Patents
Sitemap › B24 - Grinding; Polishing › B24B - Machines, devices, or processes for grinding or polishing; Dressing or conditioning of abrading surfaces; Feeding of grinding, polishing, or lapping agents › B24B 37 - Lapping machines or devices; Accessories
Patents for B24B 37 - Lapping machines or devices; Accessories (20,836)
10/2003
10/16/2003US20030194963 Methods for making reinforced wafer polishing pads and apparatuses implementing the same
10/16/2003US20030194960 Multiple polymer belt used as a carrier in a linear belt polishing system
10/16/2003US20030194959 Sintered polishing pad with regions of contrasting density
10/16/2003US20030194956 Polishing pad ironing system and methods for implementing the same
10/16/2003US20030194953 Methods, apparatus and slurries for chemical mechanical planarization
10/16/2003US20030194952 Method for planarizing a dielectric layer of a flash memory device
10/16/2003US20030194949 Method for defect reduction
10/16/2003US20030194948 Chemical-mechanical polishing machine for polishing a wafer of material, and an abrasive delivery device fitted to such a machine
10/16/2003US20030194945 Method and apparatus for detection of chemical mechanical planarization endpoint and device planarity
10/16/2003US20030194866 Method and apparatus for monitoring and controlling force applied on workpiece surface during electrochemical mechanical processing
10/15/2003EP1352711A1 Chemical mechanical polishing machine for polishing slice-like material and device for feeding of abrasive for such a machine
10/15/2003EP1352418A2 Polishing of semiconductor substrates
10/15/2003EP1352109A1 Composition for chemical mechanical planarization of copper, tantalum and tantalum nitride
10/15/2003EP1009589B1 Chemicals supply system and its use
10/15/2003CN1449322A Grooved polishing pads and methods of use
10/15/2003CN1448459A Composition for grinding agent and making-up method thereof
10/14/2003US6633379 Apparatus and method for measuring the degradation of a tool
10/14/2003US6633084 Semiconductor wafer for improved chemical-mechanical polishing over large area features
10/14/2003US6632259 Mixtures of copolymers, abrasives, oxidizers, corrosion inhibitors and complexing agents, used for selectively etching copper layers from semiconductor substrates
10/14/2003US6632129 Fixed abrasive article for use in modifying a semiconductor wafer
10/14/2003US6632127 Chemical mechanical polishing pads comprising silicon substrates bonded to microstructure thin films, used for smoothening dielectrics and semiconductor wafers
10/14/2003US6632124 Optical monitoring in a two-step chemical mechanical polishing process
10/14/2003US6632026 Method of polishing optical fiber connector
10/09/2003WO2003083920A1 Tantalum barrier removal solution
10/09/2003WO2003083918A1 Polishing pad and semiconductor substrate manufacturing method using the polishing pad
10/09/2003WO2003083917A1 Double side polishing device for wafer and double side polishing method
10/09/2003WO2003083522A2 System and method of broad band optical end point detection for film change indication
10/09/2003WO2003082522A1 Apparatus and methods for detecting transitions of wafer surface properties in chemical mechanical polishing for process status and control
10/09/2003WO2003082521A1 Method and apparatus for heating polishing pad
10/09/2003WO2003061904B1 Chemical mechanical polishing apparatus and method having a retaining ring with a contoured surface for slurry distribution
10/09/2003US20030190874 Composite conditioning tool
10/09/2003US20030190873 Chemical-mechanical polishing platform
10/09/2003US20030190869 Chemical mechanical planarization (CMP) system and method for determining an endpoint in a CMP operation
10/09/2003US20030190868 Abrasive articles and methods for the manufacture and use of same
10/09/2003US20030190867 Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
10/09/2003US20030190866 Optical coupler hub for chemical-mechanical-planarization polishing pads with an integrated optical waveguide.
