Patents
Sitemap › B24 - Grinding; Polishing › B24B - Machines, devices, or processes for grinding or polishing; Dressing or conditioning of abrading surfaces; Feeding of grinding, polishing, or lapping agents › B24B 37 - Lapping machines or devices; Accessories
Patents for B24B 37 - Lapping machines or devices; Accessories (20,836)
11/2003
11/27/2003US20030220061 Microporous polishing pads
11/27/2003US20030220053 Apparatus for electrochemical processing
11/27/2003US20030220051 Conditioning disk actuating system
11/27/2003US20030220050 Removable lapping guide for magnetic recording haed and method of use
11/27/2003US20030220049 Conditioning disk actuating system
11/27/2003US20030219982 CMP (chemical mechanical polishing) polishing liquid for metal and polishing method
11/27/2003US20030219962 Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies
11/27/2003US20030217927 Long-life workpiece surface influencing device structure and manufacturing method
11/27/2003US20030217518 Abrasive, a method of polishing with the abrasive, and a method of washing a polished object
11/27/2003US20030217517 Polishing pad
11/26/2003EP1365445A1 Working shape prediction method, working requirement determination method, working method, working system, method of manufacturing semiconductor device, computer program, and computer program storage medium
11/26/2003CN1458913A Porous ceramic and method for prepartion thereof and microstrip substrate
11/26/2003CN1458671A Conductive polishing article for electrochemical mechanical polishing
11/26/2003CN1128695C Surface polishing machine
11/25/2003US6654132 Optical techniques for measuring layer thicknesses and other surface characteristics of objects such as semiconductor wafers
11/25/2003US6654108 Test structure for metal CMP process control
11/25/2003US6653722 Method for applying uniform pressurized film across wafer
11/25/2003US6653267 Compound having a heterocycle (preferably quinaldic acid, benzotriazole or benzimidazole), surfactant and an oxidizing agent
11/25/2003US6652764 Methods and apparatuses for making and using planarizing pads for mechanical and chemical-mechanical planarization of microelectronic substrates
11/25/2003US6652370 Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates
11/25/2003US6652368 Chemical mechanical polishing carrier head
11/25/2003US6652366 Dynamic slurry distribution control for CMP
11/25/2003US6652365 Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads
11/25/2003US6652364 Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads
11/25/2003US6652363 Method and apparatus for uniformly planarizing a microelectronic substrate
11/25/2003US6652362 Apparatus for polishing a semiconductor wafer and method therefor
11/25/2003US6652358 Double-sided simultaneous grinding method, double-sided simultaneous grinding machine, double-sided simultaneous lapping method, and double-sided simultaneous lapping machine
11/25/2003US6652355 Method and apparatus for detecting an end-point in chemical mechanical polishing of metal layers
11/25/2003US6652354 Polishing apparatus and method with constant polishing pressure
11/25/2003US6651302 Method for dismantling a guide ring
11/20/2003WO2003095579A1 Composition and method for temporarily fixing solid
11/20/2003WO2003095518A1 Method of producing polishing pad-use polyurethane foam and polyurethane foam
11/20/2003WO2003095144A1 Lapping device and lapping work method
11/20/2003US20030216115 Carrier heads, planarizing machines and methods for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies
11/20/2003US20030216111 Non-foamed polishing pad and polishing method therewith
11/20/2003US20030216106 Method and apparatus for polishing, and lapping jig
11/20/2003US20030216105 Apparatus for monitoring a metal layer during chemical mechanical polishing using a phase difference signal
11/20/2003US20030216104 Method for processing a work piece in a multi-zonal processing apparatus
11/20/2003US20030216049 Method and composition for the removal of residual materials during substrate planarization
11/20/2003US20030216045 Hydrogen bubble reduction on the cathode using double-cell designs
11/20/2003US20030216042 CMP slurry for oxide film and method of forming semiconductor device using the same
11/20/2003US20030216003 Method of forming flash memory device
11/20/2003US20030215639 Aqueous dispersion containing cerium oxide-coated silicon powder, process for the production thereof and use thereof
11/20/2003US20030213703 Method and apparatus for substrate polishing
11/20/2003US20030213558 Chemical mechanical polishing endpoint detection
11/20/2003DE20309051U1 Holding ring with flange for chemo-mechanical polishing of substrates, e.g. silicon substrates for sequential deposition of (semi)conductor and insulating layers of integrated circuits
