Patents
Sitemap › B24 - Grinding; Polishing › B24B - Machines, devices, or processes for grinding or polishing; Dressing or conditioning of abrading surfaces; Feeding of grinding, polishing, or lapping agents › B24B 37 - Lapping machines or devices; Accessories
Patents for B24B 37 - Lapping machines or devices; Accessories (20,836)
09/2003
09/09/2003US6615817 Recycling system of wire saw abrasive grain slurry and centrifugal separators therefor
09/04/2003WO2003073481A2 Feedforward and feedback control of semiconductor fabrication process using secondary electron microscopy and a focused ion beam system
09/04/2003WO2003073448A2 Control of semiconductor fabrication process using scanning electron microscopy and a focused ion beam device
09/04/2003WO2003072683A1 Slurry and method for chemical mechanical polishing of metal structures including refractory metal based barrier layers
09/04/2003WO2003072672A1 Method and composition for polishing a substrate
09/04/2003WO2003072671A1 Cmp formulations for the use on nickel-phosphorus alloys
09/04/2003WO2003072670A1 Improved chemical-mechanical polishing slurry for polishing of copper or silver films
09/04/2003WO2003072669A2 Polishing composition
09/04/2003WO2003072306A1 Polishing apparatus and method for detecting foreign matter on polishing surface
09/04/2003WO2003072305A1 Method and system for controlling the chemical mechanical polishing of substrates by calculating an overpolishing time and/or a polishing time of a final polishing step
09/04/2003WO2002059943A3 Chemical mechanical polishing of copper-oxide damascene structures
09/04/2003US20030166383 Polishing apparatus
09/04/2003US20030166381 Chemical mechanical polishing slurry and chemical mechanical polishing method using the same
09/04/2003US20030166380 Chemical-mechanical polishing device, damascene wiring forming device, and dama-scene wiring forming method
09/04/2003US20030166378 Slurry flow rate monitoring in chemical-mechanical polisher using pressure transducer
09/04/2003US20030166339 CMP system for metal deposition
09/04/2003US20030166338 CMP slurry for metal and method for manufacturing metal line contact plug of semiconductor device using the same
09/04/2003US20030166337 Chemical mechanical polishing systems and methods for their use
09/04/2003US20030165412 Slurry for CMP, method of forming thereof and method of manufacturing semiconductor device including a CMP process
09/03/2003EP1341223A1 Polishing progress monitoring method and device thereof, polishing device, semiconductor device production method, and semiconductor device
09/03/2003EP1340588A1 Abrasive cloth and polishing method
09/03/2003EP1340248A2 Method for determining an endpoint and semiconductor wafer
09/03/2003EP1339529A1 Methods, apparatus and slurries for chemical mechanical planarization
09/03/2003EP0930978B1 Composition and method for polishing a composite
09/03/2003CN1440449A Silane containing polishing composition for CMP
09/03/2003CN1440321A Pneumatic diaphragm head having independent retaining ring and multi-region pressure control, and method to use the same
09/02/2003US6614529 In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical polishing planarization
09/02/2003US6613675 Methods, apparatuses, and substrate assembly structures for fabricating microelectronic components using mechanical and chemical-mechanical planarization processes
09/02/2003US6613594 Surface plasmon resonance-based endpoint detection for chemical mechanical planarization (CMP)
09/02/2003US6613591 Method of estimating post-polishing waviness characteristics of a semiconductor wafer
09/02/2003US6613200 Electro-chemical plating with reduced thickness and integration with chemical mechanical polisher into a single platform
09/02/2003US6612917 Abrasive article suitable for modifying a semiconductor wafer
09/02/2003US6612916 Article suitable for chemical mechanical planarization processes
09/02/2003US6612915 Work piece carrier head for plating and polishing
09/02/2003US6612914 Platen with lateral web tensioner
09/02/2003US6612912 Method for fabricating semiconductor device and processing apparatus for processing semiconductor device
09/02/2003US6612911 Alkali metal-containing polishing system and method
09/02/2003US6612908 Method for lapping and a lapping apparatus
09/02/2003US6612905 Silicon wafer polishing holder and method of use thereof
09/02/2003US6612904 Field controlled polishing apparatus
09/02/2003US6612903 Workpiece carrier with adjustable pressure zones and barriers
09/02/2003US6612902 Method and apparatus for end point triggering with integrated steering
09/02/2003US6612901 Apparatus for in-situ optical endpointing of web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies
09/02/2003US6612368 Flow completion apparatus
08/2003
08/28/2003WO2003071593A1 Polishing method and polishing fluid
