using said composition
06/11/2003CN1422728A Grinder and method for grinding workpiece
06/10/2003US6576554 Slurry for CMP, method of forming thereof and method of manufacturing semiconductor device including a CMP process
06/10/2003US6576552 Method for polishing semiconductor device
06/10/2003US6575825 CMP polishing pad
06/10/2003US6575824 Abrasive molding and abrasive disc provided with same
06/10/2003US6575823 Polishing pad and method for in situ delivery of chemical mechanical polishing slurry modifiers and applications thereof
06/10/2003US6575820 Chemical mechanical polishing apparatus
06/10/2003US6575818 Apparatus and method for polishing multiple semiconductor wafers in parallel
06/10/2003US6575816 Dual purpose handoff station for workpiece polishing machine
06/10/2003US6575094 A support of a PS plate which has excellent ability to withstand repeated printing, and in which defects in appearance, such as dirtying and the like, do not occur. Also provided are a method of manufacturing the lithographic
06/05/2003WO2003046893A1 Method and apparatus for treating the surface of a media, such as a magnetic hard disk, while operating, such as during dynamic electrical testing
06/05/2003WO2003045632A1 Fiber optical waveguide embedded into a polishing pad
06/05/2003WO2003045631A1 Polishing pad comprising particles with a solid core and polymeric shell
06/05/2003WO2002100593A3 Polishing pads with polymer filled fibrous web, and methods for fabricating and using same
06/05/2003US20030104959 Chemical solution feeding apparatus and method for preparing slurry
06/05/2003US20030104771 Abraisive cleaning tool for removing contamination
06/05/2003US20030104769 Method and apparatus for controlling a temperature of a polishing pad used in planarizing substrates
06/05/2003US20030104768 Web-format polishing pads and methods for manufacturing and using web-format polishing pads in mechanical and chemical-mechanical planarization of microelectronic substrates
06/05/2003US20030104766 Abrasive machine and method of abrading work piece
06/05/2003US20030104762 Polishing method and electropolishing apparatus
06/05/2003US20030104761 Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing
06/05/2003US20030104760 Optical monitoring in a two-step chemical mechanical polishing process
06/05/2003US20030104699 Slurry for chemical mechanical polishing for copper and method of manufacturing semiconductor device using the slurry
06/05/2003US20030104698 Method of manufacturing semiconductor wafer
06/05/2003US20030104696 Method of manufacturing compound semiconductor wafer
06/05/2003US20030104691 Method for applying uniform pressurized film across wafer
06/05/2003US20030103852 Dispensing apparatus for a fluid
06/04/2003EP1316991A1 Method of polishing semiconductor wafer
06/04/2003EP1316393A1 Abrasive machine and method of abrading a workpiece using a pressure vessel
06/04/2003EP1316111A2 Method of processing a semiconductor wafer
06/04/2003EP1315845A1 Method for producing a coating of fluorescent material
06/04/2003EP1315598A2 Method and apparatus for measuring a polishing condition
06/04/2003EP1259661A4 Pad designs and structures for a versatile materials processing apparatus
06/04/2003EP1084001B1 Wafer loading apparatus
06/04/2003CN1422314A System for the preferential removal of silicon oxide
06/04/2003CN1422313A Method for polishing a memory or rigid disk with an amino acid-containing composition
06/04/2003CN1422226A Package with multiple chambers and valves
06/04/2003CN1422200A Integrated chemical-mechanical polishing
06/03/2003US6572731 Self-siphoning CMP tool design for applications such as copper CMP and low-k dielectric CMP
06/03/2003US6572730 System and method for chemical mechanical planarization
06/03/2003US6572463 Methods for making reinforced wafer polishing pads utilizing direct casting and apparatuses implementing the same
06/03/2003US6572462 Carrier assembly for chemical mechanical planarization systems and method
06/03/2003US6572456 Bathless wafer measurement apparatus and method
06/03/2003US6572453 Multi-fluid polishing process
06/03/2003US6572449 Dewatered CMP polishing compositions and methods for using same
06/03/2003US6572446 Chemical mechanical polishing pad conditioning element with discrete points and compliant membrane
06/03/2003US6572445 Multizone slurry delivery for chemical mechanical polishing tool
