| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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| 04/08/2004 | US20040067860 Cleaning compositions and methods of use thereof |
| 04/08/2004 | US20040067723 Retaining ring for holding semiconductor wafers in a chemical mechanical polishing apparatus |
| 04/08/2004 | US20040067720 Method and apparatus for reducing compressed dry air usage during chemical mechanical planarization |
| 04/08/2004 | US20040067719 Apparatus and method of detecting a substrate in a carrier head |
| 04/08/2004 | US20040067718 Polishing apparatus |
| 04/08/2004 | US20040067717 Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece |
| 04/08/2004 | US20040067652 Method for polishing organic film on semiconductor substrate by use of resin particles, and slurry |
| 04/08/2004 | US20040067649 Silica and silica-based slurry |
| 04/08/2004 | US20040065864 Mixture of colloidal silica abrasive and halide compound; shallow channel isolation |
| 04/08/2004 | US20040065412 Retaining ring for holding semiconductor wafers in a chemical mechanical polishing apparatus |
| 04/08/2004 | US20040065022 Slurry containing mixture of cerium compound and hydroxide; forming shallow channels in semiconductors |
| 04/08/2004 | US20040065020 Polishing semiconductors using aqueous solution of polymer; smoothness thin films |
| 04/07/2004 | EP1405886A1 Polishing composition |
| 04/07/2004 | EP1405885A2 Wafer edge polishing composition and polishing method using the same |
| 04/07/2004 | EP1405336A2 Substrate processing method |
| 04/07/2004 | EP1404487A1 Substrate polishing machine |
| 04/07/2004 | CN1487965A Thermoplastic polyurethane foam, process for production thereof and polishing pads made of the foam |
| 04/07/2004 | CN1487868A Pressure vessel systems and methods for dispensing liquid chemical compositions |
| 04/07/2004 | CN1487867A Catalytic reactive pad for metal CMP |
| 04/07/2004 | CN1487566A Semiconductor chip processing method including back surface lapping |
| 04/07/2004 | CN1487015A Composition for grinding pad and grinding pad using the same |
| 04/07/2004 | CN1486820A Grinding device for hopper body gasket for cathode-ray tube |
| 04/07/2004 | CN1145201C Abrasive sheet |
| 04/06/2004 | US6716802 Polishing systems, methods of polishing substrates, and methods of preparing liquids for semiconductor fabrication processes |
| 04/06/2004 | US6716755 Composition and method for planarizing surfaces |
| 04/06/2004 | US6716735 Method for forming metal lines of semiconductor device |
| 04/06/2004 | US6716364 Method and apparatus for detecting presence of residual polishing slurry subsequent to polishing of a semiconductor wafer |
| 04/06/2004 | US6716299 Profiled retaining ring for chemical mechanical planarization |
| 04/06/2004 | US6716094 Chemical mechanical polishing retaining ring |
| 04/06/2004 | US6716093 Low friction gimbaled substrate holder for CMP apparatus |
| 04/06/2004 | US6716092 Providing a polishing pad having a layer of adhesive that covers substantially an entire surface of the pad, and curing selected portions of the adhesive layer to reduce adhesive strength of the layer |
| 04/06/2004 | US6716090 Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads |
| 04/06/2004 | US6716089 Method for controlling pH during planarization and cleaning of microelectronic substrates |
| 04/06/2004 | US6716087 Method for dressing a polishing pad, polishing apparatus, and method for manufacturing a semiconductor apparatus |
| 04/06/2004 | US6716086 Edge contact loadcup |
| 04/06/2004 | US6716085 Optical monitoring system and a computer that analyzes a signal from the detector and calculates whether the endpoint has been detected |
| 04/06/2004 | US6716084 Carrier head for holding a wafer and allowing processing on a front face thereof to occur |
| 04/01/2004 | WO2004027837A1 Temperature-controlled substrate holder |
| 04/01/2004 | WO2004027411A1 System and method for metal residue detection and mapping within a multi-step sequence |
| 04/01/2004 | WO2004026983A1 Polishing media for chemical mechanical planarization (cmp) |
| 04/01/2004 | WO2003072669A9 Polishing composition |
| 04/01/2004 | US20040063391 Composition for polishing pad and polishing pad therewith |
| 04/01/2004 | US20040063387 Through-pad slurry delivery for chemical-mechanical polish |
| 04/01/2004 | US20040063385 Method of controlling carrier head with multiple chambers |
| 04/01/2004 | US20040063224 Feedback control of a chemical mechanical polishing process for multi-layered films |
| 04/01/2004 | US20040060814 Electrochemical mechanical planarization |
| 04/01/2004 | US20040060607 Flow control system |
| 03/31/2004 | EP1403351A1 Polishing composition and polishing method using the same |
| 03/31/2004 | EP1401614A1 Control of chemical mechanical polishing pad conditioner directional velocity to improve pad life |
| 03/31/2004 | EP1234010B1 Use of cesium hydroxide in a dielectric cmp slurry |
| 03/31/2004 | CN1486505A Ammonium oxalate-containing polishing system and method |
| 03/31/2004 | CN1486487A Processing method and apparatus of hard disk medium surface in such operations as dynamic electronic test |
| 03/31/2004 | CN1486233A Polishing pad and method of use thereof |
