Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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07/24/2003 | US20030139123 Carrier head with a substrate detection mechanism for a chemical mechanical polishing system |
07/24/2003 | US20030139122 Polishing pad for a chemical mechanical planarization or polishing (CMP) system |
07/24/2003 | US20030139117 Slurry supply system disposed above the rotating platen of a chemical mechanical polishing apparatus |
07/24/2003 | US20030139116 CMP systems and methods utilizing amine-containing polymers |
07/24/2003 | US20030139115 Method and apparatus for applying downward force on wafer during CMP |
07/24/2003 | US20030139050 Tungsten polishing solution |
07/24/2003 | US20030139048 CMP slurry additive for foreign matter detection |
07/24/2003 | US20030139047 Metal polishing slurry having a static etch inhibitor and method of formulation |
07/24/2003 | US20030136684 Positioning a substrate with a pad partially submersed in the electrolyte, monitoring an electrical signal by a computer |
07/24/2003 | US20030136057 Using metal oxide particles |
07/24/2003 | US20030136055 Abrasive composition containing organic particles for chemical mechanical planarization |
07/24/2003 | US20030135986 Simultaneous planarization of pole piece and coil materials for write head applications |
07/23/2003 | EP1329290A2 Chemical mechanical planarization or polishing pad with sections having varied groove patterns |
07/23/2003 | EP1227912A4 Methods and apparatuses for planarizing microelectronic substrate assemblies |
07/22/2003 | US6596638 Polishing method |
07/22/2003 | US6596395 Balls of single crystal silicon and method of making the same |
07/22/2003 | US6596388 Method of introducing organic and inorganic grafted compounds throughout a thermoplastic polishing pad using a supercritical fluid and applications therefor |
07/22/2003 | US6595841 Apparatus for holding wafer cassettes in a cassette tub during a chemical mechanical polishing process |
07/22/2003 | US6595835 CD refacing system |
07/22/2003 | US6595834 Method of making <200nm light transmitting optical fluoride crystals for transmitting less than 200nm light |
07/22/2003 | US6595833 Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates with metal compound abrasives |
07/22/2003 | US6595832 Chemical mechanical polishing methods |
07/22/2003 | US6595831 Method for polishing workpieces using fixed abrasives |
07/22/2003 | US6595830 Method of controlling chemical mechanical polishing operations to control erosion of insulating materials |
07/22/2003 | US6595829 Slurry pump control system |
07/22/2003 | US6594890 Heating elastic adhesive pad to predetermined temperature to expand air in pores in surface of pad |
07/17/2003 | WO2003058698A1 Polishing pad, process for producing the same, and method of polishing |
07/17/2003 | WO2003057407A1 System for measuring multi-axis pressure gradients in a semiconductor during a polishing process |
07/17/2003 | WO2003057406A1 Apparatus and methods for controlling wafer temperature in chemical mechanical polishing |
07/17/2003 | WO2003057405A1 Grooved rollers for a linear chemical mechanical planarization system |
07/17/2003 | WO2003057404A2 Method and apparatus for applying downward force on wafer during cmp |
07/17/2003 | US20030134582 Oscillating chemical mechanical planarization apparatus |
07/17/2003 | US20030134581 Device for chemical mechanical polishing |
07/17/2003 | US20030134578 Method of backgrinding wafers while leaving backgrinding tape on a chuck |
07/17/2003 | US20030134576 Method for polishing copper on a workpiece surface |
07/17/2003 | US20030134571 Dual wafer-loss sensor and water-resistant sensor holder |
07/17/2003 | US20030134570 Wafer edge polishing system |
07/17/2003 | US20030132417 Method and apparatus for preparing slurry for CMP apparatus |
07/17/2003 | US20030132207 Method for fabricating chemical mechanical polshing pad using laser |
07/17/2003 | US20030132168 Method and apparatus for preparing slurry for CMP apparatus |
07/17/2003 | US20030132103 Electrolytic processing device and substrate processing apparatus |
07/17/2003 | US20030131938 Apparatus for preparing and supplying slurry for CMP apparatus |
07/17/2003 | US20030131902 Vacuum load lock, system including vacuum load lock, and associated methods |
07/16/2003 | EP1327498A2 Polishing apparatus |
07/16/2003 | EP1327258A1 Chemical-mechanical polishing slurry and method |
07/16/2003 | EP1326734A2 Abrasive article comprising a structured diamond-like carbon coating and method of using same to mechanically treat a substrate |
07/16/2003 | EP1326733A1 Method of chemical mechanical polishing |
07/16/2003 | EP1060221B1 Optical polishing formulation |
07/16/2003 | CN1430545A Multilayer retaining ring for chemical mechanical polishing |
