| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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| 12/18/2003 | WO2003104343A2 Method for chemical mechanical polishing (cmp) of low-k dielectric materials |
| 12/18/2003 | WO2003103959A1 Controlled penetration subpad |
| 12/18/2003 | WO2003103898A1 Residual film monitoring device, polishing device, method for manufacturing semiconductor device, and semiconductor device |
| 12/18/2003 | WO2003080291A3 Polisher with a load control system |
| 12/18/2003 | WO2003006205A3 Barrier removal at low polish pressure |
| 12/18/2003 | WO2002079887A3 Apparatus and methods with resolution enhancement feature for improving accuracy of conversion of required chemical mechanical polishing pressure to force to be applied by polishing head to wafer |
| 12/18/2003 | US20030232581 Surface planarization equipment for use in the manufacturing of semiconductor devices |
| 12/18/2003 | US20030232576 Apparatus for polishing a substrate |
| 12/18/2003 | US20030232575 Method and system for in-situ monitoring of mixing ratio of high selectivity slurry |
| 12/18/2003 | US20030232574 Polishing machine and method |
| 12/17/2003 | EP1371707A1 Cerium based abrasive material and method for preparation thereof |
| 12/17/2003 | EP1371449A2 Chemical mechanical polishing head having floating retaining ring and carrier with multi-zone polishing pressure control |
| 12/17/2003 | EP1125686B1 Work holding disc for polishing, work polishing apparatus, and work polishing method |
| 12/17/2003 | CN2592339Y Omnidistance direction graded constant-speed planar lapping machine |
| 12/17/2003 | CN1462064A Chemical-mechanical machine for grinding chip material, and abrasive material supply equipment installed on the machine |
| 12/17/2003 | CN1461766A Composite for grinding |
| 12/17/2003 | CN1131551C Method for planarization-etching semiconductor device |
| 12/17/2003 | CN1131288C 抛光组合物 The polishing composition |
| 12/17/2003 | CN1131125C Composition and slurry used for metal CMP |
| 12/16/2003 | US6664557 In-situ detection of thin-metal interface using optical interference |
| 12/16/2003 | US6663480 Polishing pad for semiconductor and optical parts, and method for manufacturing the same |
| 12/16/2003 | US6663477 Complaint membrane for restraining a workpiece and applying uniform pressure during lapping to improve flatness control |
| 12/16/2003 | US6663474 Apparatus and system of chemical mechanical polishing |
| 12/16/2003 | US6663472 Multiple step CMP polishing |
| 12/16/2003 | US6663470 Method and apparatus for releasably attaching a polishing pad to a chemical-mechanical planarization machine |
| 12/16/2003 | US6663469 Polishing method and apparatus |
| 12/16/2003 | US6663468 Method for polishing surface of semiconductor device substrate |
| 12/11/2003 | WO2003103033A1 Polishing fluid and method of polishing |
| 12/11/2003 | WO2003103025A2 Method and apparatus of sealing wafer backside for full-face electrochemical plating |
| 12/11/2003 | WO2003101669A1 Web pad design for chemical mechanical polishing |
| 12/11/2003 | WO2003101668A1 Polishing material and method of polishing therewith |
| 12/11/2003 | WO2003011518A9 Cmp system and method for efficiently processing semiconductor wafers |
| 12/11/2003 | WO2002103778A3 Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing |
| 12/11/2003 | WO2002075792A3 Method of sealing wafer backside for full-face electronchemical plating |
| 12/11/2003 | US20030228836 Subpad having robust, sealed edges |
| 12/11/2003 | US20030228830 System for manufacturing a semiconductor device, polishing slurry feeder and method for manufacturing a semiconductor device |
| 12/11/2003 | US20030228765 Semiconductor device manufacture method preventing dishing and erosion during chemical mechanical polishing |
| 12/11/2003 | US20030228763 CMP method utilizing amphiphilic nonionic surfactants |
| 12/11/2003 | US20030228762 CMP compositions for low-k dielectric materials |
| 12/11/2003 | US20030228461 Glass substrate for data recording medium and manufacturing method thereof |
| 12/11/2003 | US20030228248 Aggregation of particles; mixing with diluent, roasting, water washing |
| 12/11/2003 | US20030226764 Methods and apparatus for electrochemical-mechanical processing of microelectronic workpieces |
| 12/11/2003 | US20030226378 Slurry for and method of texturing surface of glass substrate |
| 12/10/2003 | EP1369906A1 Polishing compound and method for polishing substrate |
| 12/10/2003 | EP1369204A1 Polishing pad and multi-layer polishing pad |
| 12/10/2003 | EP1369200A1 Device for polishing optical disk |
| 12/10/2003 | EP1368826A2 Planarization of substrates using electrochemical mechanical polishing |
| 12/10/2003 | EP1368157A1 Polishing disk with end-point detection port |
| 12/10/2003 | EP1020254B1 Polishing method and polishing device |
