Patents
Sitemap › B24 - Grinding; Polishing › B24B - Machines, devices, or processes for grinding or polishing; Dressing or conditioning of abrading surfaces; Feeding of grinding, polishing, or lapping agents › B24B 37 - Lapping machines or devices; Accessories
Patents for B24B 37 - Lapping machines or devices; Accessories (20,836)
11/2003
11/11/2003US6645044 Method of chemical mechanical polishing with controllable pressure and loading area
11/06/2003WO2003090963A1 A method, an apparatus, a control system and a computer program to perform an automatic removal of cathode depositions during a bipolar electrochemical machining
11/06/2003WO2003090962A1 A method, an apparatus,a control system and a computer program to perform an automatic removal of cathode depositions during a bi polar electrochemical machining
11/06/2003WO2003041126A3 Electrochemical mechanical processing with advancible sweeper
11/06/2003WO2003022518A3 Chemical mechanical polishing tool, apparatus and method
11/06/2003WO2003002299A3 Carrier head with porose retainer ring
11/06/2003WO2002062527A8 Abrasive article suitable for modifying a semiconductor wafer
11/06/2003US20030207661 Annealing of CMP polishing pads
11/06/2003US20030207656 Slurry homogenizer and supply system
11/06/2003US20030207654 Polishing device and polishing method for semiconductor wafer
11/06/2003US20030207651 Polishing endpoint detecting method, device for detecting a polishing endpoint of a polishing process and chemical-mechanical polishing apparatus comprising the same
11/06/2003US20030207582 Use of low-high slurry flow to eliminate copper line damages
11/06/2003US20030206010 Method for monitoring a metal layer during chemical mechanical polishing using a phase difference signal
11/06/2003US20030205664 Process end point detection apparatus and method, polishing apparatus, semiconductor device manufacturing method, and recording medium recorded with signal processing program
11/06/2003US20030205484 Electrochemical/ mechanical polishing
11/06/2003US20030205325 Apparatus and method for providing a signal port in a polishing pad for optical endpoint detection
11/05/2003EP1359133A1 Porous ceramic and method for preparation thereof, and microstrip substrate
11/05/2003EP1358289A2 Alkali metal-containing polishing system and method
11/05/2003EP1358045A1 Pressure vessel systems and methods for dispensing liquid chemical compositions
11/05/2003EP1358044A2 Chemical mechanical machining and surface finishing
11/05/2003CN2584354Y Vertical dry-type pipe surface lapping machine
11/05/2003CN1453328A Aqueous dispersion body for chemical mechanical grinding
11/04/2003US6641631 Controlling pH of an aqueous polishing composition having abrasive particles of a metal oxide that provides ions upon dissolution; equilibrium concentration of said ions at said pH, which avoids drift of said pH
11/04/2003US6641630 CMP compositions containing iodine and an iodine vapor-trapping agent
11/04/2003US6641471 Polishing pad having an advantageous micro-texture and methods relating thereto
11/04/2003US6641470 Apparatus for accurate endpoint detection in supported polishing pads
11/04/2003US6641468 Slurry distributor
11/04/2003US6641463 Unitary refining element having a plurality of discrete refining members for refining a semiconductor wafer; members comprising multiphase polymeric composition
11/04/2003US6641462 Method and apparatus for distributing fluid to a polishing surface during chemical mechanical polishing
11/04/2003US6641461 Chemical mechanical polishing apparatus having edge, center and annular zone control of material removal
10/2003
10/30/2003WO2003089192A1 Lapping carrier for use in fabricating sliders
10/30/2003WO2003089191A1 Method and device for the chemical-mechanical polishing of workpieces
10/30/2003WO2003057405A8 Grooved rollers for a linear chemical mechanical planarization system
10/30/2003WO2003043780B1 Method for polishing a substrate surface
10/30/2003WO2003001582A3 Microelectronic substrate having conductive material with blunt cornered apertures, and associated methods for removing conductive material
10/30/2003WO2003001581A3 Methods and apparatus for electrical, mechanical and/or chemical removal of conductive material from a microelectronic substrate
10/30/2003WO2002018101A9 Chemical mechanical polishing (cmp) head, apparatus, and method and planarized semiconductor wafer produced thereby
10/30/2003US20030203710 Linear polishing for improving substrate uniformity
10/30/2003US20030203709 Method of improving uniformity control on wafers during chemical mechanical polishing
10/30/2003US20030203708 Chemical mechanical polisher equipped with chilled wafer holder and polishing pad and method of using
10/30/2003US20030203635 Polishing composition for metal CMP
10/30/2003US20030203624 Manufacturing method of semiconductor device
10/30/2003US20030201770 Method and apparatus for monitoring a metal layer during chemical mechanical polishing
10/30/2003US20030201769 Method for monitoring a metal layer during chemical mechanical polishing
