| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
|---|
| 05/19/2004 | CN1150601C Polishing equipment and method for producing semiconductor device |
| 05/19/2004 | CN1150600C Uniformity for improving chemical-mechanically polishing |
| 05/18/2004 | US6736952 Platen of conductive material is disposed proximate to the polishing pad and is configured to have a negative charge during planarization process; demetallization of a workpiece surface such as semiconductor |
| 05/18/2004 | US6736926 Inline monitoring of pad loading for CuCMP and developing an endpoint technique for cleaning |
| 05/18/2004 | US6736869 Separating into discrete droplets in liquid phase; configuring to engage and remove material from microelectronic substrate; chemical mechanical polishing |
| 05/18/2004 | US6736720 Apparatus and methods for controlling wafer temperature in chemical mechanical polishing |
| 05/18/2004 | US6736714 Endless belt comprising continuous textile fabric supporting a polishing layer comprising polymer for coating |
| 05/18/2004 | US6736713 Workpiece carrier retaining element |
| 05/18/2004 | US6736709 Grooved polishing pads for chemical mechanical planarization |
| 05/18/2004 | US6736708 Microelectronic substrate assembly planarizing machines and methods of mechanical and chemical-mechanical planarization of microelectronic substrate assemblies |
| 05/18/2004 | US6736705 Polishing process for glass or ceramic disks used in disk drive data storage devices |
| 05/18/2004 | US6736704 Lapping carrier for use in fabricating sliders |
| 05/18/2004 | US6736701 High flow rinsing; chemical mechanical polishing using tantalum nitride; routing, cleaning |
| 05/18/2004 | US6736699 Electrolytic polishing apparatus, electrolytic polishing method and wafer subject to polishing |
| 05/18/2004 | US6736696 Method of improving uniformity control on wafers during chemical mechanical polishing |
| 05/18/2004 | US6736551 End face polishing apparatus |
| 05/18/2004 | US6736154 Pressure vessel systems and methods for dispensing liquid chemical compositions |
| 05/13/2004 | WO2004040621A2 Method and apparatus for planarizing a semiconductor wafer |
| 05/13/2004 | US20040092218 Guide ring removal device |
| 05/13/2004 | US20040092217 Wear ring assembly |
| 05/13/2004 | US20040092210 Method to reduce defect/slurry residue for copper CMP |
| 05/13/2004 | US20040092112 Chemical mechanical polishing system and method for planarizing substrates in fabricating semiconductor devices |
| 05/13/2004 | US20040092110 Polishing method and polishing apparatus |
| 05/13/2004 | US20040092103 Polishing fluid composition |
| 05/13/2004 | US20040089520 Reinforced chemical mechanical planarization belt |
| 05/12/2004 | EP1418614A1 Wafer holding ring for chemical and mechanical polisher |
| 05/12/2004 | EP1418022A1 Vertically adjustable chemical mechanical polishing head having a pivot mechanism and method for use thereof |
| 05/12/2004 | EP1417703A1 Chemical mechanical polishing pad having holes and/or grooves |
| 05/12/2004 | CN1496581A Semiconductor wafer protective member and semiconductor wafer grinding method |
| 05/12/2004 | CN1495863A Conductive polishing component for electrochemical mechanical polishing process |
| 05/12/2004 | CN1495707A Magnetic memory slide pad with grinding-consumed projection |
| 05/12/2004 | CN1494987A Lapping pad containing embedded liquid trace component and its production method |
| 05/12/2004 | CN1494986A Integrated grinding pad and its mfg. method |
| 05/12/2004 | CN1494983A Polishing mattress and multilayer polishing mattress |
| 05/12/2004 | CN1494982A Base plate lapping device and method |
| 05/11/2004 | US6734121 Methods of treating surfaces of substrates |
| 05/11/2004 | US6733373 Polishing assembly for a linear chemical mechanical polishing apparatus and method for forming |
| 05/11/2004 | US6733370 In-situ pad conditioning apparatus for CMP polisher |
| 05/11/2004 | US6733368 Method for lapping a wafer |
| 05/11/2004 | US6733367 Method and apparatus for polishing silicon wafers |
| 05/11/2004 | US6733363 Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization |
| 05/06/2004 | WO2004038698A2 Method and apparatus for grounding a magnetic recording head |
| 05/06/2004 | WO2004037937A1 A corrosion retarding polishing slurry for the chemical mechanical polishing of copper surfaces |
| 05/06/2004 | WO2004037490A1 Transparent microporous materials for cmp |
| 05/06/2004 | US20040087262 Polishing silicon wafers |
| 05/06/2004 | US20040087259 Fluid bearing slide assembly for workpiece polishing |
| 05/06/2004 | US20040087258 Polishing method and apparatus |
| 05/06/2004 | US20040087254 Fluid-pressure regulated wafer polishing head |
| 05/06/2004 | US20040087253 Method and apparatus for processing sliders for use in disk drives and the like |
| 05/06/2004 | US20040087251 Semiconductor processing methods of removing conductive material |
| 05/06/2004 | US20040087250 Method and apparatus for forming and using planarizing pads for mechanical and chemical-mechanical planarization of microelectronic substrates |
| 05/06/2004 | US20040087248 Polishing method and apparatus |
| 05/06/2004 | US20040086251 Apparatus for and method of machining of optical connector end |
