| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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| 03/23/2004 | US6709321 Processing jig |
| 03/23/2004 | US6709317 Method and apparatus for uniformly planarizing a microelectronic substrate |
| 03/23/2004 | US6709314 Chemical mechanical polishing endpoinat detection |
| 03/23/2004 | US6709313 Apparatus for producing polishing solution and apparatus for feeding the same |
| 03/23/2004 | US6709312 Method and apparatus for monitoring a polishing condition of a surface of a wafer in a polishing process |
| 03/18/2004 | US20040054023 Having uniform foam structure; pads useful for polishing applications for semiconductor wafers and the like with high accuracy and high efficiency |
| 03/18/2004 | US20040053570 Novel finishing pad design for multidirectional use |
| 03/18/2004 | US20040053567 End effectors and methods for manufacturing end effectors with contact elements to condition polishing pads used in polishing micro-device workpieces |
| 03/18/2004 | US20040053566 CMP platen with patterned surface |
| 03/18/2004 | US20040053562 Method for securing a polishing pad to a platen for use in chemical-mechanical polishing of wafers |
| 03/18/2004 | US20040053560 Control of removal profile in electrochemically assisted CMP |
| 03/18/2004 | US20040053559 Polishing apparatus and method of bonding and removing expendable replacement components thereof |
| 03/18/2004 | US20040053558 Working shape prediction method, working requirement determination method, working method, working system, method of manufacturing semiconductor device, computer program, and computer program storage medium |
| 03/18/2004 | US20040053512 Process control in electrochemically assisted planarization |
| 03/18/2004 | US20040053500 Polishing progress monitoring method and device thereof, polishing device, semiconductor device production method, and semiconductor device |
| 03/18/2004 | US20040053499 Method and composition for polishing a substrate |
| 03/18/2004 | US20040053007 Used for transporting square or rectangular substrates, such as a glass substrate for a display or the like; substrate is used for producing a display panel of, for example, a liquid crystal display device; nonwarping, dustless |
| 03/18/2004 | US20040052154 Chemical solution feeding apparatus and method for preparing slurry |
| 03/18/2004 | US20040050715 Electrolyte mixture of alkylene glycol and chloride salt; etching using hydrogen fluoride; recovering, reuse |
| 03/18/2004 | DE10333810A1 Verfahren zum Bearbeiten eines Halbleiterwafers einschließlich Schleifen der Rückseite A method of processing a semiconductor wafer including grinding the back |
| 03/17/2004 | EP1397828A1 Electrolytic processing device and substrate processing apparatus |
| 03/17/2004 | EP1397458A1 A silica and a silica-based slurry |
| 03/17/2004 | EP1397452A1 A silica-based slurry |
| 03/17/2004 | EP1084009B1 Cmp pad conditioner arrangement and method therefor |
| 03/17/2004 | EP0706582B2 Improved compositions and methods for polishing |
| 03/17/2004 | CN1482958A Methods for making reinforced wafer polshing pads and apparatuses implementing the same |
| 03/17/2004 | CN1482943A Process and apparatus for blending and distributing a slurry solution |
| 03/17/2004 | CN1142581C Chemical machine polishing method combined with rotary coating |
| 03/16/2004 | US6706383 Polishing pad support that improves polishing performance and longevity |
| 03/16/2004 | US6706158 Electrochemical mechanical planarization |
| 03/16/2004 | US6706140 Control system for in-situ feeding back a polish profile |
| 03/16/2004 | US6706139 Method and apparatus for cleaning a web-based chemical mechanical planarization system |
| 03/16/2004 | US6705935 Abrasive molding and abrasive disc provided with same |
| 03/16/2004 | US6705934 Polishing pad |
| 03/16/2004 | US6705932 Carrier head for chemical mechanical polishing |
| 03/16/2004 | US6705930 System and method for polishing and planarizing semiconductor wafers using reduced surface area polishing pads and variable partial pad-wafer overlapping techniques |
| 03/16/2004 | US6705928 Through-pad slurry delivery for chemical-mechanical polish |
| 03/16/2004 | US6705927 Method of producing magnetic hard disk substrate with textured surface |
| 03/16/2004 | US6705926 A trialkylborate, a borinic acid, boronic acid, borinate ester, or boronate ester, benzodioxaborole compound; abrasive water slurry; chemical mechanical polishing |
| 03/16/2004 | US6705924 Carrier head with a substrate detection mechanism for a chemical mechanical polishing system |
| 03/16/2004 | US6705923 Chemical mechanical polisher equipped with chilled wafer holder and polishing pad and method of using |
| 03/16/2004 | US6705922 Method and apparatus for polishing a semiconductor substrate wafer |
| 03/11/2004 | WO2004021432A1 Protective structure of semiconductor wafer, method for protecting semiconductor wafer, multilayer protective sheet used therein, and method for processing semiconductor wafer |
| 03/11/2004 | WO2004021426A1 Polishing pad, polishing plate hole cover, polishing apparatus, polishing method, and method for manufacturing semiconductor device |