07/16/2003 | CN1429930A Solution for chemical machinery brightening of ruthenium |
07/16/2003 | CN1429873A Chemical mechanical polishing slurry for metal and method for preparing metal wire contact plug of semiconductor device by the slurry |
07/15/2003 | US6594542 Method and system for controlling chemical mechanical polishing thickness removal |
07/15/2003 | US6594024 Monitor CMP process using scatterometry |
07/15/2003 | US6593240 Two step chemical mechanical polishing process |
07/15/2003 | US6593238 Method for determining an endpoint and semiconductor wafer |
07/15/2003 | US6592776 Imidazole, benzotriazole, benzimidiazole or benzothiazole film-forming agent and such as uriedopropyltrimethoxysilane; reducing defects |
07/15/2003 | US6592742 The polishing electrolyte for polishing a metal layer comprises one or more surfactants selected from the group of benzopyrans, thioureas and aliphatic ethers; formation of metal layers used in integrated circuits |
07/15/2003 | US6592708 Filter apparatus and method therefor |
07/15/2003 | US6592443 Method and apparatus for forming and using planarizing pads for mechanical and chemical-mechanical planarization of microelectronic substrates |
07/15/2003 | US6592439 Platen for retaining polishing material |
07/15/2003 | US6592438 CMP platen with patterned surface |
07/15/2003 | US6592437 Active gimbal ring with internal gel and methods for making same |
07/15/2003 | US6592434 Wafer carrier and method of material removal from a semiconductor wafer |
07/15/2003 | US6592433 Method for defect reduction |
07/10/2003 | WO2003056620A1 Methods for planarization of group viii metal-containing surfaces using complexing agents |
07/10/2003 | WO2003055958A1 Abrasive composition containing organic particles for chemical mechanical planarization |
07/10/2003 | US20030129931 Window member for chemical mechanical polishing and polishing pad |
07/10/2003 | US20030129924 Oscillating arm fixture for lapping machines |
07/10/2003 | US20030127135 Fluid diverter apparatus and method |
07/10/2003 | US20030126804 Including a metal oxide where a portion of the portion of this metal oxide forms a distinct crystalline ceramic phase crystallized from the amorphous aluminum oxide/zirconium oxide glass; abrasives; bulk articles |
07/10/2003 | US20030126802 Ceramic materials, abrasive particles, abrasive articles, and methods of making and using the same |
07/10/2003 | US20030126801 Homogeneous fixed abrasive polishing pad |
07/09/2003 | EP1326267A1 Abrasive cloth, polishing device and method for manufacturing semiconductor device |
07/09/2003 | EP1325793A2 Drainage structure in polishing plant |
07/09/2003 | EP1325514A2 Method and apparatus for processing a semiconductor wafer using novel final polishing method |
07/09/2003 | EP1324859A1 Polishing pad with built-in optical sensor |
07/09/2003 | EP1324858A1 Polishing pad comprising a filled translucent region |
07/09/2003 | EP0909311B1 Post clean treatment |
07/09/2003 | CN2559450Y Adjustable cycloidal motion path type plane lapping machine |
07/09/2003 | CN1428827A Polishing method for base copper-layer |
07/09/2003 | CN1428388A Composition for chemical mechanical polishing of metal and metal/electric medium structure |
07/08/2003 | US6589872 Use of low-high slurry flow to eliminate copper line damages |
07/08/2003 | US6589800 Method of estimation of wafer-to-wafer thickness |
07/08/2003 | US6589105 Pad tensioning method and system in a bi-directional linear polisher |
07/08/2003 | US6589102 Surface polishing method and apparatus |
07/08/2003 | US6589101 Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates with metal compound abrasives |
07/08/2003 | US6589100 Rare earth salt/oxidizer-based CMP method |
07/08/2003 | US6589099 Method for chemical mechanical polishing (CMP) with altering the concentration of oxidizing agent in slurry |
07/03/2003 | WO2003054944A1 Novel use of alkaline earth metal salts |
07/03/2003 | WO2003054097A1 Polishing pad |
07/03/2003 | WO2003053633A1 Air platen for leading edge and trailing edge control |
07/03/2003 | WO2003011783A3 Method of making amorphous materials and ceramics |
07/03/2003 | US20030124963 Carrier head with a non-stick membrane |
07/03/2003 | US20030124959 Method for copper CMP using polymeric complexing agents |
07/03/2003 | US20030124957 Substrate polishing apparatus |
07/03/2003 | US20030124956 Polishing pad with transparent window |
07/03/2003 | US20030124867 Solution for ruthenium chemical mechanical planarization |
07/03/2003 | US20030124862 Method of polishing copper layer of substrate |
07/03/2003 | US20030124861 Method for manufacturing metal line contact plug semiconductor device |
07/03/2003 | US20030124860 Method for forming metal lines of semiconductor device |