| 05/06/2004 | US20040084414 Polishing method and polishing composition used for polishing |
| 05/06/2004 | US20040084143 Temperature-controlled substrate holder for processing in fluids |
| 05/06/2004 | EP1416524A2 Method of planarizing a semiconductor die |
| 05/06/2004 | EP1415762A1 Apparatus for and method of machining of optical connector end |
| 05/06/2004 | EP1414767A1 Glass-ceramics |
| 05/06/2004 | EP1414765A2 Method of making amorphous materials and ceramics |
| 05/06/2004 | EP1230068A4 Method and apparatus for lapping of workpieces |
| 05/06/2004 | DE10338088A1 Verfahren zur Herstellung eines Glassubstrats für einen Maskenrohling, Verfahren zur Herstellung eines Maskenrohlings, Verfahren zur Herstellung einer Transfermaske, Verfahren zur Herstllung eines Halbleiterbauelements, Glassubstrat für einen Maskenrohling, Maskenrohling und Transfermaske A process for producing a glass substrate for a mask blank, method of producing a mask blank, method of manufacturing a transfer mask, Herstllung method for a semiconductor device, glass substrate for a mask blank, the mask blank and transfer mask |
| 05/05/2004 | CN1494735A Chemical-mechanical planarization using ozone |
| 05/05/2004 | CN1494734A Polishing element, CMP polishing device and production method for semiconductor device |
| 05/04/2004 | US6732017 System and method for point of use delivery, control and mixing chemical and slurry for CMP/cleaning system |
| 05/04/2004 | US6730603 System and method of determining a polishing endpoint by monitoring signal intensity |
| 05/04/2004 | US6730592 Methods for planarization of metal-containing surfaces using halogens and halide salts |
| 05/04/2004 | US6730245 Slurry includes abrasive particles have a small particle size, narrow size distribution and a spherical morphology, and the particles are substantially unagglomerated, selected from silica, alumina, zirconia, ceria etc. and mixture |
| 05/04/2004 | US6730191 Coaxial dressing for chemical mechanical polishing |
| 05/04/2004 | US6729950 Chemical mechanical polishing pad having wave shaped grooves |
| 05/04/2004 | US6729946 Polishing apparatus |
| 05/04/2004 | US6729945 Apparatus for controlling leading edge and trailing edge polishing |
| 05/04/2004 | US6729944 Chemical mechanical polishing apparatus with rotating belt |
| 05/04/2004 | US6729943 System and method for controlled polishing and planarization of semiconductor wafers |
| 05/04/2004 | US6729941 Process for manufacturing semiconductor wafer and semiconductor wafer |
| 05/04/2004 | US6729935 Method and system for in-situ monitoring of mixing ratio of high selectivity slurry |
| 04/29/2004 | WO2004035265A1 Polishing state monitoring apparatus and polishing apparatus and method |
| 04/29/2004 | WO2003103025A3 Method and apparatus of sealing wafer backside for full-face electrochemical plating |
| 04/29/2004 | WO2003022519A9 Slurry distributor for chemical mechanical polishing apparatus and method of using the same |
| 04/29/2004 | US20040082289 Conductive polishing article for electrochemical mechanical polishing |
| 04/29/2004 | US20040082288 Fixed abrasive articles |
| 04/29/2004 | US20040082282 Finishing machine having a sandpaper positioning function |
| 04/29/2004 | US20040082279 Polishing agent and lapping method |
| 04/29/2004 | US20040082276 Transparent microporous materials for CMP |
| 04/29/2004 | US20040082275 Continuous chemical mechanical polishing process for polishing multiple conductive and non-conductive layers on semiconductor wafers |
| 04/29/2004 | US20040082273 Abrasive machine and method of abrading work piece |
| 04/29/2004 | US20040082271 Polishing pad with window |
| 04/29/2004 | US20040080757 Integrated surface metrology |
| 04/29/2004 | US20040080256 Composite oxide; fine particle size; generating aerosols, heating to remove liquid, coating surfaces |
| 04/29/2004 | DE10390695T5 Schutzelement und Schleifverfahren für Halbleiterwafer Guard member and grinding method for semiconductor wafers |
| 04/29/2004 | DE10296958T5 Verfahren zur Herstellung von lichtdurchlässigen, optischen Fluorkristallen Process for the preparation of light-transmitting, optical fluorine crystals |
| 04/29/2004 | DE10296621T5 Polierkissen und System Polishing pad and system |
| 04/29/2004 | DE10247200A1 Process for simultaneously removing material on both sides of one or more semiconductor wafers comprises using a plate which has chemically inert abrasion- and adhesion-resistant coating in partial regions on the front and rear sides |
| 04/28/2004 | EP1413396A1 Abrasive machine and method of abrading work piece |
| 04/28/2004 | EP1412443A1 Cerium oxide slurry and method of manufacturing a substrate |
| 04/28/2004 | EP1412131A1 Method for fabricating polishing pad using laser beam and mask |
| 04/28/2004 | EP1412130A1 Polishing apparatus and polishing method |
| 04/28/2004 | EP1412129A1 Method for fabricating chemical mechanical polishing pad using laser |
| 04/27/2004 | US6727107 Method of testing the processing of a semiconductor wafer on a CMP apparatus |
| 04/27/2004 | US6726554 Guide ring removal device |
| 04/27/2004 | US6726550 Polishing apparatus |