| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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| 09/25/2003 | WO2003078104A1 Treatment condition decision method, treatment condition decision system, treatment system, treatment condition decision calculator program, program recording medium, and semiconductor device manufacturing method |
| 09/25/2003 | WO2003078103A1 Polishing equipment, and method of manufacturing semiconductor device using the equipment |
| 09/25/2003 | WO2002029859A3 Method and apparatus for electrochemical planarization of a workpiece |
| 09/25/2003 | WO2002002276A3 Projected gimbal point drive |
| 09/25/2003 | US20030182015 Polisher |
| 09/25/2003 | US20030181345 Tantalum barrier removal solution |
| 09/25/2003 | US20030181153 Polishing head with a floating knife-edge |
| 09/25/2003 | US20030181151 Carrier head with a vibration reduction feature for a chemical mechanical polishing system |
| 09/25/2003 | US20030181143 Chemical mechanical polishing apparatus and methods using a flexible pad and variable fluid flow for variable polishing |
| 09/25/2003 | US20030181142 CMP method for noble metals |
| 09/25/2003 | US20030181141 Method of polishing semiconductor wafers by using double-sided polisher |
| 09/25/2003 | US20030181139 Windows configurable to be coupled to a process tool or to be disposed within an opening in a polishing pad |
| 09/25/2003 | US20030181138 Methods and systems for determining a characteristic of polishing within a zone on a specimen from combined output signals of an eddy current device |
| 09/25/2003 | US20030181137 Linear polishing sheet with window |
| 09/25/2003 | US20030181136 CMP pad platen with viewport |
| 09/25/2003 | US20030181135 CMP endpoint detection system |
| 09/25/2003 | US20030181132 Methods and systems for generating a two-dimensional map of a characteristic at relative or absolute locations of measurement spots on a specimen during polishing |
| 09/25/2003 | US20030181131 Systems and methods for characterizing a polishing process |
| 09/25/2003 | US20030180973 Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool |
| 09/25/2003 | US20030178587 Chemical-mechanical polishing apparatus and method for controlling the same |
| 09/25/2003 | US20030178320 Comprises acid (phosphoric, sulfuric, perchloric, and/or acetic) based electrolytes, chelate agent (ethylenediamine), and corrosion inhibitor (benzotriazole) |
| 09/25/2003 | US20030178202 Flow completion system |
| 09/25/2003 | DE10217496C1 Surface treatment method for sandwich construction mirror has inner core filled with pressurized fluid prior to grinding and polishing process |
| 09/24/2003 | EP1345735A1 Method and apparatus for chemical-mechanical polishing (cmp) using upstream and downstream fluid dispensing means |
| 09/24/2003 | EP1345734A1 Crosslinked polyethylene polishing pad for chemical-mechnical polishing, polishing apparatus and polishing method |
| 09/24/2003 | EP1345733A1 Methods for making reinforced wafer polshing pads and apparatuses implementing the same |
| 09/24/2003 | EP1161322A4 Improved polishing pads and methods relating thereto |
| 09/24/2003 | CN1122094C 抛光组合物 The polishing composition |
| 09/24/2003 | CN1122093C Polishing composition used for manufacturing storage hard disk and polishing method |
| 09/23/2003 | US6624048 Die attach back grinding |
| 09/23/2003 | US6623993 Method of determining the time for polishing the surface of an integrated circuit wafer |
| 09/23/2003 | US6623856 Dental glass powders comprising spherical glass particles of specific particle size distribution |
| 09/23/2003 | US6623355 Methods, apparatus and slurries for chemical mechanical planarization |
| 09/23/2003 | US6623345 Wafer for cleaning semiconductor device probe |
| 09/23/2003 | US6623344 Wafer polishing apparatus |
| 09/23/2003 | US6623343 System and method for CMP head having multi-pressure annular zone subcarrier material removal control |
| 09/23/2003 | US6623338 Method of abrading silicon substrate |
| 09/23/2003 | US6623337 Base-pad for a polishing pad |
| 09/23/2003 | US6623335 Method of forming ink fill slot of ink-jet printhead |
| 09/23/2003 | US6623334 Chemical mechanical polishing with friction-based control |
| 09/23/2003 | US6623333 System and method for controlling a wafer polishing process |
| 09/23/2003 | US6623331 Polishing disk with end-point detection port |
| 09/23/2003 | US6622745 Fluid waster diversion system |
| 09/18/2003 | WO2003077309A2 Method of predicting post-polishing waviness characteristics of a semiconductor wafer |
| 09/18/2003 | WO2003076538A1 Methanol-containing silica-based cmp compositions |
| 09/18/2003 | WO2003076134A1 Methods and apparatus for electrochemical-mechanical processing of microelectronic workpieces |
| 09/18/2003 | WO2003076133A1 Device for treating the surface of test pieces |
| 09/18/2003 | US20030176151 STI polish enhancement using fixed abrasives with amino acid additives |
| 09/18/2003 | US20030176081 Chemical mechanical polishing of a metal layer with polishing rate monitoring |
| 09/18/2003 | US20030173329 Polishing slurry for aluminum-based metal, and method of manufacturing semiconductor device |
| 09/18/2003 | US20030173193 Reinforced chemical mechanical planarization belt |
