Patents for B24B 37 - Lapping machines or devices; Accessories (20,836)
08/2003
08/19/2003US6607422 Endpoint detection with light beams of different wavelengths
08/14/2003WO2003067641A1 Polishing pad, polishing device, and polishing method
08/14/2003WO2003066284A1 Method and apparatus for chemical mechanical polishing with an eddy current monitoring system
08/14/2003WO2003066282A2 Systems and methods for characterizing a polishing process
08/14/2003WO2003011999A3 Abrasive particles, abrasive articles, and methods of making and using the same
08/14/2003US20030153255 Abrasive material
08/14/2003US20030153253 Polishing cloth
08/14/2003US20030153252 Methods for conditioning surfaces of polishing pads after chemical-mechanical polishing, and apparatuses for conditioning surfaces of polishing pads
08/14/2003US20030153250 Subaperture chemical mechanical planarization with polishing pad conditioning
08/14/2003US20030153249 Surface roughening treatment method of object being treated, and apparatus therefor
08/14/2003US20030153246 In-situ endpoint detect for non-transparent polishing member
08/14/2003US20030153245 Advanced chemical mechanical polishing system with smart endpoint detection
08/14/2003US20030153183 Process for chemical mechanical polishing of semiconductor substrate and aqueous dispersion for chemical mechanical polishing
08/14/2003US20030150838 Powder of pyrogenically produced silicon dioxide doped with 0.01 and 3 wt. % aluminium oxide having an average particle diameter of not more than 0.1 mu m.
08/14/2003US20030150558 Equipment coating
08/13/2003EP1335011A1 Cerium based abrasive material, method of quality examination therefor and method for production thereof
08/13/2003EP1335009A1 Dispersion for chemical mechanical polishing
08/13/2003EP0933166B1 Abrasive and method for polishing semiconductor substrate
08/13/2003CN2565587Y 冲子成型研磨器 Punch Grinder
08/13/2003CN2565586Y Punch grinder
08/13/2003CN1436225A Polishing composition for metal CMP
08/13/2003CN1436113A Device and method for measuring amount of grinding in magnetic head producing process
08/13/2003CN1436112A Magnetic head grinding device and method
08/13/2003CN1117652C Abrasive processing apparatus and method for employing encoded abrasive product
08/12/2003USRE38215 Polishing apparatus
08/12/2003US6605537 Polishing of metal substrates
08/12/2003US6604988 Polishing apparatus and method with belt drive system adapted to extend the lifetime of a refreshing polishing belt provided therein
08/12/2003US6604985 Abrasive article having a window system for polishing wafers, and methods
08/12/2003US6604849 Slurry dilution system with an ultrasonic vibrator capable of in-situ adjustment of slurry concentration
08/07/2003WO2003065432A1 Electrolytic processing apparatus and substrate processing apparatus and method
08/07/2003WO2003064108A1 Polishing head, polishing device and polishing method
08/07/2003WO2002045127A3 Methods of endpoint detection for wafer planarization
08/07/2003US20030148722 Froth and method of producing froth
08/07/2003US20030148721 Polishing pads useful for endpoint detection in chemical mechanical polishing
08/07/2003US20030148718 Polishing head and chemical mechanical polishing apparatus including the same
08/07/2003US20030148715 Apparatus for finishing a magnetic slider
08/07/2003US20030148714 Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device
08/07/2003US20030148712 Multiple step CMP polishing
08/07/2003US20030148711 Method of making optical fluoride laser crystal components
08/07/2003US20030148706 Method and apparatus of eddy current monitoring for chemical mechanical polishing
08/07/2003US20030148616 A CMP oxide slurry includes an aqueous solution containing abrasive particles and two or more different passivation agents. Preferably, the aqueous solution is made up of deionized water, and the abrasive particles are a metal oxide
08/07/2003US20030148614 Polyelectrolyte dispensing polishing pad, production thereof and method of polishing a substrate
08/07/2003US20030146482 Layered circuit boards and methods of production thereof
08/07/2003US20030146404 Using fluorinated adjuvant
08/07/2003US20030145525 Glass-ceramics
08/06/2003EP1333477A2 Use of fluorinated additives in the etching or polishing of integrated circuits
08/06/2003EP1333476A2 Process for chemical mechanical polishing of semiconductor substrate and aqueous dispersion for chemical mechanical polishing
08/06/2003EP1333080A2 Aqueous disperson containing silicon dioxide powder, coated with cerium oxide, process for its preparation and its use
08/06/2003EP1332515A2 Infrared end-point system for cmp
08/06/2003EP1332385A1 Method and device for polishing optical fiber connectors
