| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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| 06/10/2004 | US20040110449 Measuring the surface properties of polishing pads using ultrasonic reflectance |
| 06/10/2004 | US20040109174 Method and apparatus for optical film measurements in a controlled environment |
| 06/10/2004 | US20040108065 Apparatus methods for controlling wafer temperature in chemical mechanical polishing |
| 06/10/2004 | US20040108064 Methods for polishing semiconductor device structures by differentially applying pressure to substrates that carry the semiconductor device structures |
| 06/10/2004 | US20040108063 Method and polishing pad design enabling improved wafer removal from a polishing pad in a CMP process |
| 06/09/2004 | EP1425786A1 Constant ph polish and scrub |
| 06/09/2004 | EP1425136A1 Platen assembly having a topographically altered platen surface |
| 06/09/2004 | EP1385671A4 Recyclable retaining ring assembly for a chemical mechanical polishing apparatus |
| 06/09/2004 | EP1341643A4 Polishing pads with polymer filled fibrous web, and methods for fabricating and using same |
| 06/09/2004 | DE10356669A1 Material-abrading lapping or machining tool especially for processing semiconductor wafers, has working surface divided into surface elements by mutually crossing grooves |
| 06/09/2004 | CN1503332A Method for polishing semiconductor wafer and polishing pad for the same |
| 06/08/2004 | US6747283 In-situ detection of thin-metal interface using high resolution spectral analysis of optical interference |
| 06/08/2004 | US6746958 Method of controlling the duration of an endpoint polishing process in a multistage polishing process |
| 06/08/2004 | US6746320 Linear reciprocating disposable belt polishing method and apparatus |
| 06/08/2004 | US6746319 Measuring apparatus |
| 06/08/2004 | US6746318 Workpiece carrier with adjustable pressure zones and barriers |
| 06/08/2004 | US6746317 Methods and apparatuses for making and using planarizing pads for mechanical and chemical mechanical planarization of microelectronic substrates |
| 06/08/2004 | US6746316 Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads |
| 06/08/2004 | US6746313 Polishing head assembly in an apparatus for chemical mechanical planarization |
| 06/08/2004 | US6746312 Polishing method and polishing apparatus |
| 06/08/2004 | US6746311 Polishing pad with release layer |
| 06/08/2004 | US6746310 Uniform thin films produced by magnetorheological finishing |
| 06/03/2004 | WO2004046216A1 Method of fabricating polyurethane foam with micro pores and polishing pad tehrefrom |
| 06/03/2004 | WO2003073481A3 Feedforward and feedback control of semiconductor fabrication process using secondary electron microscopy and a focused ion beam system |
| 06/03/2004 | US20040106367 Fixed abrasive polishing pad |
| 06/03/2004 | US20040106364 Polishing and cleaning compound device |
| 06/03/2004 | US20040106361 Pre-coated particles for chemical mechanical polishing |
| 06/03/2004 | US20040106358 Method and apparatus for global die thinning and polishing of flip-chip packaged integrated circuits |
| 06/03/2004 | US20040106357 Polishing pad for in-situ endpoint detection |
| 06/03/2004 | US20040106283 Comparison of chemical-mechanical polishing processes |
| 06/03/2004 | US20040104200 Methods for finishing microelectronic device packages |
| 06/03/2004 | US20040104128 Filling concave portions formed on wafer surface; determining electropolishing end point of metal film in accordance with change of current waveform |
| 06/02/2004 | EP1424727A1 Polishing composition and rinse composition |
| 06/02/2004 | EP1423868A2 Forming a semiconductor structure using a combination of planarizing methods and electropolishing |
| 06/02/2004 | EP1075351B1 Apparatus and method for chemical-mechanical polishing (cmp) using a head having direct pneumatic wafer polishing pressure system |
| 06/02/2004 | CN1501451A Method of fabricating semiconductor device |
| 06/02/2004 | CN1152416C Novel mechanical-chemical polishing method for semiconductor or insulation material layer |
| 06/01/2004 | US6743268 Acidic slurry of an oxidizer, deionized water, a corrosion inhibitor and a surfactant |
| 06/01/2004 | US6743267 Boron surface-modified colloids |
| 06/01/2004 | US6743081 In-line oscillating device |
| 06/01/2004 | US6743080 Method for seasoning a polishing pad |
| 06/01/2004 | US6743078 Methods, apparatus and slurries for chemical mechanical planarization |
| 06/01/2004 | US6743075 Method for determining chemical mechanical polishing time |
| 06/01/2004 | US6743074 Method and system for manufacturing a photocathode |
| 05/27/2004 | WO2004044273A1 Electropolishing system and process |
| 05/27/2004 | WO2004044076A1 A slurry composition and a polishing method using the same |
| 05/27/2004 | WO2004043648A1 Polishing apparatus |
| 05/27/2004 | US20040102144 Polishing systems for use with semiconductor substrates including differential pressure application apparatus |
| 05/27/2004 | US20040102141 Polishing pad with window for planarization |
| 05/27/2004 | US20040102140 Contour following end effectors for lapping/polishing |
| 05/27/2004 | US20040102139 Method of manufacturing silicon wafer |
