| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
|---|
| 01/15/2004 | US20040009738 Method and apparatus for chemical and mechanical polishing |
| 01/15/2004 | US20040009637 CMP device and production method for semiconductor device |
| 01/15/2004 | US20040007592 Precision liquid mixing apparatus and method |
| 01/15/2004 | US20040007478 Electroetching system and process |
| 01/15/2004 | US20040006924 For chemical mechanical polishing (CMP) of semiconductors |
| 01/15/2004 | DE20316392U1 Process for polishing thin substrates such as semi conductor wafers has rotary turntable with guide strip to protect against substrate damage |
| 01/14/2004 | EP1380627A1 Cerium based abrasive material and abrasive material slurry, and method for producing cerium based abrasive material |
| 01/14/2004 | EP1380048A1 Method and composition for polishing by cmp |
| 01/14/2004 | EP1379357A2 Method and apparatus for avoiding particle accumulation during an electrochemical mechanical process |
| 01/14/2004 | EP1379356A1 Method and apparatus for end point triggering with integrated steering |
| 01/14/2004 | EP1126952B1 Belt for polishing semiconductors |
| 01/14/2004 | EP0874390B1 Polishing method |
| 01/14/2004 | CN1468446A Slurry for use with fixed-abrasive polishing pads in polishing semiconductor device conductive structures that include copper and tungsten and polishing methods |
| 01/14/2004 | CN1468162A Polishing pad comprising a filled translucent region |
| 01/14/2004 | CN1467817A Semiconductor device manufacture method preventing dishing and erosion during chemical mechanical polishing |
| 01/14/2004 | CN1134522C Polishing compositions |
| 01/14/2004 | CN1134521C Polishing composition and method for manufacturing storage hard disk |
| 01/14/2004 | CN1134323C Modular machine tool for polishing and planting substrates |
| 01/13/2004 | US6677239 Methods and compositions for chemical mechanical polishing |
| 01/13/2004 | US6676822 Method for electro chemical mechanical deposition |
| 01/13/2004 | US6676801 Pressure suppression device for chemical mechanical polishing machine and method thereof |
| 01/13/2004 | US6676718 Polishing composition containing polyethylenimine that forms hydrogen bonding sites with hydrated dielectric layer of silica to form protective film |
| 01/13/2004 | US6676717 Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations |
| 01/13/2004 | US6676497 Vibration damping in a chemical mechanical polishing system |
| 01/13/2004 | US6676496 Apparatus for processing semiconductor wafers |
| 01/13/2004 | US6676493 Integrated planarization and clean wafer processing system |
| 01/13/2004 | US6676492 Chemical mechanical polishing |
| 01/13/2004 | US6676487 Polishing liquid of silicon dioxide powder; x-ray mask deposited on a semiconductor surface |
| 01/13/2004 | US6676484 Copper chemical-mechanical polishing process using a fixed abrasive polishing pad and a copper layer chemical-mechanical polishing solution specifically adapted for chemical-mechanical polishing with a fixed abrasive pad |
| 01/13/2004 | US6676483 Anti-scattering layer for polishing pad windows |
| 01/13/2004 | US6676482 Learning method and apparatus for predictive determination of endpoint during chemical mechanical planarization using sparse sampling |
| 01/13/2004 | US6676383 Method and a pump apparatus for the generation of an adjustable, substantially constant volume flow of a fluid and a use of this method |
| 01/08/2004 | WO2004003987A1 Contamination remover |
| 01/08/2004 | WO2004003986A1 Method and apparatus for applying differential removal rates to a surface of a substrate |
| 01/08/2004 | WO2004002680A1 Apparatus and method for endpoint detection and monitoring for chemical mechanical polishing operations |
| 01/08/2004 | WO2004002676A1 Partial-membrane carrier head |
| 01/08/2004 | WO2003021641A3 Method and apparatus for sensing a wafer in a carrier |
| 01/08/2004 | WO2002050893A3 Process for monitoring a process, planarizing a surface, and for quantifying the results of a planarization process |
| 01/08/2004 | WO2002041369A3 Electropolishing and chemical mechanical planarization |
| 01/08/2004 | US20040005845 Polishing method and apparatus |
| 01/08/2004 | US20040005769 Method and apparatus for endpoint detection |
| 01/08/2004 | US20040003895 Abrasive pad for cmp |
| 01/08/2004 | US20040003894 Method and apparatus for electro-chemical processing |
| 01/07/2004 | EP1207981B1 Spindle assembly for force controlled polishing |
| 01/07/2004 | CN1466676A In-situ method and apparatus for end point detection in chemical mechanical polishing |
| 01/07/2004 | CN1133510C Regenerating treater for waste liquid of inorganic abradant |
| 01/06/2004 | US6673634 Wafer protection method |
| 01/06/2004 | US6672951 Fixed abrasive polishing pad |
| 01/06/2004 | US6672950 Contamination prevention system and method |
| 01/06/2004 | US6672949 Polishing apparatus |
