Patents
Sitemap › B24 - Grinding; Polishing › B24B - Machines, devices, or processes for grinding or polishing; Dressing or conditioning of abrading surfaces; Feeding of grinding, polishing, or lapping agents › B24B 37 - Lapping machines or devices; Accessories
Patents for B24B 37 - Lapping machines or devices; Accessories (20,836)
07/2003
07/03/2003US20030124858 Fabrication method for semiconductor integrated circuit device
07/03/2003US20030124855 Method of improving chemical mechanical polish endpoint signals by use of chemical additives
07/03/2003US20030124852 Composition and method for planarizing surfaces
07/03/2003US20030124850 Polishing slurry for use in CMPof SiC series compound, polishing method, and method of manufacturing semiconductor device
07/03/2003US20030123067 Monitoring apparatus for polishing pad and method thereof
07/03/2003US20030121890 Wafer protection method
07/03/2003US20030121797 Electro-chemical plating with reduced thickness and integration with chemical mechanical polisher into a single platform
07/03/2003US20030121774 Workpiece surface influencing device designs for electrochemical mechanical processing and method of using the same
07/03/2003US20030121214 Polishing composition for a substrate for a magnetic disk and polishing method employing it
07/03/2003DE10205280C1 Aqueous dispersion used for chemical-mechanical polishing of oxide surface, preferably silica, contains pyrogenic silica powder doped with alumina from aerosol with specified particle size
07/03/2003DE10204471C1 Aqueous dispersion of cerium oxide-coated doped silica powder, used for chemical-mechanical polishing of semiconductor substrate or coating or in shallow trench insulation, is obtained by mixing doped silica core with cerium salt solution
07/02/2003EP1323798A1 Composition for chemical mechanical polishing of metal and metal-dielectrics structures
07/02/2003EP1322940A1 In-situ method and apparatus for end point detection in chemical mechanical polishing
07/02/2003EP1322450A1 Activated slurry cmp system and methods for implementing the same
07/02/2003EP1322449A1 Web-style pad conditioning system and methods for implementing the same
07/02/2003EP1218466B1 Compositions for and methods of reducing/eliminating scratches and defects in silicon dioxide cmp process
07/02/2003CN1427055A 抛光组合物 The polishing composition
07/01/2003US6586337 Method and apparatus for endpoint detection during chemical mechanical polishing
07/01/2003US6585850 Retaining ring with a three-layer structure
07/01/2003US6585786 Slurry for chemical mechanical polishing
07/01/2003US6585579 Chemical mechanical planarization or polishing pad with sections having varied groove patterns
07/01/2003US6585575 Method and apparatus for releasably attaching a polishing pad to a chemical-mechanical planarization machine
07/01/2003US6585574 Polishing pad with reduced moisture absorption
07/01/2003US6585572 Subaperture chemical mechanical polishing system
07/01/2003US6585570 Method and apparatus for supplying chemical-mechanical polishing slurries
07/01/2003US6585568 Chemical mechanical polishing slurry
07/01/2003US6585567 Short CMP polish method
07/01/2003US6585563 In-situ monitoring of linear substrate polishing operations
07/01/2003US6585562 Method and apparatus for polishing control with signal peak analysis
07/01/2003US6585560 Apparatus and method for feeding slurry
07/01/2003US6585559 Modular controlled platen preparation system and method
06/2003
06/26/2003WO2003051578A1 Method and apparatus for measuring a required characteristic of a workpiece layer
06/26/2003WO2003051577A1 Abrasive article for the deposition and polishing of a conductive material
06/26/2003WO2002075804A3 Planarization of substrates using electrochemical mechanical polishing
06/26/2003US20030119434 Apparatus for holding wafer cassettes in a cassette in a cassette tub during a chemical mechanical polishing process
06/26/2003US20030119433 Air platen for leading edge and trailing edge control
06/26/2003US20030119431 Chemical mechanical polishing apparatus and methods with porous vacuum chuck and perforated carrier film
06/26/2003US20030119429 Apparatus and methods for controlling wafer temperature in chemical mechanical polishing
06/26/2003US20030119426 Methods for planarization of group VIII metal-containing surfaces using a fixed abrasive article
06/26/2003US20030119425 Turning tool for grooving polishing pad, apparatus and method of producing polishing pad using the tool, and polishing pad produced by using the tool
06/26/2003US20030119422 Method for lapping and a lapping apparatus
06/26/2003US20030119321 Methods for planarization of Group VIII metal-containing surfaces using oxidizing gases
06/26/2003US20030119319 Methods for planarization of group VIII metal-containing surfaces using complexing agents
06/26/2003US20030119304 Methods for planarization of metal-containing surfaces using halogens and halide salts
06/26/2003US20030116446 Mixture containing ammonium hydrogen phosphates
06/26/2003US20030116445 Electrolyte with good planarization capability, high removal rate and smooth surface finish for electrochemically controlled copper CMP