10/09/2003US20030190865 Chemical mechanical polishing with multiple polishing pads
10/09/2003US20030190864 Methods and systems for detecting a presence of blobs on a specimen during a polishing process
10/09/2003US20030190446 Assembly system for stationing semiconductor wafer suitable for processing and process for manufacturing semiconductor wafer
10/09/2003US20030189004 Useful for chemical mechanical polishing (CMP) apparatus for polishing a workpiece by using a slurry containing an abrasive, a pH agent and deionized water, also includes a two-step filter: an ultra filter and reverse osmosis filter
10/09/2003US20030188829 Integrated pressure sensor for measuring multiaxis pressure gradients
10/08/2003EP1350827A1 Abrasive, abrasive slurry, and method for manufacturing abrasive
10/08/2003EP1349705A1 Polishing pad and method of use thereof
10/08/2003EP1349704A1 Polishing platen with pressurized membrane
10/08/2003EP1349703A1 Belt polishing device with double retainer ring
10/08/2003EP1349701A1 Jet-induced finishing of a substrate surface
10/08/2003EP1349700A2 Method of making optical fluoride laser crystal components
10/08/2003EP1178872B1 Chemical mechanical planarization or polishing pad with sections having varied groove patterns
10/08/2003CN1447735A Abrasive pad for CMD
10/08/2003CN1447734A Small diameter chemical machinery polishing system
10/08/2003CN1447401A Mfg. method of semiconductor device
10/08/2003CN1447396A Chemical mechanical polishing appts. and its control method
10/08/2003CN1447394A Chemical-mechanical grinding head possessing floating obstruct ring
10/08/2003CN1123423C Method and device for polishing semiconductor wafers
10/07/2003US6630433 Oxidizing reactant selected from ammonium persulfate, hydrogen peroxide, nitric acid, co-reactant selected from phosphoric acid, sulfuric acid, nitric acid, oxalic acid, acetic acid, organic acids, additives
10/07/2003US6630403 Mixing a surfactant to a slurry to form a polishing solution; and planarizing of the microelectronic substrate using polishing solution
10/07/2003US6630059 Workpeice proximity plating apparatus
10/07/2003US6630051 Auto slurry deliver fine-tune systems for chemical-mechanical-polishing process and method of using the system
10/07/2003US6629883 Polishing apparatus
10/07/2003US6629882 Precise polishing apparatus and method
10/07/2003US6629881 Method and apparatus for controlling slurry delivery during polishing
10/07/2003US6629878 Pretreatment for reducing surface treatments defects
10/07/2003US6629876 Apparatus for grinding wafers using a grind chuck having a high elastic modulus
10/07/2003US6629875 Machine for grinding-polishing of a water edge
10/07/2003US6629874 Feature height measurement during CMP
10/02/2003WO2003080757A1 Cerium based abrasive material and method for preparation thereof
10/02/2003WO2003080293A1 Lapping device and lapping method
10/02/2003WO2003080291A2 Polisher with a load control system
10/02/2003US20030186632 Chuck means for flat workpieces, in particular semi-conductor wafers
10/02/2003US20030186630 Reinforced chemical mechanical planarization belt
10/02/2003US20030186627 Interchangeable conditioning disk apparatus
10/02/2003US20030186624 Method of determining a flatness of an electronic device substrate, method of producing the substrate, method of producing a mask blank, method of producing a transfer mask, polishing method, electronic device substrate, mask blank, transfer mask, and polishing apparatus
10/02/2003US20030186623 Method and apparatus for heating polishing pad
10/02/2003US20030186622 Polishing method and polishing apparatus
10/02/2003US20030186621 Method for determining chemical mechanical polishing time
10/02/2003US20030186546 Method and system for controlling the chemical mechanical polishing of substrates by calculating an overpolishing time and/or a polishing time of a final polishing step
10/02/2003US20030186497 Methods of polishing, interconnect-fabrication, and producing semiconductor devices
10/02/2003US20030186028 Epitaxially coated semiconductor wafer and process for producing it
10/02/2003US20030184732 System and method of broad band optical end point detection for film change indication
10/02/2003US20030184017 Seal assembly manufacturing methods and seal assemblies manufactured thereby
10/02/2003US20030182868 A problem to be solved is to provide a slurry that is capable of flattening an uneven film on a substrate with good precision, and that has good stability, not separating into two layers, solidifying through flocculated settling or
10/02/2003DE10208165C1 Verfahren, Steuerung und Vorrichtung zum Steuern des chemisch-mechanischen Polierens von Substraten Method, and control apparatus for controlling the chemical-mechanical polishing of substrates
10/01/2003EP1347861A2 System and method for polishing and planarization of semiconductor wafers using reduced surface area polishing pads
10/01/2003EP1347824A2 Process and apparatus for blending and distributing a slurry solution
10/01/2003CN1446142A Method for processing semiconductor wafer using double-side polishing
10/01/2003CN1122591C In-line cleaning method after polishing
09/2003
09/30/2003US6628410 Endpoint detector and method for measuring a change in wafer thickness in chemical-mechanical polishing of semiconductor wafers and other microelectronic substrates
09/30/2003US6628397 Apparatus and methods for performing self-clearing optical measurements
09/30/2003US6627115 Electroluminescent phosphor powders, methods for making phosphor powders and devices incorporating same
09/30/2003US6627098 Carrier heads, planarizing machines and methods for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies
09/30/2003US6626968 For manufacturing semiconductor device
09/30/2003US6626967 Polishing composition and polishing method employing it
09/30/2003US6626744 Planarization system with multiple polishing pads
09/30/2003US6626743 Method and apparatus for conditioning a polishing pad
09/30/2003US6626741 Method for improving thickness uniformity on a semiconductor wafer during chemical mechanical polishing
09/30/2003US6626740 Self-leveling pads and methods relating thereto
09/30/2003US6626736 Polishing apparatus
09/25/2003WO2003079428A1 Method and apparatus for integrated chemical mechanical polishing of copper and barrier layers
09/25/2003WO2003078859A2 Reinforced chemical mechanical planarization belt
09/25/2003WO2003078535A1 Thermal management with filled polymeric polishing pads and applications therefor
1 ... 128 129 130 131 132 133 134 135 136 137 138 139 140 141 142 143 144 145 146 147 148 ... 209