| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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| 02/05/2004 | US20040021125 To polish and remove a barrier metal film |
| 02/05/2004 | US20040020789 For planarizing a substrate surface |
| 02/05/2004 | US20040020788 For electrochemical mechanical polishing and/or electropolishing |
| 02/05/2004 | US20040020135 For chemical mechanical polishing conducted in a step of forming a buried type copper-based metal interconnection of a semiconductor device |
| 02/05/2004 | US20040020134 Cmp slurry composition and a method for planarizing semiconductor device using the same |
| 02/05/2004 | US20040020133 Easily removable |
| 02/04/2004 | EP1386708A2 Particulate products made by an aerosol method |
| 02/04/2004 | EP1386695A2 Conductive polishing article for electrochemical mechanical polishing |
| 02/04/2004 | EP1385915A1 Polishing composition having a surfactant |
| 02/04/2004 | EP1385671A2 Recyclable retaining ring assembly for a chemical mechanical polishing apparatus |
| 02/04/2004 | CN1473358A Abrasive cloth, polishing device and method for manufacturing semiconductor device |
| 02/04/2004 | CN1473357A Substrate processing method |
| 02/04/2004 | CN1473186A Cerium-based polishing material slurry and mehtod for manufacturing the same |
| 02/04/2004 | CN1137504C Piezoelectric actuated chemical mechanical polishing tray |
| 02/04/2004 | CN1137232C New type abrasive composition used in integrated circuit electronic industry |
| 02/04/2004 | CN1137013C Improved polishing pads and methods relating thereof |
| 02/03/2004 | US6686285 Semiconductor device manufacture method preventing dishing and erosion during chemical mechanical polishing |
| 02/03/2004 | US6686023 Polished-piece holder and manufacturing method thereof |
| 02/03/2004 | US6685796 CMP uniformity |
| 02/03/2004 | US6685757 Polishing composition |
| 02/03/2004 | US6685548 Grooved polishing pads and methods of use |
| 02/03/2004 | US6685543 Compensating chemical mechanical wafer polishing apparatus and method |
| 02/03/2004 | US6685540 Polishing pad comprising particles with a solid core and polymeric shell |
| 02/03/2004 | US6685537 Punching or drilling apertures on scouring surfaces, then filling with acrylated resins and curing to from radiation transparent openings for in situ monitoring of wafers during abrasion |
| 02/03/2004 | US6684704 Measuring the surface properties of polishing pads using ultrasonic reflectance |
| 01/29/2004 | WO2004010487A1 Semiconductor abrasive, process for producing the same and method of polishing |
| 01/29/2004 | WO2004009718A1 Method of polishing a substrate with a polishing system containing conducting polymer |
| 01/29/2004 | WO2004009291A1 Polishing pad for endpoint detection and related methods |
| 01/29/2004 | WO2004009289A2 Rising after chemical-mechanical planarization process applied on a wafer |
| 01/29/2004 | WO2003019627A3 Cmp process involving frequency analysis-based monitoring |
| 01/29/2004 | US20040018949 Semiconductor process residue removal composition and process |
| 01/29/2004 | US20040018809 Polishing pad for use in chemical/mechanical planarization of semiconductor wafers having a transparent window for end-point determination and method of making |
| 01/29/2004 | US20040018808 Belt tensioning assembly for CMP apparatus |
| 01/29/2004 | US20040018807 Polishing pad conditioner and chemical-mechanical polishing apparatus having the same |
| 01/29/2004 | US20040018806 Wafer polisher |
| 01/29/2004 | US20040018805 Polishing pad and method of manufacture |
| 01/29/2004 | US20040018804 Retaining rings, planarizing apparatuses including retaining rings, and methods for planarizing micro-device workpieces |
| 01/29/2004 | US20040018728 Chemical mechanical polishing solution for platinum |
| 01/29/2004 | US20040016895 In-situ detection of thin-metal interface using optical interference via a dynamically updated reference |
| 01/29/2004 | US20040016507 Chemical mechanical polishing equipment |
| 01/28/2004 | EP1384553A2 A polishing machine with driving means to move the grinding tool along a precession path and method to use it |
| 01/28/2004 | EP1250390B1 Composition and method for planarizing surfaces |
| 01/28/2004 | EP1234009B1 Composition and method for planarizing surfaces |
| 01/28/2004 | CN1471726A Polishing device and method of manufacturing semiconductor device |
| 01/28/2004 | CN1471725A Polishing progress monitoring method and device thereof, polishing device, semiconductor device production method, and semiconductor device |
| 01/28/2004 | CN1471141A Chemical machinery grinding equipment |
| 01/27/2004 | US6682628 Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies |
| 01/27/2004 | US6682575 Methanol-containing silica-based CMP compositions |
| 01/27/2004 | US6682409 Wafer carrier structure for chemical-mechanical polisher |
| 01/27/2004 | US6682408 Polishing apparatus |
| 01/27/2004 | US6682406 Abrasive cleaning tool for removing contamination |
| 01/27/2004 | US6682404 Method for controlling a temperature of a polishing pad used in planarizing substrates |
| 01/27/2004 | US6682402 Reaction injection molding |
