| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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| 07/06/2004 | US6758725 Lapping method and lapping apparatus |
| 07/06/2004 | US6758723 Substrate polishing apparatus |
| 07/06/2004 | US6758722 Dual-purpose lapping guide for the production of magneto-resistive heads |
| 07/06/2004 | US6758721 Apparatus and method for lapping magnetic heads |
| 07/01/2004 | WO2004055089A1 Polyol composition of the two-part system for foam grindstone, two-part curable composition for foam grindstone, foam grindstone, and process for production thereof |
| 07/01/2004 | WO2004054779A1 Method for producing closed cell cellular material for use in polishing, cellular sheet for polishing, laminate for polishing and polishing method, method for producing laminate for polishing, and grooved polishing pad |
| 07/01/2004 | WO2004033153A3 Retaining ring for holding semiconductor wafers in a chemical-mechanical polishing device |
| 07/01/2004 | US20040127148 Polishing method for semiconductor device, method for fabricating semiconductor device and polishing system |
| 07/01/2004 | US20040127147 Polishing composition |
| 07/01/2004 | US20040127145 Perforated-transparent polishing pad |
| 07/01/2004 | US20040127144 Method and apparatus for controlling CMP pad surface finish |
| 07/01/2004 | US20040127143 Apparatus and methods for slurry flow control |
| 07/01/2004 | US20040127142 Load cup for chemical mechanical polishing |
| 07/01/2004 | US20040127051 Apparatus and methods of chemical mechanical polishing |
| 07/01/2004 | US20040127047 Polishing composition and polishing method using the same |
| 07/01/2004 | US20040127046 Polishing composition and polishing method using the same |
| 07/01/2004 | US20040123951 Retaining ring having reduced wear and contamination rate for a polishing head of a CMP tool |
| 07/01/2004 | DE10260233A1 Workpiece processing method, e.g. for semiconductor wafer, by attaching workpiece to holder comprising porous material, using solid material such as wax or adhesive |
| 06/30/2004 | EP1433197A1 Chemical mechanical polishing pad having wave-shaped grooves |
| 06/30/2004 | EP1432773A1 Rare earth salt oxidizer based cmp method |
| 06/30/2004 | EP1432659A1 Ceramic materials, abrasive particles, abrasive articles, and methods of making and using the same |
| 06/30/2004 | EP1210209A4 Molded polishing pad having integral window |
| 06/30/2004 | CN1509322A Chemical mechanical polishing compositions and method relating thereto |
| 06/30/2004 | CN1155815C Optimizing chemical-mechanical planing process by testing oxide/nitride interface |
| 06/29/2004 | US6756308 Polishing uisng ozone and abrasives |
| 06/29/2004 | US6755878 Abrasive articles and methods of making and using the same |
| 06/29/2004 | US6755726 Polishing head with a floating knife-edge |
| 06/29/2004 | US6755723 Polishing head assembly |
| 06/29/2004 | US6755721 Chemical mechanical polishing of nickel phosphorous alloys |
| 06/29/2004 | US6755718 Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization |
| 06/29/2004 | US6754942 Method for assembling a polishing head and apparatus for detecting air leakage in the polishing head while assembling the same |
| 06/24/2004 | WO2004053968A1 Slurry composition for secondary polishing of silicon wafer |
| 06/24/2004 | WO2004053967A1 Semiconductor apparatus, wiring board forming method, and substrate treatment apparatus |
| 06/24/2004 | WO2004053966A1 Polishing method |
| 06/24/2004 | WO2004053942A2 Measuring alignment between a wafer chuck and polishing/plating receptacle |
| 06/24/2004 | WO2004004971A3 Lapping method and lapping tool for glass balls |
| 06/24/2004 | US20040121714 Polishing cloth and method of producing same |
| 06/24/2004 | US20040121710 Method and apparatus for conditioning a polishing pad |
| 06/24/2004 | US20040121709 Deformable pad for chemical mechanical polishing |
| 06/24/2004 | US20040121708 Pad assembly for electrochemical mechanical processing |
| 06/24/2004 | US20040121704 Vertically adjustable chemical mechanical polishing head having a pivot mechanism and method for use thereof |
| 06/23/2004 | EP1430520A1 Chemical mechanical polishing pad with micro-holes |
| 06/23/2004 | EP1430002A2 Alumina-zirconia, and methods of making and using the same |
| 06/23/2004 | EP1429893A1 A method and apparatus for inline measurement of material removal during a polishing or grinding process |
| 06/23/2004 | EP1224060B1 Polishing pad |
| 06/23/2004 | EP1015175B1 Abrasive articles comprising a fluorochemical agent for wafer surface modification |
| 06/23/2004 | CN1507651A Method for producing IC chip |
