| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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| 04/27/2004 | US6726545 Linear polishing for improving substrate uniformity |
| 04/27/2004 | US6726540 Polishing cloth and method of manufacturing semiconductor device using the same |
| 04/27/2004 | US6726538 Sample polishing apparatus and sample polishing method |
| 04/27/2004 | US6726537 Polishing carrier head |
| 04/27/2004 | US6726534 Preequilibrium polishing method and system |
| 04/27/2004 | US6726532 Belt tensioning assembly for CMP apparatus |
| 04/27/2004 | US6726530 End-point detection system for chemical mechanical polishing applications |
| 04/27/2004 | US6726529 Low temperature chemical mechanical polishing of dielectric materials |
| 04/22/2004 | WO2004034456A1 Method of forming wiring |
| 04/22/2004 | WO2004033574A1 Cmp method utilizing amphiphilic non-ionic surfactants |
| 04/22/2004 | WO2004033153A2 Retaining ring for holding semiconductor wafers in a chemical-mechanical polishing device |
| 04/22/2004 | WO2004033152A1 Retaining ring for use on a carrier of a polishing apparatus |
| 04/22/2004 | WO2004033151A1 Retaining ring for holding semiconductor wafers in a chemical-mechanical polishing device |
| 04/22/2004 | WO2004033148A1 Both side grinding method and both side grinder of thin disc-like work |
| 04/22/2004 | WO2004009289A3 Rising after chemical-mechanical planarization process applied on a wafer |
| 04/22/2004 | US20040077297 Polishing apparatus and polishing method |
| 04/22/2004 | US20040077294 Method and apparatus to provide a GMR lapping plate texturization using a photo-chemical process |
| 04/22/2004 | US20040077292 Real-time polishing pad stiffness control using magnetically controllable fluid |
| 04/22/2004 | US20040077167 Retaining ring for use on a carrier of a polishing apparatus |
| 04/22/2004 | US20040076806 Porous ceramics and method for preparation thereof, and microstrip substrate |
| 04/22/2004 | US20040074636 Flow completion system |
| 04/22/2004 | US20040074517 Surfactants for chemical mechanical polishing |
| 04/21/2004 | EP1410118A1 Method and system for endpoint detection |
| 04/21/2004 | EP1409201A1 Fixed abrasive articles with wear indicators |
| 04/21/2004 | EP1250215B1 System and method for controlled polishing and planarization of semiconductor wafers |
| 04/21/2004 | CN1491269A Cerium based abrasive material and method for preparation thereof |
| 04/21/2004 | CN1491146A Chemical mechanical machining and surface finishing |
| 04/21/2004 | CN1146866C Crown forming method of flying head and its crown forming device |
| 04/20/2004 | US6725120 Apparatus and methods with resolution enhancement feature for improving accuracy of conversion of required chemical mechanical polishing pressure to force to be applied by polishing head to wafer |
| 04/20/2004 | US6723655 Methods for fabricating a semiconductor device |
| 04/20/2004 | US6723643 Method for chemical mechanical polishing of thin films using end-point indicator structures |
| 04/20/2004 | US6723144 Semiconductor device fabricating method |
| 04/20/2004 | US6722965 Carrier head with flexible membranes to provide controllable pressure and loading area |
| 04/20/2004 | US6722964 Polishing apparatus and method |
| 04/20/2004 | US6722963 Apparatus for chemical-mechanical planarization of microelectronic substrates with a carrier and membrane |
| 04/20/2004 | US6722962 Polishing system, polishing method, polishing pad, and method of forming polishing pad |
| 04/20/2004 | US6722957 Method and apparatus for planarizing a microelectronic substrate with a tilted planarizing surface |
| 04/20/2004 | US6722953 Abrasive liquid feed apparatus, method for feeding additive to abrasive liquid feed apparatus, and polishing apparatus |
| 04/20/2004 | US6722951 Eliminates damage; performs intermittently low speed polishing under low torque prior to high speed continuous polishing at high torque |
| 04/20/2004 | US6722950 Method and apparatus for electrodialytic chemical mechanical polishing and deposition |
| 04/20/2004 | US6722949 Ventilated platen/polishing pad assembly for chemcial mechanical polishing and method of using |
| 04/20/2004 | US6722948 Pad conditioning monitor |
| 04/20/2004 | US6722947 Lapping machine, lapping method, and method of manufacturing magnetic head |
| 04/20/2004 | US6722946 Advanced chemical mechanical polishing system with smart endpoint detection |
| 04/20/2004 | US6722943 Planarizing machines and methods for dispensing planarizing solutions in the processing of microelectronic workpieces |
| 04/20/2004 | US6722942 Chemical mechanical polishing with electrochemical control |
| 04/20/2004 | US6722249 Method of fabricating a polishing pad having an optical window |
| 04/15/2004 | WO2004030865A1 Methods and systems for controlling belt surface temperature and slurry temperature in linear chemical mechanical planarization |