| 03/31/2004 | CN1485393A Abrasive used for planarization of semiconductor device and method of manufacturing semiconductor device using the abrasive |
| 03/31/2004 | CN1485180A Chemical mechanical polishing and pad dressing method |
| 03/30/2004 | US6712681 Polishing pads with polymer filled fibrous web, and methods for fabricating and using same |
| 03/30/2004 | US6712679 Platen assembly having a topographically altered platen surface |
| 03/30/2004 | US6712676 Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads |
| 03/30/2004 | US6712674 Polishing apparatus and polishing method |
| 03/30/2004 | US6712673 Polishing apparatus, polishing head and method |
| 03/30/2004 | US6712672 Clamping wafer holder for chemica-mechanical planarization machines and method for using it |
| 03/30/2004 | US6712670 Method and apparatus for applying downward force on wafer during CMP |
| 03/30/2004 | US6712669 BPSG chemical mechanical planarization process control for production control and cost savings |
| 03/25/2004 | WO2004024394A1 Control of removal profile in electrochemically assisted cmp |
| 03/25/2004 | WO2004024393A1 A polishing pad support that improves polishing performance and longevity |
| 03/25/2004 | WO2004024391A1 Novel finishing pad design for multidirectional use |
| 03/25/2004 | WO2003078859A3 Reinforced chemical mechanical planarization belt |
| 03/25/2004 | US20040058630 Chemical mechanical polishing pad having holes and or grooves |
| 03/25/2004 | US20040058626 Surface preparation for receiving processing treatments |
| 03/25/2004 | US20040058623 Polishing media for chemical mechanical planarization (CMP) |
| 03/25/2004 | US20040058621 Endpoint detection with multiple light beams |
| 03/25/2004 | US20040058620 System and method for metal residue detection and mapping within a multi-step sequence |
| 03/25/2004 | US20040058546 Constant pH polish and scrub |
| 03/25/2004 | US20040058543 Method of using films having optimized optical properties for chemical mechanical polishing endpoint detection |
| 03/25/2004 | US20040055998 Method for providing a smooth wafer surface |
| 03/25/2004 | US20040055993 Materials and methods for control of stability and rheological behavior of particulate suspensions |
| 03/25/2004 | US20040055223 Stability, smoothness; photolithography; concave, convex shapes on cushion backing |
| 03/25/2004 | DE10241845A1 Carrier for polishing apparatus for chemical-mechanical planarization of workpiece surface, comprises multi-volume diaphragms of soft, flexible material |
| 03/25/2004 | DE10241155A1 Device for finishing thinning of a workpiece used in the production of integrated circuits and transistors comprises a radiation emitting unit which directs radiation onto a region, a radiation receiving unit, and an evaluation unit |
| 03/24/2004 | EP1399962A1 Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles |
| 03/24/2004 | EP1399961A2 Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing |
| 03/24/2004 | EP1399960A1 In situ sensor based control of semiconductor processing procedure |
| 03/24/2004 | EP1399957A2 Microelectronic substrate having conductive material with blunt cornered apertures, and associated methods for removing conductive material |
| 03/24/2004 | EP1399956A2 Methods and apparatus for electrical, mechanical and/or chemical removal of conductive material from a microelectronic substrate |
| 03/24/2004 | EP1399517A2 Chemical mechanical polishing compositions and methods relating thereto |
| 03/24/2004 | EP1399295A1 Feedforward and feedback control for conditioning of chemical mechanical polishing pad |
| 03/24/2004 | EP1399294A1 End point detection system for chemical mechanical polishing applications |
| 03/24/2004 | EP1399291A1 Apparatus and method for measuring tool degradation |
| 03/24/2004 | CN1484851A Working shape prediction method working requirement determination method working method working system method of manufacturing semiconductor device |
| 03/24/2004 | CN1484568A Polishing disk with end-point detection port |
| 03/24/2004 | CN1484567A System and method for polishing and planarizing semiconductor wafers using reduced surface area polishing pads and variable partial pad |
| 03/24/2004 | CN1484566A Crosslinked polyethylene polishing pad for chemical mechnical polishing polishing apparatus and polishing method |
| 03/24/2004 | CN1483780A Slurry for chemical mechanical polishing |
| 03/24/2004 | CN1143365C Grinding method and method for producing grinding granules used in said grinding method |
| 03/24/2004 | CN1143314C Reduced voltage input/reduced voltage output tri-state buffers and methods therefor |
| 03/24/2004 | CN1142989C Slurries of abrasive inorganic oxide particles and method for adjusting abrasiveness of particles |
| 03/23/2004 | US6709981 Method and apparatus for processing a semiconductor wafer using novel final polishing method |
| 03/23/2004 | US6709544 Chemical mechanical polishing equipment |
| 03/23/2004 | US6709323 Holder for flat workpieces, particularly semiconductor wafers |
| 03/23/2004 | US6709322 Apparatus for aligning a surface of an active retainer ring with a wafer surface for chemical mechanical polishing |