| 01/27/2004 | US6682399 Pressure monitoring system for chemical-mechanical polishing |
| 01/27/2004 | US6682398 Method for characterizing the planarizing properties of an expendable material combination in a chemical-mechanical polishing process; simulation technique; and polishing technique |
| 01/27/2004 | US6682396 Apparatus and method for linear polishing |
| 01/27/2004 | US6681850 Flow completion system |
| 01/22/2004 | WO2003034804A3 Preparation of high performance silica slurry using a centrifuge |
| 01/22/2004 | WO2003022519A3 Slurry distributor for chemical mechanical polishing apparatus and method of using the same |
| 01/22/2004 | US20040014414 Polishing cloth for and method of texturing a surface |
| 01/22/2004 | US20040014413 Polishing pad and multi-layer polishing pad |
| 01/22/2004 | US20040014403 CMP point of use filtration |
| 01/22/2004 | US20040014401 Method for backside die thinning and polishing of packaged integrated circuits |
| 01/22/2004 | US20040014399 Selective barrier removal slurry |
| 01/22/2004 | US20040014398 Method of polishing a substrate with a polishing system containing conducting polymer |
| 01/22/2004 | US20040014396 Methods and systems for planarizing workpieces, e.g., microelectronic workpieces |
| 01/22/2004 | US20040014395 Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations |
| 01/22/2004 | US20040014321 Methods for manufacturing contact plugs for semiconductor devices |
| 01/22/2004 | US20040014319 Prevention of precipitation defects on copper interconnects during cpm by use of solutions containing organic compounds with silica adsorption and copper corrosion inhibiting properties |
| 01/22/2004 | US20040014318 Slurry for use with fixed-abrasive polishing pads in polishing semiconductor device conductive structures that include copper and tungsten |
| 01/22/2004 | US20040013798 Comprises luminophores/phosphors; vapor phase deposition |
| 01/22/2004 | US20040012795 Planarizing machines and control systems for mechanical and/or chemical-mechanical planarization of microelectronic substrates |
| 01/22/2004 | US20040011991 Use of a gettering agent in a chemical mechanical polishing and rinsing operation and apparatus therefor |
| 01/22/2004 | US20040011462 Method and apparatus for applying differential removal rates to a surface of a substrate |
| 01/22/2004 | US20040011461 Apparatus and method of controlling the temperature of polishing pads used in planarizing micro-device workpieces |
| 01/22/2004 | US20040010979 Polishes comprising nanostructure abrasives, oxidizers, water and acids selected from sulfurous, persulfuric, phosphoric, phosphonic, phosphinic, pyrophosphoric, tripolyphosphoric or sulfamic acid; reducing scratching of substrates |
| 01/22/2004 | US20040010978 Abrasive material |
| 01/22/2004 | DE10230146A1 Verfahren zum Bearbeiten eines scheibenförmigen Werkstückes A method for processing a disk-shaped workpiece |
| 01/21/2004 | EP1381492A1 A chemical mechanical planarization system with an adjustable force applying air platen |
| 01/21/2004 | EP1381491A2 Conductive polishing article for electrochemical mechanical polishing |
| 01/21/2004 | CN1469794A Methods, apparatus and slurries for chemical mechanical planarization |
| 01/21/2004 | CN1469454A Method for producing contact plug of semiconductor device |
| 01/21/2004 | CN1468685A Method for processing disc-shaped workpieces |
| 01/20/2004 | US6679937 Copper powders methods for producing powders and devices fabricated from same |
| 01/20/2004 | US6679929 Abrasive, aliphatic carboxylic acid, a base, polishing acclerating compound such as citric acid, anticorrosive such as benzotriazole, hydrogen peroxide, and water; for semiconductors containing copper and a tantalum compound |
| 01/20/2004 | US6679928 Polishing composition having a surfactant |
| 01/20/2004 | US6679769 Cooling, machining |
| 01/20/2004 | US6679765 Slurry supply system disposed above the rotating platen of a chemical mechanical polishing apparatus |
| 01/20/2004 | US6679764 Supply system for chemicals and its use |
| 01/20/2004 | US6679763 Apparatus and method for qualifying a chemical mechanical planarization process |
| 01/20/2004 | US6679762 Recession control via thermal expansion coefficient differences in recording heads during lapping |
| 01/20/2004 | US6679759 Method of manufacturing silicon wafer |
| 01/20/2004 | US6679756 Method and apparatus for monitoring polishing state, polishing device, process wafer, semiconductor device, and method of manufacturing semiconductor device |
| 01/15/2004 | WO2004004971A2 Lapping method and lapping tool for glass balls |
| 01/15/2004 | WO2002053273A8 Process and apparatus for blending and distributing a slurry solution |
| 01/15/2004 | WO2002047139A3 Methode of forming a copper film on a substrate |
| 01/15/2004 | US20040010380 Method of detecting a polishing end point in a chemical mechanical polishing process |
| 01/15/2004 | US20040009742 Polishing pad conditioning disks for chemical mechanical polisher |
| 01/15/2004 | US20040009740 Method and composition for chemical polishing |
| 01/15/2004 | US20040009739 Dual-purpose lapping guide for the production of magneto-resistive heads |