08/06/2003CN1434882A Pad designs and structures for universal material working equipment
08/06/2003CN1434846A Polishing composition
08/06/2003CN1434491A Chemical mechanical polishing method for semiconductor substrate and water-dispersion solution for chemical mechanical polishing
08/06/2003CN1434489A Semicondoctor wafer with improved partial planeness and making method thereof
08/05/2003US6602724 Chemical mechanical polishing of a metal layer with polishing rate monitoring
08/05/2003US6602439 Controlled particle size
08/05/2003US6602436 Chemical mechanical planarization of metal substrates
08/05/2003US6602430 Methods for finishing microelectronic device packages
08/05/2003US6602380 Method and apparatus for releasably attaching a polishing pad to a chemical-mechanical planarization machine
08/05/2003US6602123 Finishing pad design for multidirectional use
08/05/2003US6602121 Pad support apparatus for chemical mechanical planarization
08/05/2003US6602117 Slurry for use with fixed-abrasive polishing pads in polishing semiconductor device conductive structures that include copper and tungsten and polishing methods
08/05/2003US6602116 Chemical mechanical polishing silicon wafers using annular pads having abrasive particles; integrated circuits; smoothness
08/05/2003US6602114 Multilayer retaining ring for chemical mechanical polishing
08/05/2003US6602112 Dissolution of metal particles produced by polishing
08/05/2003US6602110 Automated polishing apparatus and method of polishing
08/05/2003US6602108 Modular controlled platen preparation system and method
07/2003
07/31/2003WO2003062338A1 Cmp systems and methods utilizing amine-containing polymers
07/31/2003WO2003062337A1 Tungsten polishing solution
07/31/2003WO2003061905A1 Process control in electro-chemical mechanical polishing
07/31/2003WO2003061904A1 Chemical mechanical polishing apparatus and method having a retaining ring with a contoured surface for slurry distribution
07/31/2003US20030143937 Contamination prevention system and method
07/31/2003US20030143933 Apparatus for polishing a wafer
07/31/2003US20030143930 Apparatus and method for front side chemical mechanical planarization (cmp) of semiconductor workpieces
07/31/2003US20030143927 Planarizing machines and methods for dispensing planarizing solutions in the processing of microelectronic workpieces
07/31/2003US20030143925 Polishing pad window for a chemical-mechanical polishing tool
07/31/2003US20030143924 Method and system for slurry usage reduction in chemical mechanical polishing
07/31/2003US20030143848 Chemical mechanical polishing slurry and method for using same
07/31/2003US20030140491 Device and method for measuring amount of grinding in magnetic head producing process
07/30/2003EP1330841A1 Method for assembling planar workpieces
07/30/2003EP1073877B1 Endpoint detection in chemical mechanical polishing (cmp) by substrate holder elevation detection
07/30/2003CN1116372C Polishing agent for semiconductor substrates
07/29/2003US6599837 Chemical mechanical polishing composition and method of polishing metal layers using same
07/29/2003US6599836 Planarizing solutions, planarizing machines and methods for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies
07/29/2003US6599765 Apparatus and method for providing a signal port in a polishing pad for optical endpoint detection
07/29/2003US6599175 Apparatus for distributing a fluid through a polishing pad
07/29/2003US6599174 Eliminating dishing non-uniformity of a process layer
07/29/2003US6599173 Method to prevent leaving residual metal in CMP process of metal interconnect
07/29/2003US6599170 Method and apparatus for polishing, and lapping jig
07/24/2003WO2003060980A2 Methods for planarization of group viii metal-containing surfaces using oxidizing gases
07/24/2003WO2003060974A1 Semiconductor wafer protective member and semiconductor wafer grinding method
07/24/2003WO2003060972A1 Ic chip manufacturing method
07/24/2003WO2003060962A2 Electrolyte composition and treatment for electrolytic chemical mechanical polishing
07/24/2003WO2003060028A1 Methods for planarization of metal-containing surfaces using halogens and halide salts
07/24/2003WO2003059576A1 Abrasive grain burying device for lapping device
07/24/2003WO2003059573A1 Polishing method and polishing device
07/24/2003WO2003059571A1 Methods for planarization of group viii metal-containing surfaces using a fixed abrasive article
07/24/2003WO2003017330A3 Forming a semiconductor structure using a combination of planarizing methods and electropolishing
07/24/2003US20030139127 Capsulated abrasive composition and polishing pad using the same
07/24/2003US20030139124 Grooved rollers for a linear chemical mechanical planarization system