| 04/15/2004 | WO2004030860A2 Flow control system |
| 04/15/2004 | US20040072522 Gradient polishing pad made from paper-making fibers for use in chemical/mechanical planarization of wafers |
| 04/15/2004 | US20040072518 Platen with patterned surface for chemical mechanical polishing |
| 04/15/2004 | US20040072517 Apparatus for polishing a semiconductor wafer and method therefor |
| 04/15/2004 | US20040072516 Polishing pad having a grooved pattern for use in chemical mechanical polishing apparatus |
| 04/15/2004 | US20040072515 Device for polishing optical disk |
| 04/15/2004 | US20040072507 Polishing pads useful in chemical mechanical polishing of substrates in the presence of a slurry containing abrasive particles |
| 04/15/2004 | US20040072506 Fixed abrasive article for use in modifying a semiconductor wafer |
| 04/15/2004 | US20040072505 Polishing member and method of manufacturing semiconductor device |
| 04/15/2004 | US20040072503 Dual mode hybrid control and method for CMP slurry |
| 04/15/2004 | US20040072502 Subpad support with a releasable subpad securing element and polishing apparatus including the subpad support |
| 04/15/2004 | US20040072500 Chemical mechanical polishing with friction-based control |
| 04/15/2004 | US20040072499 Polishing apparatus |
| 04/15/2004 | US20040072445 Effective method to improve surface finish in electrochemically assisted CMP |
| 04/15/2004 | US20040070880 Method and apparatus for grounding a magnetic recording head |
| 04/15/2004 | US20040070092 Method for simultaneous two-disk texturing |
| 04/15/2004 | US20040069406 CMP apparatus polishing head with concentric pressure zones |
| 04/15/2004 | US20040068937 Homogeneous fixed abrasive polishing pad |
| 04/15/2004 | DE10247180A1 Haltering zum Halten von Halbleiterwafern in einer chemisch-mechanischen Poliervorrichtung Retaining ring for holding semiconductor wafers in a chemical mechanical polishing apparatus |
| 04/15/2004 | DE10247179A1 Haltering zum Halten von Halbleiterwafern in einer chemisch-mechanischen Poliervorrichtung Retaining ring for holding semiconductor wafers in a chemical mechanical polishing apparatus |
| 04/15/2004 | DE10245548A1 Semiconductor wafer polishing device, |
| 04/14/2004 | EP1408538A1 Polishing element, cmp polishing device and productions method for semiconductor device |
| 04/14/2004 | EP1407482A1 Method for chemical mechanical polishing (cmp) with altering the concentration of oxidizing agent in slurry |
| 04/14/2004 | EP0990486B1 Polishing solution feeder |
| 04/14/2004 | CN2611103Y Drum-like abrasive cloth grinder lapping machine |
| 04/14/2004 | CN2611102Y Drum-like abrasive cloth grinder lapping machine having device for clip-removal and dust-collection |
| 04/14/2004 | CN2611101Y Air valve polishing tool |
| 04/14/2004 | CN1489509A Polishing pad with built-in optical sensor |
| 04/14/2004 | CN1489508A FIxed abrasive article for use in modifying semiconductor wafer |
| 04/14/2004 | CN1489507A Water carrier with groove for decoupling retainer ring from wafer |
| 04/14/2004 | CN1488470A 抛光机 Polishing Machine |
| 04/13/2004 | US6721628 Closed loop concentration control system for chemical mechanical polishing slurry |
| 04/13/2004 | US6720266 Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies |
| 04/13/2004 | US6720264 Prevention of precipitation defects on copper interconnects during CMP by use of solutions containing organic compounds with silica adsorption and copper corrosion inhibiting properties |
| 04/13/2004 | US6720250 Method of manufacturing a semiconductor device using a slurry for chemical mechanical polishing of copper |
| 04/13/2004 | US6719874 Active retaining ring support |
| 04/13/2004 | US6719823 Polishing systems, methods of polishing substrates, and methods of cleaning polishing slurry from substrate surfaces |
| 04/13/2004 | US6719819 Polishing composition |
| 04/13/2004 | US6719818 Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations |
| 04/13/2004 | US6719619 Quick coupler for mounting a rotational disk |
| 04/13/2004 | US6719618 Polishing apparatus |
| 04/13/2004 | US6719617 Slurry homogenizer and supply system |
| 04/13/2004 | US6719615 Versatile wafer refining |
| 04/13/2004 | US6719611 Jet-induced finishing of a substrate surface |
| 04/13/2004 | US6719610 Method and device for grinding particulates |
| 04/13/2004 | US6719608 Fabrication of devices with fibers engaged to grooves on substrates |
| 04/13/2004 | US6718612 Method for manufacturing a magnetic disk comprising a glass substrate using a protective layer over a glass workpiece |
| 04/08/2004 | WO2004028746A2 Brazed diamond tools and methods for making the same |
| 04/08/2004 | WO2004028745A1 Polishing pad for planarization |
| 04/08/2004 | WO2004028744A1 Polishing pad with window for planarization |
| 04/08/2004 | WO2004028743A1 Polishing apparatus, polishing head, and polishing method |
| 04/08/2004 | WO2002064315A8 Polishing disk with end-point detection port |