06/03/2003US6572443 Method and apparatus for detecting a process endpoint
06/03/2003US6572441 Method of and apparatus for chemical-mechanical polishing
06/03/2003US6572440 Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization
06/03/2003US6572439 Customized polishing pad for selective process performance during chemical mechanical polishing
06/03/2003US6572438 Structure of polishing head of polishing apparatus
05/2003
05/30/2003WO2003043783A1 Method and apparatus for controlling slurry distribution
05/30/2003WO2003043780A2 Method for polishing a substrate surface
05/30/2003WO2002052634A3 Method for characterising and simulating a chemical-mechanical polishing process
05/29/2003US20030100253 In-line oscillating device
05/29/2003US20030100250 Pads for CMP and polishing substrates
05/29/2003US20030100247 Method of supplying slurry and a slurry supply apparatus having a mixing unit at a point of use
05/29/2003US20030100244 Polishing pad comprising particles with a solid core and polymeric shell
05/29/2003US20030100243 Fiber optical sensor embedded into the polishing pad for in-situ, real-time, monitoring of thin films during the chemical mechanical planarization process
05/29/2003US20030100196 Compensating chemical mechanical wafer polishing apparatus and method
05/29/2003US20030100187 Dispersion containing pyrogenically manufactured abrasive particles with superparamagnetic domains
05/29/2003US20030100186 CMP slurry and method of manufacturing semiconductor device
05/29/2003US20030100144 Process for chemically mechanically polishing wafers
05/29/2003US20030098446 Composition for the chemical-mechanical polishing of metal and metal/dielectric structures with high selectivity
05/29/2003US20030098434 Method of fabricating a copper damascene structure
05/29/2003US20030097742 Auxiliary tool for dismantling a guide ring and application method of the same
05/28/2003EP1314194A2 Slurry for use with fixed-abrasive polishing pads in polishing semiconductor device conductive structures that include copper and tungsten and polishing methods
05/28/2003EP1165288B1 A method and apparatus for stabilizing the process temperature during chemical mechanical polishing
05/28/2003CN1420917A Polishing agent and method for producing planar layers
05/27/2003US6570662 Optical techniques for measuring layer thicknesses and other surface characteristics of objects such as semiconductor wafers
05/27/2003US6569771 Carrier head for chemical mechanical polishing
05/27/2003US6569690 Monitoring system for determining progress in a fabrication activity
05/27/2003US6569215 Composition for polishing magnetic disk substrate
05/27/2003US6569004 Polishing pad and method of manufacture
05/27/2003US6568998 Using planarizing medium having relatively hard polishing pad and planarizing liquid including colloidal particles formed from silicon dioxide, manganese oxide, and cerium oxide
05/27/2003US6568996 Polishing agent for processing semiconductor, dispersant used therefor and process for preparing semiconductor device using above polishing agent for processing semiconductor
05/27/2003US6568992 Method for controlling MRE stripe height
05/27/2003US6568991 Method and apparatus for sensing a wafer in a carrier
05/27/2003US6568989 Semiconductor wafer finishing control
05/27/2003US6568988 Chemical mechanical polishing apparatus with stable signals
05/22/2003WO2003043071A1 Grinding pad and method of producing the same
05/22/2003WO2003042310A1 Additive composition, slurry composition including the same, and method of polishing an object using the slurry composition
05/22/2003WO2003041909A1 Method and apparatus for endpoint detection during chemical mechanical polishing
05/22/2003US20030096564 Wafer polishing apparatus
05/22/2003US20030096561 Polishing apparatus and method with belt drive system adapted to extend the lifetime of a refreshing polishing belt provided therein
05/22/2003US20030096559 Methods and apparatuses for analyzing and controlling performance parameters in mechanical and chemical-mechanical planarization of microelectronic substrates
05/22/2003US20030096558 Method and apparatus for treating the surface of a media, such as a magnetic hard disk, while operating. such as during dynamic electrical testing
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