10/30/2003US20030201067 Method and apparatus for aligning and setting the axis of rotation of spindles of a multi-body system
10/29/2003EP1357161A2 Aqueous dispersion for chemical mechanical polishing
10/29/2003EP1356502A1 Ammonium oxalate-containing polishing system and method
10/29/2003CN1452784A Method of modifying surface of semiconductor wafer
10/29/2003CN1126153C Polishing apparatus
10/29/2003CN1125705C Method and device for detecting end point of film removing process
10/29/2003CN1125704C CMP pad conditioner arrangement and method therefor
10/28/2003US6638868 Method for preventing or reducing anodic Cu corrosion during CMP
10/28/2003US6638391 Wafer carrier assembly for a chemical mechanical polishing apparatus and a polishing method using the same
10/28/2003US6638389 Method for applying an insert or tape to chucks or wafer carriers used for grinding, polishing, or planarizing wafers
10/28/2003US6638148 Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads
10/28/2003US6638147 Polishing method for removing corner material from a semi-conductor wafer
10/28/2003US6638146 Retention plate for polishing semiconductor substrate
10/28/2003US6638145 Constant pH polish and scrub
10/28/2003US6638143 Ion exchange materials for chemical mechanical polishing
10/28/2003US6638141 Method and apparatus for chemical-mechanical polishing
10/28/2003US6638140 Method and apparatus for polishing
10/23/2003WO2003088335A1 Polishing device and substrate processing device
10/23/2003WO2003086706A1 Polishing method
10/23/2003WO2003086701A1 Protection of work piece during surface processing
10/23/2003WO2003037565A3 Polishing pads and manufacturing methods
10/23/2003WO2002094957A3 Chemical mechanical polishing compositions and methods relating thereto
10/23/2003WO2001074535A9 Fixed abrasive linear polishing belt and system using the same
10/23/2003US20030199602 Photo-curable resin composition
10/23/2003US20030199238 Polishing apparatus and method for producing semiconductors using the apparatus
10/23/2003US20030199235 Polishing pad and method of use thereof
10/23/2003US20030199234 Grooved polishing pads and methods of use
10/23/2003US20030199230 Polishing cloth, polishing apparatus and method of manufacturing semiconductor devices
10/23/2003US20030199229 Flexible polishing fluid delivery system
10/23/2003US20030199228 Lapping carrier for use in fabricating sliders
10/23/2003US20030199227 Methods of preparing semiconductor workpiece process fluid and semiconductor workpiece processing methods
10/23/2003US20030199225 Apparatus and method for the chemical mechanical polishing of the surface of circular flat workpieces, in particular semi-conductor wafers
10/23/2003US20030199112 Copper wiring module control
10/23/2003US20030198799 Battery separator
10/23/2003US20030196386 For use in micro isolating step or a planarizing step of an inter layer dielectric in production of semiconductor devices
10/22/2003EP1354913A1 Thermoplastic polyurethane foam, process for production thereof and polishing pads made of the foam
10/22/2003EP1354017A2 Ready-to-use stable chemical-mechanical polishing slurries
10/22/2003EP1354012A2 A cmp polishing pad including a solid catalyst
10/22/2003EP1353792A2 Catalytic reactive pad for metal cmp
10/22/2003EP1212170B1 Method and system for chemical mechanical polishing with a cylindrical polishing pad
10/22/2003EP1210395B1 Compositions for insulator and metal cmp and methods relating thereto
10/22/2003EP1133380B1 A carrier head with edge control for chemical mechanical polishing
10/21/2003US6635512 Method of producing a semiconductor device by dividing a semiconductor wafer into separate pieces of semiconductor chips
10/21/2003US6635500 Treatment of substrates
10/21/2003US6635348 Aerosol method and apparatus, particulate products, and electronic devices made therefrom
10/21/2003US6635211 Reinforced polishing pad for linear chemical mechanical polishing and method for forming
10/21/2003US6634936 Chemical mechanical planarization or polishing pad with sections having varied groove patterns
10/21/2003US6634935 Single drive system for a bi-directional linear chemical mechanical polishing apparatus
10/21/2003US6634932 Web-format polishing pads and methods for manufacturing and using web-format polishing pads in mechanical and chemical-mechanical planarization of microelectronic substrates
10/21/2003US6634930 Method and apparatus for preventing metal corrosion during chemical mechanical polishing
10/21/2003US6634927 Finishing element using finishing aids
10/21/2003US6634924 Polishing apparatus
10/16/2003WO2003085595A1 Abrasive articles and methods for the manufacture and use of same
10/16/2003WO2003084715A1 Composite conditioning tool
10/16/2003WO2003060962A3 Electrolyte composition and treatment for electrolytic chemical mechanical polishing
10/16/2003WO2003038858A3 A semiconductor manufacturing apparatus having a built-in inspection apparatus and method therefor
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