11/19/2003EP1362670A2 Method and apparatus for chemical mechanical polishing
11/19/2003EP1362378A2 Chemical mechanical polishing of copper-oxide damascene structures
11/19/2003EP1362365A2 Chemical-mechanical planarization using ozone
11/19/2003CN1457506A Polishing compound and method for polishing substrate
11/19/2003CN1128195C Abrasive, method of polishing wafer, and method of producing semiconductor device
11/18/2003US6650408 Method for inspecting a polishing pad in a semiconductor manufacturing process, an apparatus for performing the method, and a polishing device adopting the apparatus
11/18/2003US6649523 Method and system to provide material removal and planarization employing a reactive pad
11/18/2003US6649253 Method of using films having optimized optical properties for chemical mechanical polishing endpoint detection
11/18/2003US6648743 Chemical mechanical polishing pad
11/18/2003US6648740 Carrier head with a flexible membrane to form multiple chambers
11/18/2003US6648739 Wafer polishing apparatus
11/18/2003US6648736 Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads
11/18/2003US6648735 Method of abrading both faces of work piece
11/18/2003US6648734 Polishing head for pressurized delivery of slurry
11/18/2003US6648733 Polishing pads and methods relating thereto
11/18/2003US6648730 Calibration tool
11/18/2003US6648729 Wafer pressure regulation system for polishing machine
11/13/2003WO2003094216A1 Polishing fluid and polishing method
11/13/2003WO2003094215A1 Semiconductor wafer manufacturing method and wafer
11/13/2003WO2003060980A3 Methods for planarization of group viii metal-containing surfaces using oxidizing gases
11/13/2003WO2003018252A3 Metal polishing
11/13/2003US20030211817 Gimbal assembly for semiconductor fabrication and other tools
11/13/2003US20030211816 High-pressure pad cleaning system
11/13/2003US20030211815 Compositions and methods for dielectric CMP
11/13/2003US20030211814 Method for achieving uniform CU CMP polishing
11/13/2003US20030211813 Protection of work piece during surface processing
11/13/2003US20030211812 Substrate delivery method, a substrate delivery mechanism and a substrate polishing apparatus
11/13/2003US20030211811 Adaptable multi zone carrier
11/13/2003US20030211744 Method for preventing or reducing anodic cu corrosion during cmp
11/13/2003US20030211743 Method for avoiding slurry sedimentation in CMP slurry delivery systems
11/13/2003US20030211742 CMP process for a damascene pattern
11/13/2003US20030211014 Method of making micro titer plates and micro titer plates made thereby
11/13/2003US20030209523 Planarization by chemical polishing for ULSI applications
11/13/2003US20030209522 CMP composition containing silane-modified abrasive particles
11/13/2003US20030209448 Forming grooves; fluid flow; polishing surfaces
11/13/2003US20030209320 Planarization system with multiple polishing pads
11/13/2003US20030209310 Apparatus, system and method to reduce wafer warpage
11/12/2003EP1361023A2 Polishing articles for electrochemical mechanical polishing of substrates
11/12/2003EP1360034A1 Fixed abrasive article for use in modifying a semiconductor wafer
11/12/2003EP1360033A1 Abrasive article suitable for modifying a semiconductor wafer
11/12/2003EP1042105B1 Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates
11/12/2003EP1007308B1 Aerosol method and apparatus, particulate products, and electronic devices made therefrom
11/11/2003US6646348 Silane containing polishing composition for CMP
11/11/2003US6645865 Methods, apparatuses and substrate assembly structures for fabricating microelectronic components using mechanical and chemical-mechanical planarization processes
11/11/2003US6645862 Double-side polishing process with reduced scratch rate and device for carrying out the process
11/11/2003US6645398 Sulfur-containing phosphor powders, methods for making phosphor powders and devices incorporating same
11/11/2003US6645264 Composition for forming polishing pad, crosslinked body for polishing pad, polishing pad using the same and method for producing thereof
11/11/2003US6645061 Polishing pad having a grooved pattern for use in chemical mechanical polishing
11/11/2003US6645057 Adjustable and extended guide rings
11/11/2003US6645052 Method and apparatus for controlling CMP pad surface finish
11/11/2003US6645051 Water, ethylene oxide-propylene oxide copolymer, acid and abrasive; uniform smoothing of edges and flat surface of magnetic disks
11/11/2003US6645050 Multimode substrate carrier
11/11/2003US6645049 Polishing holder for silicon wafers and method of use thereof
11/11/2003US6645046 Conditioning mechanism in a chemical mechanical polishing apparatus for semiconductor wafers
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