08/28/2003WO2003071592A1 Method and device for polishing
08/28/2003WO2003071369A1 System and method for point of use delivery, control and mixing chemical and slurry for cmp/cleaning system
08/28/2003WO2003043780A3 Method for polishing a substrate surface
08/28/2003WO2003005421A3 Fabricating structures using chemo-mechanical polishing and chemically-selective endpoint detection
08/28/2003WO2002071445A3 Polishing chemical delivery for small head chemical mechanical planarization
08/28/2003US20030162486 Polishing head and apparatus with an improved pad conditioner for chemical mechanical polishing
08/28/2003US20030162482 Method of polishing glass substrate for information recording media, and glass substrate for information recording media
08/28/2003US20030162481 Chemical mechanical polishing of dual orientation polycrystalline materials
08/28/2003US20030162480 Magnetic head grinding device and method
08/28/2003US20030162398 Catalytic composition for chemical-mechanical polishing, method of using same, and substrate treated with same
08/28/2003US20030162385 Method of forming metal lines having improved uniformity on a substrate
08/28/2003US20030159362 Applying slurry to soft surface layer
08/27/2003EP1338636A1 Abrasive material
08/27/2003EP1338384A2 Polishing apparatus
08/27/2003EP1337601A1 Slurry for chemical-mechanical polishing copper damascene structures
08/27/2003EP1337380A1 Abrasive article having a window system for polishing wafers, and methods
08/27/2003EP1032485B1 Wafer polishing machine
08/27/2003CN1438932A Method of manufacturing a semicondustor component and chemical-mechanical polishing system therefor
08/27/2003CN1438931A Oscillating fixed abrasive CMP system and methods for implementing the same
08/27/2003CN1438930A Polishing sheet and method of manufacturing the sheet
08/27/2003CN1438094A Method for surface roughening of object to be processed and apparatus used thereof
08/26/2003US6610114 Oxidizing polishing slurries for low dielectric constant materials
08/26/2003US6609961 Chemical mechanical planarization belt assembly and method of assembly
08/26/2003US6609957 Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads
08/26/2003US6609954 Method of planarization
08/26/2003US6609953 Seal rings with improved friction and wear properties
08/26/2003US6609952 Chemical mechanical planarization (CMP) system and method for determining an endpoint in a CMP operation
08/26/2003US6609950 Method for polishing a substrate
08/26/2003US6609949 Interface assembly for lapping control feedback
08/26/2003US6609948 Method of making an electronic lapping guide (ELG) for lapping a read sensor
08/26/2003US6609947 Planarizing machines and control systems for mechanical and/or chemical-mechanical planarization of micro electronic substrates
08/26/2003US6609946 Method and system for polishing a semiconductor wafer
08/21/2003WO2003068883A1 Anionic abrasive particles treated with positively-charged polyelectrolytes for cmp
08/21/2003WO2003068882A1 Free radical-forming activator attached to solid and used to enhance cmp formulations
08/21/2003WO2003068881A1 Process for chemical-mechanical polishing of metal substrates
08/21/2003WO2003068504A1 Equipment coating
08/21/2003WO2002004573A3 Ready-to-use stable chemical-mechanical polishing slurries
08/21/2003US20030158630 System and method for point of use delivery, control and mixing chemical and slurry for CMP/cleaning system
08/21/2003US20030157870 Vacuum suction membrane for holding silicon wafer
08/21/2003US20030157804 For use in fabricating semiconductors, integrated circuits and microelectromechanical systems
08/21/2003US20030154999 Method for preventing chemical attack on a copper containing semiconductor wafer
08/21/2003US20030154659 Polishing composition
08/20/2003EP1336988A1 Polishing device and method of manufacturing semiconductor device
08/20/2003EP1335814A1 Semiconductor wafer, polishing apparatus and method
08/20/2003CN2566980Y Lapping disc
08/20/2003CN2566979Y Self-propelled lapping machine
08/20/2003CN1437762A Method of manufacturing semiconductor wafer
08/20/2003CN1437643A Slurries of abrasive inorganic oxide particles and method for polishing copper containing surfaces
08/20/2003CN1437520A Polishing pad
08/20/2003CN1118354C Mosaic polishing pad and producing method thereof
08/19/2003USRE38228 Polishing apparatus
08/19/2003US6607429 Support for temporary fixation of self-sticking abrasive and/or polishing sheet
08/19/2003US6607428 Material for use in carrier and polishing pads
08/19/2003US6607425 Pressurized membrane platen design for improving performance in CMP applications
08/19/2003US6607423 Method for achieving a desired semiconductor wafer surface profile via selective polishing pad conditioning
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