Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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08/19/2003 | US6607422 Endpoint detection with light beams of different wavelengths |
08/14/2003 | WO2003067641A1 Polishing pad, polishing device, and polishing method |
08/14/2003 | WO2003066284A1 Method and apparatus for chemical mechanical polishing with an eddy current monitoring system |
08/14/2003 | WO2003066282A2 Systems and methods for characterizing a polishing process |
08/14/2003 | WO2003011999A3 Abrasive particles, abrasive articles, and methods of making and using the same |
08/14/2003 | US20030153255 Abrasive material |
08/14/2003 | US20030153253 Polishing cloth |
08/14/2003 | US20030153252 Methods for conditioning surfaces of polishing pads after chemical-mechanical polishing, and apparatuses for conditioning surfaces of polishing pads |
08/14/2003 | US20030153250 Subaperture chemical mechanical planarization with polishing pad conditioning |
08/14/2003 | US20030153249 Surface roughening treatment method of object being treated, and apparatus therefor |
08/14/2003 | US20030153246 In-situ endpoint detect for non-transparent polishing member |
08/14/2003 | US20030153245 Advanced chemical mechanical polishing system with smart endpoint detection |
08/14/2003 | US20030153183 Process for chemical mechanical polishing of semiconductor substrate and aqueous dispersion for chemical mechanical polishing |
08/14/2003 | US20030150838 Powder of pyrogenically produced silicon dioxide doped with 0.01 and 3 wt. % aluminium oxide having an average particle diameter of not more than 0.1 mu m. |
08/14/2003 | US20030150558 Equipment coating |
08/13/2003 | EP1335011A1 Cerium based abrasive material, method of quality examination therefor and method for production thereof |
08/13/2003 | EP1335009A1 Dispersion for chemical mechanical polishing |
08/13/2003 | EP0933166B1 Abrasive and method for polishing semiconductor substrate |
08/13/2003 | CN2565587Y 冲子成型研磨器 Punch Grinder |
08/13/2003 | CN2565586Y Punch grinder |
08/13/2003 | CN1436225A Polishing composition for metal CMP |
08/13/2003 | CN1436113A Device and method for measuring amount of grinding in magnetic head producing process |
08/13/2003 | CN1436112A Magnetic head grinding device and method |
08/13/2003 | CN1117652C Abrasive processing apparatus and method for employing encoded abrasive product |
08/12/2003 | USRE38215 Polishing apparatus |
08/12/2003 | US6605537 Polishing of metal substrates |
08/12/2003 | US6604988 Polishing apparatus and method with belt drive system adapted to extend the lifetime of a refreshing polishing belt provided therein |
08/12/2003 | US6604985 Abrasive article having a window system for polishing wafers, and methods |
08/12/2003 | US6604849 Slurry dilution system with an ultrasonic vibrator capable of in-situ adjustment of slurry concentration |
08/07/2003 | WO2003065432A1 Electrolytic processing apparatus and substrate processing apparatus and method |
08/07/2003 | WO2003064108A1 Polishing head, polishing device and polishing method |
08/07/2003 | WO2002045127A3 Methods of endpoint detection for wafer planarization |
08/07/2003 | US20030148722 Froth and method of producing froth |
08/07/2003 | US20030148721 Polishing pads useful for endpoint detection in chemical mechanical polishing |
08/07/2003 | US20030148718 Polishing head and chemical mechanical polishing apparatus including the same |
08/07/2003 | US20030148715 Apparatus for finishing a magnetic slider |
08/07/2003 | US20030148714 Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device |
08/07/2003 | US20030148712 Multiple step CMP polishing |
08/07/2003 | US20030148711 Method of making optical fluoride laser crystal components |
08/07/2003 | US20030148706 Method and apparatus of eddy current monitoring for chemical mechanical polishing |
08/07/2003 | US20030148616 A CMP oxide slurry includes an aqueous solution containing abrasive particles and two or more different passivation agents. Preferably, the aqueous solution is made up of deionized water, and the abrasive particles are a metal oxide |
08/07/2003 | US20030148614 Polyelectrolyte dispensing polishing pad, production thereof and method of polishing a substrate |
08/07/2003 | US20030146482 Layered circuit boards and methods of production thereof |
08/07/2003 | US20030146404 Using fluorinated adjuvant |
08/07/2003 | US20030145525 Glass-ceramics |
08/06/2003 | EP1333477A2 Use of fluorinated additives in the etching or polishing of integrated circuits |
08/06/2003 | EP1333476A2 Process for chemical mechanical polishing of semiconductor substrate and aqueous dispersion for chemical mechanical polishing |
08/06/2003 | EP1333080A2 Aqueous disperson containing silicon dioxide powder, coated with cerium oxide, process for its preparation and its use |
08/06/2003 | EP1332515A2 Infrared end-point system for cmp |
08/06/2003 | EP1332385A1 Method and device for polishing optical fiber connectors |
