| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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| 02/26/2004 | WO2003104343A3 Method for chemical mechanical polishing (cmp) of low-k dielectric materials |
| 02/26/2004 | US20040038632 Conditioner of chemical-mechanical polishing station |
| 02/26/2004 | US20040038631 Polishing pad showing intrinsic abrasion and fabrication method thereof |
| 02/26/2004 | US20040038628 Method and device for grinding particulates |
| 02/26/2004 | US20040038625 Carrier assemblies, planarizing apparatuses including carrier assemblies, and methods for planarizing micro-device workpieces |
| 02/26/2004 | US20040038624 Multiprobe detection system for chemical-mechanical planarization tool |
| 02/26/2004 | US20040038623 Methods and systems for conditioning planarizing pads used in planarizing substrates |
| 02/26/2004 | US20040038544 Method for processing a semiconductor wafer using double-side polishing |
| 02/26/2004 | US20040038534 Apparatus and method for conditioning a polishing pad used for mechanical and/or chemical-mechanical planarization |
| 02/26/2004 | US20040038502 Method of detecting chemical mechanical polishing endpoints in thin film head processes |
| 02/26/2004 | US20040038469 Method of processing a semiconductor wafer |
| 02/26/2004 | US20040038024 Adhesive tape for polishing pad and polishing tape |
| 02/26/2004 | US20040036149 Abrasive used for planarization of semiconductor device and method of manufacturing semiconductor device using the abrasive |
| 02/26/2004 | US20040035153 Method of producing a glass substrate for a mask blank, method of producing a mask blank, method of producing a transfer mask, method of producing a semiconductor device, glass substrate for a mask blank, mask blank, and transfer mask |
| 02/26/2004 | DE10252049A1 Slurry for chemical/mechanical polishing of wafer, contains metal oxide abrasive particles, removal rate accelerator, anionic polymeric passivation agent, anionic passivation agent having one to twelve carbon, and water |
| 02/25/2004 | EP1390967A2 Method of sealing wafer backside for full-face electrochemical plating |
| 02/25/2004 | EP1390820A2 Apparatus and methods with resolution enhancement feature for improving accuracy of conversion of required chemical mechanical polishing pressure to force to be applied by polishing head to wafer |
| 02/25/2004 | EP1390176A1 Integrated endpoint detection system with optical and eddy current monitoring |
| 02/25/2004 | CN1477619A Grinding guide with dual-purpose for producing magnetoresistive head |
| 02/24/2004 | US6695682 Polishing method and polishing apparatus |
| 02/19/2004 | WO2004015752A1 Method and apparatus for polishing wafer |
| 02/19/2004 | WO2004015751A1 Method of machining semiconductor wafer-use polishing pad and semiconductor wafer-use polishing pad |
| 02/19/2004 | WO2004015021A1 Cmp abrasive and substrate polishing method |
| 02/19/2004 | WO2004014608A1 Method and device for polishing substrate |
| 02/19/2004 | WO2004014607A1 A method of polishing a wafer of material |
| 02/19/2004 | WO2004014603A2 Polishing pad with window |
| 02/19/2004 | WO2003038858A8 A semiconductor manufacturing apparatus having a built-in inspection apparatus and method therefor |
| 02/19/2004 | US20040034516 Method for characterizing and simulating a chemical mechanical polishing process |
| 02/19/2004 | US20040033769 Carrier head with a flexible membrane for a chemical mechanical polishing system |
| 02/19/2004 | US20040033764 Chemical/mechanical polishing slurry and chemical mechanical polishing method using the same |
| 02/19/2004 | US20040033763 Storage device slider with sacrificial lapping extension |
| 02/19/2004 | US20040033761 Polishing apparatus |
| 02/19/2004 | US20040033760 Grid relief in CMP polishing pad to accurately measure pad wear, pad profile and pad wear profile |
| 02/19/2004 | US20040033759 Platen and manifold for polishing workpieces |
| 02/19/2004 | US20040033758 Polishing pad with window |
| 02/19/2004 | US20040033757 Methods and systems for planarizing microelectronic devices with Ge-Se-Ag layers |
| 02/19/2004 | US20040033693 Slurry for chemical mechanical polishing process and method of manufacturing semiconductor device using the same |
| 02/19/2004 | US20040033690 Method for polishing a substrate surface |
| 02/19/2004 | US20040032256 Frequency measuring device, polishing device using the same and eddy current sensor |
| 02/19/2004 | US20040031206 >/= 95% of total rare earth oxides (TREO) and has < 3% of fluorine; particle size distribution determined by a laser diffraction method is within a predetermined range |
| 02/18/2004 | EP1389506A1 Automatic metallographic polishing apparatus |
| 02/18/2004 | EP1389505A2 Polishing apparatus |
| 02/18/2004 | EP1389152A1 Delivery system for magnetorheological fluid |
| 02/18/2004 | EP1190006B1 Slurry composition and method of chemical mechanical polishing using same |
| 02/18/2004 | CN1476368A Abrasive article having window system for polishing wafers, and methods |
| 02/18/2004 | CN1476367A Polishing pad, method of mfg. polishing pad, and cushion layer polishing pad |
| 02/18/2004 | CN1476366A Tool for applying resilient tape to chuck used for grinding or polishing wafers |
| 02/18/2004 | CN1475786A Manufacturing method of electronic microscope fixed point test piece |
| 02/18/2004 | CN1475604A Solution used for platinum chemical mechanical polishing |