| 12/10/2003 | CN1461251A Semiconductor wafer, polishing apparatus and method |
| 12/09/2003 | US6660680 Heating aerosols at low temperature; well-controlled microstructure and morphology |
| 12/09/2003 | US6660639 Method of fabricating a copper damascene structure |
| 12/09/2003 | US6660637 Process for chemical mechanical polishing |
| 12/09/2003 | US6660185 Photoluminescent phosphor powders, methods for making phosphor powders and devices incorporating same |
| 12/09/2003 | US6659850 Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece |
| 12/09/2003 | US6659849 Platen with debris control for chemical mechanical planarization |
| 12/09/2003 | US6659848 Slurry dispenser that outputs a filtered slurry to a chemical-mechanical polisher at a constant flow rate over the lifetime of the filter |
| 12/09/2003 | US6659846 Pad for chemical mechanical polishing |
| 12/09/2003 | US6659845 Grinding method, electronic component, and variable capacitor |
| 12/09/2003 | US6659842 Method and apparatus for optical monitoring in chemical mechanical polishing |
| 12/09/2003 | US6659634 Chemical solution feeding apparatus and method for preparing slurry |
| 12/09/2003 | US6659116 System for wafer carrier in-process clean and rinse |
| 12/04/2003 | WO2003099519A1 Polishing pad for electrochemical-mechanical polishing and methods to manufacture it |
| 12/04/2003 | WO2003099518A1 Microporous polishing pad |
| 12/04/2003 | WO2003099516A1 Method for producing thin, plate-like elements having plane-parallel plane surfaces and a predetermined thickness |
| 12/04/2003 | WO2003083522A3 System and method of broad band optical end point detection for film change indication |
| 12/04/2003 | WO2003057404A3 Method and apparatus for applying downward force on wafer during cmp |
| 12/04/2003 | WO2001023135A3 Recyclable retaining ring assembly for a chemical mechanical polishing apparatus |
| 12/04/2003 | US20030224703 Chemical mechanical polishing apparatus having a stepped retaining ring and method for use thereof |
| 12/04/2003 | US20030224678 Web pad design for chemical mechanical polishing |
| 12/04/2003 | US20030224610 Fabrication process for bonded wafer precision layer thickness control and its non-destructructive measurement method |
| 12/04/2003 | US20030224604 Sacrificial polishing substrate for improved film thickness uniformity and planarity |
| 12/03/2003 | EP1366860A1 Non-destructive method for measuring the thickness of a bonded wafer |
| 12/03/2003 | EP1366854A1 Double sided polisher apparatus |
| 12/03/2003 | EP1365889A1 System for magnetorheological finishing of substrates |
| 12/03/2003 | EP1365888A2 Projected gimbal point drive |
| 12/03/2003 | EP1056549B1 A cleaning/buffing apparatus for use in a wafer processing device |
| 12/03/2003 | CN1460398A Multilayer wiring board, method for producing multilayer wiring board, polisher for multilayer wiring board and metal sheet for producing wiring board |
| 12/03/2003 | CN1460043A Method and apparatus for processing semiconductor wafer using novel final polishing method |
| 12/03/2003 | CN1460042A Apparatus and method for chemical mechanical polishing of substrates |
| 12/03/2003 | CN1129960C Method for polishing surface of copper based material mechanically and chemically |
| 12/03/2003 | CN1129554C Ceria oxide liquid and preparing process |
| 12/02/2003 | USRE38340 Multi-point bending of bars during fabrication of magnetic recording heads |
| 12/02/2003 | US6656755 Method for manufacturing semiconductor device by polishing |
| 12/02/2003 | US6656241 Silica-based slurry |
| 12/02/2003 | US6656030 Unsupported chemical mechanical polishing belt |
| 12/02/2003 | US6656026 Wafer polishing apparatus |
| 12/02/2003 | US6656025 Seamless polishing surface |
| 12/02/2003 | US6656024 Method and apparatus for reducing compressed dry air usage during chemical mechanical planarization |
| 12/02/2003 | US6656023 In situ control with lubricant and tracking |
| 12/02/2003 | US6656022 Abrasive grains having remained after polishing are easily removed |
| 12/02/2003 | US6656021 Process for fabricating a semiconductor device |
| 12/02/2003 | US6656020 Polishing apparatus and polishing method |
| 12/02/2003 | US6656019 Grooved polishing pads and methods of use |
| 12/02/2003 | US6656018 Polishing pads useful in chemical mechanical polishing of substrates in the presence of a slurry containing abrasive particles |
| 12/02/2003 | US6655455 Flow completion system |
| 11/27/2003 | WO2003098676A1 Substrate processing apparatus and substrate processing method |
| 11/27/2003 | WO2003098675A1 Apparatus, system and method to reduce wafer warpage |
| 11/27/2003 | WO2003098674A1 Method of inspecting metal film machining residue, inspection apparatus and process for producing thin-film device |
| 11/27/2003 | WO2003097298A1 Non-foamed polishing pad and polishing method therewith |