08/06/2003 | CN1434882A Pad designs and structures for universal material working equipment |
08/06/2003 | CN1434846A Polishing composition |
08/06/2003 | CN1434491A Chemical mechanical polishing method for semiconductor substrate and water-dispersion solution for chemical mechanical polishing |
08/06/2003 | CN1434489A Semicondoctor wafer with improved partial planeness and making method thereof |
08/05/2003 | US6602724 Chemical mechanical polishing of a metal layer with polishing rate monitoring |
08/05/2003 | US6602439 Controlled particle size |
08/05/2003 | US6602436 Chemical mechanical planarization of metal substrates |
08/05/2003 | US6602430 Methods for finishing microelectronic device packages |
08/05/2003 | US6602380 Method and apparatus for releasably attaching a polishing pad to a chemical-mechanical planarization machine |
08/05/2003 | US6602123 Finishing pad design for multidirectional use |
08/05/2003 | US6602121 Pad support apparatus for chemical mechanical planarization |
08/05/2003 | US6602117 Slurry for use with fixed-abrasive polishing pads in polishing semiconductor device conductive structures that include copper and tungsten and polishing methods |
08/05/2003 | US6602116 Chemical mechanical polishing silicon wafers using annular pads having abrasive particles; integrated circuits; smoothness |
08/05/2003 | US6602114 Multilayer retaining ring for chemical mechanical polishing |
08/05/2003 | US6602112 Dissolution of metal particles produced by polishing |
08/05/2003 | US6602110 Automated polishing apparatus and method of polishing |
08/05/2003 | US6602108 Modular controlled platen preparation system and method |
07/31/2003 | WO2003062338A1 Cmp systems and methods utilizing amine-containing polymers |
07/31/2003 | WO2003062337A1 Tungsten polishing solution |
07/31/2003 | WO2003061905A1 Process control in electro-chemical mechanical polishing |
07/31/2003 | WO2003061904A1 Chemical mechanical polishing apparatus and method having a retaining ring with a contoured surface for slurry distribution |
07/31/2003 | US20030143937 Contamination prevention system and method |
07/31/2003 | US20030143933 Apparatus for polishing a wafer |
07/31/2003 | US20030143930 Apparatus and method for front side chemical mechanical planarization (cmp) of semiconductor workpieces |
07/31/2003 | US20030143927 Planarizing machines and methods for dispensing planarizing solutions in the processing of microelectronic workpieces |
07/31/2003 | US20030143925 Polishing pad window for a chemical-mechanical polishing tool |
07/31/2003 | US20030143924 Method and system for slurry usage reduction in chemical mechanical polishing |
07/31/2003 | US20030143848 Chemical mechanical polishing slurry and method for using same |
07/31/2003 | US20030140491 Device and method for measuring amount of grinding in magnetic head producing process |
07/30/2003 | EP1330841A1 Method for assembling planar workpieces |
07/30/2003 | EP1073877B1 Endpoint detection in chemical mechanical polishing (cmp) by substrate holder elevation detection |
07/30/2003 | CN1116372C Polishing agent for semiconductor substrates |
07/29/2003 | US6599837 Chemical mechanical polishing composition and method of polishing metal layers using same |
07/29/2003 | US6599836 Planarizing solutions, planarizing machines and methods for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies |
07/29/2003 | US6599765 Apparatus and method for providing a signal port in a polishing pad for optical endpoint detection |
07/29/2003 | US6599175 Apparatus for distributing a fluid through a polishing pad |
07/29/2003 | US6599174 Eliminating dishing non-uniformity of a process layer |
07/29/2003 | US6599173 Method to prevent leaving residual metal in CMP process of metal interconnect |
07/29/2003 | US6599170 Method and apparatus for polishing, and lapping jig |
07/24/2003 | WO2003060980A2 Methods for planarization of group viii metal-containing surfaces using oxidizing gases |
07/24/2003 | WO2003060974A1 Semiconductor wafer protective member and semiconductor wafer grinding method |
07/24/2003 | WO2003060972A1 Ic chip manufacturing method |
07/24/2003 | WO2003060962A2 Electrolyte composition and treatment for electrolytic chemical mechanical polishing |
07/24/2003 | WO2003060028A1 Methods for planarization of metal-containing surfaces using halogens and halide salts |
07/24/2003 | WO2003059576A1 Abrasive grain burying device for lapping device |
07/24/2003 | WO2003059573A1 Polishing method and polishing device |
07/24/2003 | WO2003059571A1 Methods for planarization of group viii metal-containing surfaces using a fixed abrasive article |
07/24/2003 | WO2003017330A3 Forming a semiconductor structure using a combination of planarizing methods and electropolishing |
07/24/2003 | US20030139127 Capsulated abrasive composition and polishing pad using the same |
07/24/2003 | US20030139124 Grooved rollers for a linear chemical mechanical planarization system |