Patents for B24B 37 - Lapping machines or devices; Accessories (20,836)
07/2003
07/24/2003US20030139123 Carrier head with a substrate detection mechanism for a chemical mechanical polishing system
07/24/2003US20030139122 Polishing pad for a chemical mechanical planarization or polishing (CMP) system
07/24/2003US20030139117 Slurry supply system disposed above the rotating platen of a chemical mechanical polishing apparatus
07/24/2003US20030139116 CMP systems and methods utilizing amine-containing polymers
07/24/2003US20030139115 Method and apparatus for applying downward force on wafer during CMP
07/24/2003US20030139050 Tungsten polishing solution
07/24/2003US20030139048 CMP slurry additive for foreign matter detection
07/24/2003US20030139047 Metal polishing slurry having a static etch inhibitor and method of formulation
07/24/2003US20030136684 Positioning a substrate with a pad partially submersed in the electrolyte, monitoring an electrical signal by a computer
07/24/2003US20030136057 Using metal oxide particles
07/24/2003US20030136055 Abrasive composition containing organic particles for chemical mechanical planarization
07/24/2003US20030135986 Simultaneous planarization of pole piece and coil materials for write head applications
07/23/2003EP1329290A2 Chemical mechanical planarization or polishing pad with sections having varied groove patterns
07/23/2003EP1227912A4 Methods and apparatuses for planarizing microelectronic substrate assemblies
07/22/2003US6596638 Polishing method
07/22/2003US6596395 Balls of single crystal silicon and method of making the same
07/22/2003US6596388 Method of introducing organic and inorganic grafted compounds throughout a thermoplastic polishing pad using a supercritical fluid and applications therefor
07/22/2003US6595841 Apparatus for holding wafer cassettes in a cassette tub during a chemical mechanical polishing process
07/22/2003US6595835 CD refacing system
07/22/2003US6595834 Method of making <200nm light transmitting optical fluoride crystals for transmitting less than 200nm light
07/22/2003US6595833 Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates with metal compound abrasives
07/22/2003US6595832 Chemical mechanical polishing methods
07/22/2003US6595831 Method for polishing workpieces using fixed abrasives
07/22/2003US6595830 Method of controlling chemical mechanical polishing operations to control erosion of insulating materials
07/22/2003US6595829 Slurry pump control system
07/22/2003US6594890 Heating elastic adhesive pad to predetermined temperature to expand air in pores in surface of pad
07/17/2003WO2003058698A1 Polishing pad, process for producing the same, and method of polishing
07/17/2003WO2003057407A1 System for measuring multi-axis pressure gradients in a semiconductor during a polishing process
07/17/2003WO2003057406A1 Apparatus and methods for controlling wafer temperature in chemical mechanical polishing
07/17/2003WO2003057405A1 Grooved rollers for a linear chemical mechanical planarization system
07/17/2003WO2003057404A2 Method and apparatus for applying downward force on wafer during cmp
07/17/2003US20030134582 Oscillating chemical mechanical planarization apparatus
07/17/2003US20030134581 Device for chemical mechanical polishing
07/17/2003US20030134578 Method of backgrinding wafers while leaving backgrinding tape on a chuck
07/17/2003US20030134576 Method for polishing copper on a workpiece surface
07/17/2003US20030134571 Dual wafer-loss sensor and water-resistant sensor holder
07/17/2003US20030134570 Wafer edge polishing system
07/17/2003US20030132417 Method and apparatus for preparing slurry for CMP apparatus
07/17/2003US20030132207 Method for fabricating chemical mechanical polshing pad using laser
07/17/2003US20030132168 Method and apparatus for preparing slurry for CMP apparatus
07/17/2003US20030132103 Electrolytic processing device and substrate processing apparatus
07/17/2003US20030131938 Apparatus for preparing and supplying slurry for CMP apparatus
07/17/2003US20030131902 Vacuum load lock, system including vacuum load lock, and associated methods
07/16/2003EP1327498A2 Polishing apparatus
07/16/2003EP1327258A1 Chemical-mechanical polishing slurry and method
07/16/2003EP1326734A2 Abrasive article comprising a structured diamond-like carbon coating and method of using same to mechanically treat a substrate
07/16/2003EP1326733A1 Method of chemical mechanical polishing
07/16/2003EP1060221B1 Optical polishing formulation
07/16/2003CN1430545A Multilayer retaining ring for chemical mechanical polishing