06/26/2003US20030115806 A mixture contains colloidal silica, one bicarbonate selected from ammonium bicarbonate, lithium bicarbonate, potassium bicarbonate, sodium bicarbonate and water; surface treatment of semiconductor
06/26/2003US20030115805 Abrasive particles, abrasive articles, and methods of making and using the same
06/25/2003EP1321227A1 A polishing method and device using magnetorheological fluid
06/25/2003EP1320443A1 Polishing pad having an advantageous micro-texture
06/25/2003EP1320441A1 Cmp apparatus and methods to control the tilt of the carrier head, the retaining ring and the pad conditioner
06/25/2003EP1320440A1 Wafer carrier for cmp system
06/25/2003CN1426343A Method and apparatus for chemical-mechanical polishing using upstream and downstream fluid dispensing means
06/24/2003US6583050 Semiconductor wafer with improved flatness, and process for producing the semiconductor wafer
06/24/2003US6582623 CMP composition containing silane modified abrasive particles
06/24/2003US6582283 Polishing pads for chemical mechanical planarization
06/24/2003US6582282 Chemical mechanical polishing with multiple polishing pads
06/24/2003US6582281 Semiconductor processing methods of removing conductive material
06/24/2003US6582279 Apparatus and method for reclaiming a disk substrate for use in a data storage device
06/24/2003US6582277 Method for controlling a process in a multi-zonal apparatus
06/19/2003WO2003050864A2 Method for copper cmp using polymeric complexing agents
06/19/2003US20030114088 Fixed abrasive polishing pad
06/19/2003US20030114087 Method and apparatus for face-up substrate polishing
06/19/2003US20030114086 Chemical-mechanical polisher hardware design
06/19/2003US20030114084 Method and apparatus for polishing substrates
06/19/2003US20030114083 Gel-free colloidal abrasive polishing compositions and associated methods
06/19/2003US20030114079 Rigid plate assembly with polishing pad and method of using
06/19/2003US20030114077 Chemical mechanical polishing (CMP) apparatus with temperature control
06/19/2003US20030114076 Apparatus for chemical mechanical polishing
06/19/2003US20030114004 Methods of producing and polishing semiconductor device and polishing apparatus
06/19/2003US20030113996 Semiconductor production device and production method for semiconductor device
06/19/2003US20030113984 Semiconductor wafer thinning method, and thin semiconductor wafer
06/19/2003US20030113509 Abrasive article for the deposition and polishing of a conductive material
06/19/2003US20030112451 Method and apparatus for measuring a required feature of a layer during a polishing process
06/19/2003US20030110803 Method of manufacturing glass substrate for magnetic disks, and glass substrate for magnetic disks
06/19/2003US20030110711 Polishing composition
06/19/2003US20030110710 Acidic abrasives; for magnetic disks, semiconductors
06/19/2003US20030110709 Method of making amorphous materials and ceramics
06/19/2003US20030110707 Glass/ceramics comprising aluminum oxide; surface treatment
06/19/2003US20030110706 Glass/ceramics comprising aluminum oxide
06/19/2003US20030110609 Subpad support with a releasable subpad securing element and polishing apparatus including the subpad support
06/18/2003EP1318891A1 Polishing pad comprising particulate polymer and crosslinked polymer binder
06/18/2003DE20301322U1 Metal tube with smooth-polished interior surface for medical or laboratory purposes and polishing tool.
06/18/2003DE10159833C1 Verfahren zur Herstellung einer Vielzahl von Halbleiterscheiben A process for producing a plurality of semiconductor wafers
06/18/2003CN1425190A Monitor, method of monitoring, polishing device, and method of manufacturing semiconductor wafer
06/18/2003CN1424746A Silicon semiconductor crystal wafers and manufacturing method for multiple semiconductor crystal wafers
06/17/2003US6580508 Method for monitoring a semiconductor wafer in a chemical mechanical polishing process
06/17/2003US6579800 Chemical mechanical polishing endpoint detection
06/17/2003US6579799 Method and apparatus for controlling chemical interactions during planarization of microelectronic substrates
06/17/2003US6579604 Method of altering and preserving the surface properties of a polishing pad and specific applications therefor
06/17/2003US6579407 Method and apparatus for aligning and setting the axis of rotation of spindles of a multi-body system
06/17/2003US6579160 Holder for polished work and manufacturing method thereof
06/17/2003US6579157 Polishing pad ironing system and method for implementing the same
06/17/2003US6579154 Polishing the surface of the specimen by activating the plasma radicals attached on the surface of the specimen with the friction thereby removing said convex portion of the specimen and planarizing the surface of the specimen
06/17/2003US6579152 Polishing apparatus
06/17/2003US6579151 Retaining ring with active edge-profile control by piezoelectric actuator/sensors
06/17/2003US6579150 Dual detection method for end point in chemical mechanical polishing
06/17/2003US6579148 Polishing apparatus
06/12/2003WO2003049166A1 Method and device for measuring film layer state, polishing device, and method of manufacturing semiconductor device
06/12/2003US20030109209 Polishing pad
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