| 02/18/2004 | CN1475540A Chemical/mechanical polishing paste and chemical mechanical polishing method using said paste |
| 02/18/2004 | CN1139106C Equipment and method for transporting substrate mechanical polishing and grinding suspension |
| 02/18/2004 | CN1138612C Wafer edge polishing method and apparatus |
| 02/17/2004 | US6693036 Method for producing semiconductor device polishing apparatus, and polishing method |
| 02/17/2004 | US6693034 Deadhesion method and mechanism for wafer processing |
| 02/17/2004 | US6692546 For use in polishing metal films in semiconductor interconnection procedures |
| 02/17/2004 | US6692342 Wafer abrasive machine |
| 02/17/2004 | US6692341 Abrasive machine |
| 02/17/2004 | US6692339 Combined chemical mechanical planarization and cleaning |
| 02/17/2004 | US6692338 Through-pad drainage of slurry during chemical mechanical polishing |
| 02/17/2004 | US6692221 Method of adhering wafer and wafer adhering device |
| 02/12/2004 | WO2004013656A2 Uniform thin films produced by magnetorheological finishing |
| 02/12/2004 | WO2004012906A1 Abrasive articles with a liner with protrusions and methods of making and using the same |
| 02/12/2004 | WO2003026001A3 Integrated equipment set for forming an interconnect on a substrate |
| 02/12/2004 | US20040029503 System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal control |
| 02/12/2004 | US20040029502 Carrier assemblies, planarizing apparatuses including carrier assemblies, and methods for planarizing micro-device workpieces |
| 02/12/2004 | US20040029501 Segmented wafer polishing pad |
| 02/12/2004 | US20040029495 Catalytic composition for chemical-mechanical polishing, method of using same, and substrate treated with same |
| 02/12/2004 | US20040029493 Uniform thin films produced by magnetorheological finishing |
| 02/12/2004 | US20040029490 Apparatuses and methods for in-situ optical endpointing on web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies |
| 02/12/2004 | US20040029489 Polishing apparatus |
| 02/12/2004 | US20040029333 Polishing device and method of manufacturing semiconductor device |
| 02/12/2004 | US20040029316 Method for assembling planar workpieces |
| 02/12/2004 | US20040028346 Polishing pad for polishing optical fiber connectors |
| 02/12/2004 | US20040025444 Mixture of oxidizer and abrasive; activation free radicals; for semiconductors, integrated circuits |
| 02/12/2004 | DE10234956A1 Verfahren zum Steuern des chemisch mechanischen Polierens von gestapelten Schichten mit einer Oberflächentopologie A method for controlling the chemical mechanical polishing of stacked layers with a surface topology |
| 02/12/2004 | DE10010287B4 Verfahren zur Herstellung von flüssigen Gemischen für das chemisch-mechanische Polieren von Wafern Process for the preparation of liquid mixtures for chemical mechanical polishing of wafers |
| 02/11/2004 | EP1214174B1 Windowless belt and method for in-situ wafer monitoring |
| 02/11/2004 | CN1474735A Polishing pad comprising particulate polymer and crosslinked polymer binder |
| 02/11/2004 | CN1474734A Method of chemical polishing |
| 02/10/2004 | US6690473 Integrated surface metrology |
| 02/10/2004 | US6689691 Method of simultaneously polishing a plurality of objects of a similar type, in particular silicon wafers, on a polishing installation |
| 02/10/2004 | US6689258 Electrochemically generated reactants for chemical mechanical planarization |
| 02/10/2004 | US6689186 Silver-containing particles, method and apparatus of manufacture, silver-containing devices made therefrom |
| 02/10/2004 | US6689178 For polishing glass materials; precision and cutting property; magnetic recording media such as hard disks, glass substrates of liquid crystal displays |
| 02/10/2004 | US6688969 Method for planarizing a dielectric layer of a flash memory device |
| 02/10/2004 | US6688957 Substrate polishing article |
| 02/10/2004 | US6688956 Substrate polishing device and method |
| 02/10/2004 | US6688945 CMP endpoint detection system |
| 02/05/2004 | WO2004012249A1 Polishing device |
| 02/05/2004 | WO2003032374A3 Workpiece carrier with adjustable pressure zones and barriers |
| 02/05/2004 | US20040023610 Polishing article for processing a substrate comprises a fabric layer having a conductive layer disposed thereover. The conductive layer has an exposed surface adapted to polish a substrate. The fabric layer may be woven or non-woven. The |
| 02/05/2004 | US20040023609 Wafer holding ring for checmial and mechanical polisher |
| 02/05/2004 | US20040023607 Method and apparatus for integrated chemical mechanical polishing of copper and barrier layers |
| 02/05/2004 | US20040023606 Advanced chemical mechanical polishing system with smart endpoint detection |
| 02/05/2004 | US20040023602 Chemical mechanical polishing and pad dressing method |
| 02/05/2004 | US20040023597 Method for seasoning a polishing pad |
| 02/05/2004 | US20040023495 Contacts for electrochemical processing |
| 02/05/2004 | US20040023492 Method for planarizing metal interconnects |
| 02/05/2004 | US20040023490 Method of controlling the chemical mechanical polishing of stacked layers having a surface topology |
| 02/05/2004 | US20040021243 Adding and mixing a resin containing active hydrogen functional groups with additives and an auxiliary gas, and resin containing -NCO functional groups, and injecting and foaming the mixture in a mold to produce a microporous pad |