07/16/2003CN1429930A Solution for chemical machinery brightening of ruthenium
07/16/2003CN1429873A Chemical mechanical polishing slurry for metal and method for preparing metal wire contact plug of semiconductor device by the slurry
07/15/2003US6594542 Method and system for controlling chemical mechanical polishing thickness removal
07/15/2003US6594024 Monitor CMP process using scatterometry
07/15/2003US6593240 Two step chemical mechanical polishing process
07/15/2003US6593238 Method for determining an endpoint and semiconductor wafer
07/15/2003US6592776 Imidazole, benzotriazole, benzimidiazole or benzothiazole film-forming agent and such as uriedopropyltrimethoxysilane; reducing defects
07/15/2003US6592742 The polishing electrolyte for polishing a metal layer comprises one or more surfactants selected from the group of benzopyrans, thioureas and aliphatic ethers; formation of metal layers used in integrated circuits
07/15/2003US6592708 Filter apparatus and method therefor
07/15/2003US6592443 Method and apparatus for forming and using planarizing pads for mechanical and chemical-mechanical planarization of microelectronic substrates
07/15/2003US6592439 Platen for retaining polishing material
07/15/2003US6592438 CMP platen with patterned surface
07/15/2003US6592437 Active gimbal ring with internal gel and methods for making same
07/15/2003US6592434 Wafer carrier and method of material removal from a semiconductor wafer
07/15/2003US6592433 Method for defect reduction
07/10/2003WO2003056620A1 Methods for planarization of group viii metal-containing surfaces using complexing agents
07/10/2003WO2003055958A1 Abrasive composition containing organic particles for chemical mechanical planarization
07/10/2003US20030129931 Window member for chemical mechanical polishing and polishing pad
07/10/2003US20030129924 Oscillating arm fixture for lapping machines
07/10/2003US20030127135 Fluid diverter apparatus and method
07/10/2003US20030126804 Including a metal oxide where a portion of the portion of this metal oxide forms a distinct crystalline ceramic phase crystallized from the amorphous aluminum oxide/zirconium oxide glass; abrasives; bulk articles
07/10/2003US20030126802 Ceramic materials, abrasive particles, abrasive articles, and methods of making and using the same
07/10/2003US20030126801 Homogeneous fixed abrasive polishing pad
07/09/2003EP1326267A1 Abrasive cloth, polishing device and method for manufacturing semiconductor device
07/09/2003EP1325793A2 Drainage structure in polishing plant
07/09/2003EP1325514A2 Method and apparatus for processing a semiconductor wafer using novel final polishing method
07/09/2003EP1324859A1 Polishing pad with built-in optical sensor
07/09/2003EP1324858A1 Polishing pad comprising a filled translucent region
07/09/2003EP0909311B1 Post clean treatment
07/09/2003CN2559450Y Adjustable cycloidal motion path type plane lapping machine
07/09/2003CN1428827A Polishing method for base copper-layer
07/09/2003CN1428388A Composition for chemical mechanical polishing of metal and metal/electric medium structure
07/08/2003US6589872 Use of low-high slurry flow to eliminate copper line damages
07/08/2003US6589800 Method of estimation of wafer-to-wafer thickness
07/08/2003US6589105 Pad tensioning method and system in a bi-directional linear polisher
07/08/2003US6589102 Surface polishing method and apparatus
07/08/2003US6589101 Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates with metal compound abrasives
07/08/2003US6589100 Rare earth salt/oxidizer-based CMP method
07/08/2003US6589099 Method for chemical mechanical polishing (CMP) with altering the concentration of oxidizing agent in slurry
07/03/2003WO2003054944A1 Novel use of alkaline earth metal salts
07/03/2003WO2003054097A1 Polishing pad
07/03/2003WO2003053633A1 Air platen for leading edge and trailing edge control
07/03/2003WO2003011783A3 Method of making amorphous materials and ceramics
07/03/2003US20030124963 Carrier head with a non-stick membrane
07/03/2003US20030124959 Method for copper CMP using polymeric complexing agents
07/03/2003US20030124957 Substrate polishing apparatus
07/03/2003US20030124956 Polishing pad with transparent window
07/03/2003US20030124867 Solution for ruthenium chemical mechanical planarization
07/03/2003US20030124862 Method of polishing copper layer of substrate
07/03/2003US20030124861 Method for manufacturing metal line contact plug semiconductor device
07/03/2003US20030124860 Method for forming metal lines of semiconductor device