| 09/18/2003 | DE20310898U1 Substrate surface cleaning and/or polishing apparatus e.g. for CD or DVD, positions polishing pads of differing grain or roughness w.r.t. surface of disk-like substrate |
| 09/17/2003 | EP1091829B1 Chemical mechanical polishing head having floating wafer retaining ring and wafer carrier with multi-zone polishing pressure control |
| 09/17/2003 | CN2573151Y Grinding tool for machining concave-convex face |
| 09/17/2003 | CN1443231A Polishing fluid composition |
| 09/16/2003 | US6621584 Monitoring of material being removed during chemical-mechanical polishing of semiconductor |
| 09/16/2003 | US6620726 Method of forming metal lines having improved uniformity on a substrate |
| 09/16/2003 | US6620336 Polishing pad, polishing apparatus and polishing method |
| 09/16/2003 | US6620216 Small particle size abrasive, oxidizing agent and organic phosphonic acid; reducing fine scratches |
| 09/16/2003 | US6620215 Abrasive composition containing organic particles for chemical mechanical planarization |
| 09/16/2003 | US6620036 Stacked polishing pad having sealed edge |
| 09/16/2003 | US6620035 Grooved rollers for a linear chemical mechanical planarization system |
| 09/16/2003 | US6620034 Way to remove Cu line damage after Cu CMP |
| 09/16/2003 | US6620032 Polishing pads and planarizing machines for mechanical and/or chemical-mechanical planarization of microelectronic substrate assemblies |
| 09/16/2003 | US6620031 Method for optimizing the planarizing length of a polishing pad |
| 09/16/2003 | US6620029 Apparatus and method for front side chemical mechanical planarization (CMP) of semiconductor workpieces |
| 09/16/2003 | US6620027 Method and apparatus for hard pad polishing |
| 09/12/2003 | WO2003074228A1 Advanced chemical mechanical polishing system with smart endpoint detection |
| 09/12/2003 | WO2003074227A2 Polishing pad for use in chemical-mechanical planarization of semiconductor wafers and method of making same |
| 09/12/2003 | WO2003050864A3 Method for copper cmp using polymeric complexing agents |
| 09/12/2003 | WO2002103776A3 Method for relating photolithography overlay target damage and chemical mechanical planarization (cmp) fault detection to cmp tool identification |
| 09/12/2003 | WO2002060643A9 Spherical drive assembly for chemical mechanical planarization |
| 09/11/2003 | US20030171081 Polishing pad |
| 09/11/2003 | US20030171080 Slurry distributor |
| 09/11/2003 | US20030171076 Chemical mechanical polishing apparatus and method having a retaining ring with a contoured surface for slurry distribution |
| 09/11/2003 | US20030171072 Improved chemical mechanical polishing of nickel phoshorous alloys |
| 09/11/2003 | US20030171071 Polishing apparatus |
| 09/11/2003 | US20030171070 Polishing pad with transparent window having reduced window leakage for a chemical mechanical polishing apparatus |
| 09/11/2003 | US20030171069 Web lift system for chemical mechanical planarization |
| 09/11/2003 | US20030170991 Method of polishing a multi-layer substrate |
| 09/11/2003 | US20030170920 Method of estimating post-polishing waviness characteristics of a semiconductor wafer |
| 09/11/2003 | US20030168635 For use in flat panel displays and lighting elements |
| 09/11/2003 | US20030168628 Methanol-containing silica-based CMP compositions |
| 09/11/2003 | US20030168627 Slurry and method for chemical mechanical polishing of metal structures including refractory metal based barrier layers |
| 09/11/2003 | US20030168169 Chemical-mechanical polishing apparatus, polishing pad and method for manufacturing semiconductor device |
| 09/10/2003 | EP1341643A2 Polishing pads with polymer filled fibrous web, and methods for fabricating and using same |
| 09/10/2003 | CN2571539Y Automatic leveling device for lapping-disc |
| 09/10/2003 | CN2571538Y Circular lapping device for big steel ball of bearing |
| 09/10/2003 | CN1441713A Method of polishing semiconductor wafer by using double-sided polisher |
| 09/10/2003 | CN1441017A Chemical and mechanical polishing size and chemical and mechanical polishing method using said size |
| 09/09/2003 | US6618130 Method and apparatus for optical endpoint detection during chemical mechanical polishing |
| 09/09/2003 | US6616801 Method and apparatus for fixed-abrasive substrate manufacturing and wafer polishing in a single process path |
| 09/09/2003 | US6616718 Aqueous solution for colloidal polishing of silicate substrates |
| 09/09/2003 | US6616520 Polishing cloth and method for attaching/detaching the polishing cloth to/from polishing machine base plate |
| 09/09/2003 | US6616516 Method and apparatus for asymmetric processing of front side and back side of semiconductor substrates |
| 09/09/2003 | US6616513 Grid relief in CMP polishing pad to accurately measure pad wear, pad profile and pad wear profile |
| 09/09/2003 | US6616512 Including a cleaning box, in which a substrate such as a semiconductor wafer is cleaned with a cleaning liquid and then dried; upper wall with an air intake opening and the exhaust system is fluidly connected to the box |
| 09/09/2003 | US6616510 Chemical mechanical polishing method for copper |
| 09/09/2003 | US6616509 Method for performing two wafer preparation operations on vertically oriented semiconductor wafer in single enclosure |
| 09/09/2003 | US6616014 Precision liquid mixing apparatus and method |