| 01/06/2004 | US6672947 Method for global die thinning and polishing of flip-chip packaged integrated circuits |
| 01/06/2004 | US6672946 Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads |
| 01/06/2004 | US6672941 Method and apparatus for chemical/mechanical planarization (CMP) of a semiconductor substrate having shallow trench isolation |
| 01/06/2004 | US6672940 Surface polishing slurry cooling system |
| 01/02/2004 | EP1377145A1 Multilayer wiring board, method for producing multilayer wiring board, polisher for multilayer wiring board, and metal sheet for producing wiring board |
| 01/02/2004 | EP1375066A2 Wafer polishing apparatus and cleaning method using inert gas |
| 01/02/2004 | EP1372909A1 Support for a polishing belt |
| 01/02/2004 | EP1372908A1 Reinforced polishing pad with a shaped or flexible window structure |
| 01/02/2004 | EP1372907A2 Apparatus and methods for aligning a surface of an active retainer ring with a wafer surface during chemical mechanical polishing |
| 01/01/2004 | US20040002291 Partial-membrane carrier head |
| 01/01/2004 | US20040002289 Method and apparatus for monitoring a polishing condition of a surface of a wafer in a polishing process |
| 01/01/2004 | US20040002171 Method and apparatus for real time metal film thickness measurement |
| 12/31/2003 | WO2004001829A1 Polishing body, polishing device, semiconductor device, and method of manufacturing semiconductor device |
| 12/31/2003 | WO2003077309A3 Method of predicting post-polishing waviness characteristics of a semiconductor wafer |
| 12/31/2003 | WO2003066282A3 Systems and methods for characterizing a polishing process |
| 12/31/2003 | CN1464534A Wafer carrier assembly for a chemical mechanical polishing apparatus and a polishing method using the same |
| 12/31/2003 | CN1132721C Abrasive tool having metal bound phase |
| 12/31/2003 | CN1132719C 研磨用托架、表面研磨装置及表面研磨方法 Polishing bracket, surface grinding surface grinding apparatus and method |
| 12/30/2003 | US6671051 Apparatus and methods for detecting killer particles during chemical mechanical polishing |
| 12/30/2003 | US6670200 Layer-thickness detection methods and apparatus for wafers and the like, and polishing apparatus comprising same |
| 12/30/2003 | US6669748 Dispersion liquid of silica particles for polishing, method of producing the same, and polishing agent |
| 12/30/2003 | US6669540 Chuck means for flat workpieces, in particular semi-conductor wafers |
| 12/30/2003 | US6669539 System for in-situ monitoring of removal rate/thickness of top layer during planarization |
| 12/30/2003 | US6669538 Pad cleaning for a CMP system |
| 12/30/2003 | US6669536 Method of making optical fluoride laser crystal components |
| 12/25/2003 | US20030236057 Polishing apparatus and method, and wafer evacuation program |
| 12/25/2003 | US20030236056 Polishing station of a chemical mechanical polishing apparatus |
| 12/25/2003 | US20030236055 Polishing pad for endpoint detection and related methods |
| 12/25/2003 | US20030234184 Method and composition for polishing a substrate |
| 12/25/2003 | US20030234078 Wafer carrier assembly for a chemical mechanical polishing apparatus and a polishing method using the same |
| 12/24/2003 | WO2003107408A1 Polisher |
| 12/24/2003 | WO2003107407A1 Method of polishing organic insulating film of semiconductor integrated circuit |
| 12/24/2003 | WO2003015981A3 Improved chemical mechanical polishing compositions for metal and associated materials and method of using same |
| 12/24/2003 | CN1463467A Electrolytic processing device and substrate processing appts. |
| 12/24/2003 | CN1463287A Cerium oxide slurry, and method of mfg. substrate |
| 12/24/2003 | CN1462666A High accuracy barrel finishing machine with full automatic adjustable pressure and dual stepless speed changing |
| 12/24/2003 | CN1131765C 带有可装载的罩的换向线性抛光机 Cover with loadable commutation linear polishing machine |
| 12/23/2003 | US6667239 Chemical mechanical polishing of copper-oxide damascene structures |
| 12/23/2003 | US6667238 Polishing method and apparatus |
| 12/23/2003 | US6666959 Semiconductor workpiece proximity plating methods and apparatus |
| 12/23/2003 | US6666948 Silicon wafer polisher |
| 12/23/2003 | US6666756 Wafer carrier head assembly |
| 12/23/2003 | US6666755 Belt wiper for a chemical mechanical planarization system |
| 12/23/2003 | US6666754 Method and apparatus for determining CMP pad conditioner effectiveness |
| 12/23/2003 | US6666752 Wafer retainer and method for attaching/detaching the wafer retainer to/from polishing machine base plate |
| 12/23/2003 | US6666751 Deformable pad for chemical mechanical polishing |
| 12/23/2003 | US6666749 Apparatus and method for enhanced processing of microelectronic workpieces |
| 12/23/2003 | US6666326 Reinforced chemical mechanical planarization belt |
| 12/18/2003 | WO2003105191A2 Subpad having robust, sealed edges |
| 12/18/2003 | WO2003104351A1 Metal oxide powder for high precision polishing and method of preparation thereof |