| 05/27/2004 | US20040102138 Methods for aligning a surface of an active retainer ring with a wafer surface for chemical mechanical polishing |
| 05/27/2004 | US20040102137 Polishing pad for planarization |
| 05/27/2004 | US20040102136 Spring-loaded contour following end effectors for lapping/polishing |
| 05/27/2004 | US20040102135 Automated lapping system |
| 05/27/2004 | US20040102049 Method and system to provide material removal and planarization employing a reactive pad |
| 05/27/2004 | US20040102045 Polishing apparatus |
| 05/27/2004 | US20040101415 Method and a pump apparatus for the generation of an adjustable, substantially constant volume flow of a fluid and a use of this method |
| 05/27/2004 | US20040099375 Edge-contact ring for a wafer pedestal |
| 05/27/2004 | US20040098924 Contains hydroxyethyl cellulose, polyethylene oxide, ammonia, water, and silicon dioxide; for reducing haze level of surfaces of silicon wafers |
| 05/26/2004 | EP1421610A1 Slurry composition for use in chemical mechanical polishing of metal wiring |
| 05/26/2004 | EP1421453A2 Cmp process involving frequency analysis-based monitoring |
| 05/26/2004 | CN1500290A Monitoring method of polishing state, monitor of polishing state, polishing appts, processed wafer, semiconductor device mfg. method, and semiconductor device |
| 05/26/2004 | CN1500030A Method and appts. for end point triggering with integrated steering |
| 05/26/2004 | CN1500029A Appts. and methods for aligning surface of active retainer ring with wafer surface for chemical mechanical polishing |
| 05/26/2004 | CN1500028A Device for controlling eveness of edge polishing |
| 05/26/2004 | CN1499581A Method of flatting semiconductor die |
| 05/26/2004 | CN1499231A Appts. for and method of maching of optical connector end |
| 05/26/2004 | CN1498725A Chemical mechanical polishing head with pivot mechanism and vertical regulation, and its application method |
| 05/26/2004 | CN1498724A Lapping machine and method of grinding workpiece |
| 05/25/2004 | US6741913 Technique for noise reduction in a torque-based chemical-mechanical polishing endpoint detection system |
| 05/25/2004 | US6741903 Method for relating photolithography overlay target damage and chemical mechanical planarization (CMP) fault detection to CMP tool indentification |
| 05/25/2004 | US6739962 Polishing pads and methods relating thereto |
| 05/25/2004 | US6739958 Carrier head with a vibration reduction feature for a chemical mechanical polishing system |
| 05/25/2004 | US6739955 Apparatus and methods for conditioning polishing pads in mechanical and/or chemical-mechanical planarization of microelectronic-device substrate assemblies |
| 05/25/2004 | US6739953 Mechanical stress free processing method |
| 05/25/2004 | US6739952 Method and apparatus for planarizing a microelectronic substrate with a tilted planarizing surface |
| 05/25/2004 | US6739951 Method and apparatus for electrochemical-mechanical planarization |
| 05/25/2004 | US6739947 In situ friction detector method and apparatus |
| 05/25/2004 | US6739946 Thermal-chemical polishing device and method thereof |
| 05/25/2004 | US6739945 Polishing pad with built-in optical sensor |
| 05/25/2004 | US6739944 System for real-time control of semiconductor wafer polishing |
| 05/21/2004 | WO2004042529A2 Method and apparatus for processing sliders for use in disk drives and the like |
| 05/21/2004 | WO2004041479A1 Polishing apparatus |
| 05/21/2004 | WO2004041477A1 Surface treatment method for vacuum member |
| 05/20/2004 | US20040097177 Advanced bi-directional linear polishing system and method |
| 05/20/2004 | US20040097176 Methods for conditioning surfaces of polishing pads after chemical-mechanical polishing, and apparatuses for conditioning surfaces of polishing pads |
| 05/20/2004 | US20040097175 Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates |
| 05/20/2004 | US20040097174 Method for polishing semiconductor wafer and polishing pad for the same |
| 05/20/2004 | US20040097169 Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization |
| 05/20/2004 | US20040097053 Semiconductor wafer protective member and semiconductor wafer grinding method |
| 05/20/2004 | US20040096529 Method of manufacturing polishing pad |
| 05/20/2004 | US20040094269 Methods for determining amounts and locations of differential pressure to be applied to semiconductor substrates during polishing of semiconductor device structures carried thereby and for subsequently polishing similar semiconductor device structures |
| 05/20/2004 | US20040093803 Keeping the color of the abrasive in specified ranges or stably adding fluorine |
| 05/19/2004 | EP1419853A1 Apparatus and method for in-situ endpoint detection and monitoring for chemical mechanical polishing operations |
| 05/19/2004 | CN1498415A Infrared end-point detecting system |
| 05/19/2004 | CN1497681A Grinding method of using slurry containing resin particle of organic membrane on semiconductor substrate |
| 05/19/2004 | CN1497030A Polishing composition |
| 05/19/2004 | CN1497029A Paste used for polishing copper base metal |
| 05/19/2004 | CN1150609C Technological process for making different gate medium thicknesses by suing polysilicon mask and chemical mechanical process |