| 03/11/2004 | WO2004020545A1 Method and apparatus for chemically, mechanically, and/or electrolytically removing material from microelectronic substrates |
| 03/11/2004 | WO2004020148A1 Method and apparatus for electromechanically and/or electrochemically-mechanically removing conductive material from a microelectronic substrate |
| 03/11/2004 | WO2003038862A3 Pads for cmp and polishing substrates |
| 03/11/2004 | US20040048564 Polishing pads and methods relating thereto |
| 03/11/2004 | US20040048562 Polishing pads and methods relating thereto |
| 03/11/2004 | US20040048559 Chemical mechanical polishing pad with micro-holes |
| 03/11/2004 | US20040048554 Method for polishing surface of semiconductor device substrate |
| 03/11/2004 | US20040048553 Polishing head of chemical mechanical polishing apparatus |
| 03/11/2004 | US20040048552 Multi-zone grinding and/or polishing sheet |
| 03/11/2004 | US20040048550 Modular method for chemical mechanical planarization |
| 03/11/2004 | US20040046148 Composition for chemical mechanical planarization of copper, tantalum and tantalum nitride |
| 03/11/2004 | US20040045466 Lithographic printing plate support and method of manufacturing the same |
| 03/10/2004 | EP1395394A1 Polishing apparatus and polishing pad |
| 03/10/2004 | EP1395392A1 Improved method and apparatus for bi-directionally polishing a workpiece |
| 03/10/2004 | CN1481295A Polishing platen with pressurized membrane |
| 03/10/2004 | CN1481294A Belt polishing device with double retainer ring |
| 03/10/2004 | CN1480503A Abradant, grinding method for substrate, and mfg. method for semiconductor device |
| 03/10/2004 | CN1141202C Retaining device for grinded basilar plate |
| 03/09/2004 | US6703318 Method of planarizing a semiconductor die |
| 03/09/2004 | US6702954 Chemical-mechanical polishing slurry and method |
| 03/09/2004 | US6702866 Homogeneous fixed abrasive polishing pad |
| 03/09/2004 | US6702658 Wafer polishing apparatus utilizing an Oldham's coupling mechanism for the wafer carrier |
| 03/09/2004 | US6702654 Conditioning wheel for conditioning a semiconductor wafer polishing pad and method of manufacture thereof |
| 03/09/2004 | US6702651 Method and apparatus for conditioning a polishing pad |
| 03/09/2004 | US6702648 Use of scatterometry/reflectometry to measure thin film delamination during CMP |
| 03/09/2004 | US6702646 Method and apparatus for monitoring polishing plate condition |
| 03/09/2004 | US6701972 Vacuum load lock, system including vacuum load lock, and associated methods |
| 03/04/2004 | WO2004019395A1 Polishing pad and polishing method |
| 03/04/2004 | WO2003072669A3 Polishing composition |
| 03/04/2004 | WO2002102920A8 A silica and a silica-based slurry |
| 03/04/2004 | WO2002053320A9 Wafer support for chemical mechanical planarization |
| 03/04/2004 | WO2002049805A8 Polishing platen with pressurized membrane |
| 03/04/2004 | US20040043713 Polishing machine |
| 03/04/2004 | US20040043709 Process for machining a wafer-like workpiece |
| 03/04/2004 | US20040043707 Method of polishing semiconductor wafer |
| 03/04/2004 | US20040043706 Method and apparatus for polishing and planarization |
| 03/04/2004 | US20040043705 Method and apparatus for chemically, mechanically, and/or electrolytically removing material from microelectronic substrates |
| 03/04/2004 | US20040043702 Chemical-mechanical polishing slurry for polishing metal films |
| 03/04/2004 | US20040043699 Apparatus and method for mechanical and/or chemical-mechanical planarization of micro-device workpieces |
| 03/04/2004 | US20040043698 Polishing pad design |
| 03/04/2004 | US20040043616 Method for processing a semiconductor wafer including back side grinding |
| 03/04/2004 | US20040043608 Method for manufacturing semiconductor device and apparatus for manufacturing thereof |
| 03/04/2004 | US20040043521 In-situ chemical-mechanical planarization pad metrology using ultrasonic imaging |
| 03/04/2004 | US20040040656 For semiconductor substrate; curing adhesive between substrate and confining ring |
| 03/03/2004 | EP1394202A2 Composition for polishing pad and polishing pad therewith |
| 03/03/2004 | EP1393858A2 Polishing machine |
| 03/03/2004 | CN1479942A Method for determinating endpoint and semiconductor wafer |
| 03/03/2004 | CN1479665A Actived slurry chemical mechanical planarization system and method for implenting the same |
| 03/02/2004 | US6699920 Methods of manufacturing polishing substrates |
| 03/02/2004 | US6699791 Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies |
| 03/02/2004 | US6699304 Palladium-containing particles, method and apparatus of manufacture, palladium-containing devices made therefrom |
| 03/02/2004 | US6699115 Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus |
| 03/02/2004 | US6699107 Polishing head and apparatus with an improved pad conditioner for chemical mechanical polishing |
| 03/02/2004 | US6699104 Elimination of trapped air under polishing pads |
| 03/02/2004 | US6699102 Lapping monitor for monitoring the lapping of transducers |
| 02/26/2004 | WO2004017386A2 Carrier including a multi-volume diaphragm for polishing a semiconductor wafer and a method therefor |