| 06/23/2004 | CN1507014A Polishing method and method for producing semiconductor apparatus |
| 06/23/2004 | CN1506211A Making process of grinding pad with detection window |
| 06/23/2004 | CN1155059C Combination CMP-etch method for forming thin planar layer over surface of device |
| 06/22/2004 | US6753256 Method of manufacturing semiconductor wafer |
| 06/22/2004 | US6752898 Method and apparatus for an air bearing platen with raised topography |
| 06/22/2004 | US6752703 Chemical mechanical polishing apparatus and methods with porous vacuum chuck and perforated carrier film |
| 06/22/2004 | US6752701 Planarization apparatus with grinding and etching devices and holding device for moving workpiece between said devices |
| 06/22/2004 | US6752698 Method and apparatus for conditioning fixed-abrasive polishing pads |
| 06/22/2004 | US6752697 Apparatus and method for chemical mechanical polishing of a substrate |
| 06/22/2004 | US6752693 Afferent-based polishing media for chemical mechanical planarization |
| 06/22/2004 | US6752692 Cleaning method and polishing apparatus employing such cleaning method |
| 06/22/2004 | US6752690 Method of making polishing pad for planarization of semiconductor wafers |
| 06/22/2004 | US6752689 Apparatus for optical inspection of wafers during polishing |
| 06/22/2004 | US6752687 Method of polishing disks |
| 06/22/2004 | US6752442 Workpiece handling end-effector and a method for processing workpieces using a workpiece handling end-effector |
| 06/17/2004 | US20040117146 Method to measure oxide thickness by FTIR to improve an in-line CMP endpoint determination |
| 06/17/2004 | US20040116054 Abrasive pad and process for the wet-chemical grinding of a substrate surface |
| 06/17/2004 | US20040116052 Methods for reducing delamination during chemical mechanical polishing |
| 06/17/2004 | US20040116051 Method and apparatus for conditioning a chemical-mechanical polishing pad |
| 06/17/2004 | US20040116050 Method and apparatus for chemical-mechanical planarization of microelectronic substrates with a carrier and membrane |
| 06/17/2004 | US20040116048 Ultra fine particle film forming method and apparatus |
| 06/17/2004 | US20040116047 Method and apparatus for detecting an end-point in chemical mechanical polishing of metal layers |
| 06/17/2004 | US20040115944 Providing a wafer having a trench, a STI layer formed in the trench, the HfO2-containing gate dielectric covering the wafer and the STI layer, a gate electrode, performing a nitrogen ion bombardment to convert the exposed HfO2-containing gate dielectric to an Hf3N4 layer; utilizing phophoric acid |
| 06/17/2004 | US20040115841 In situ finishing aid control |
| 06/17/2004 | US20040112867 Hard magentic disks; abrasion using diamond particles in aqueous solution |
| 06/17/2004 | US20040112359 Brazed diamond tools and methods for making the same |
| 06/17/2004 | US20040111977 The abrasive has excellent properties to maintain its dispersed state |
| 06/17/2004 | DE10255652A1 Grinding pad for wet-chemical grinding of a substrate surface comprises a polymer matrix consisting of polymers with repetition units and incorporating embedded abrasive particles |
| 06/16/2004 | EP1428862A1 CERIUM−BASED ABRASIVE MATERIAL SLURRY AND METHOD FOR PRODUCING CERIUM−BASED ABRASIVE MATERIAL SLURRY |
| 06/16/2004 | EP1177068A4 Improved chemical mechanical polishing slurries for metal |
| 06/16/2004 | CN1505554A Integrated endpoint detection system with optical and eddy current monitoring |
| 06/16/2004 | CN1504315A Method for producing grinding pad |
| 06/16/2004 | CN1153823C Composite for mechanochemical polishing polymer insulating material layer with low dielectric constant |
| 06/15/2004 | US6750145 Method of eliminating agglomerate particles in a polishing slurry |
| 06/15/2004 | US6750128 Methods of polishing, interconnect-fabrication, and producing semiconductor devices |
| 06/15/2004 | US6749714 Polishing body, polisher, polishing method, and method for producing semiconductor device |
| 06/15/2004 | US6749494 Conditioning tool |
| 06/15/2004 | US6749491 CMP belt stretch compensation apparatus and methods for using the same |
| 06/15/2004 | US6749489 Method and apparatus for planarizing and cleaning microelectronic substrates |
| 06/15/2004 | US6749487 Method of polishing glass substrate for information recording media, and glass substrate for information recording media |
| 06/15/2004 | US6749486 Chemical-mechanical polishing device, damascene wiring forming device, and damascene wiring forming method |
| 06/15/2004 | US6749485 Hydrolytically stable grooved polishing pads for chemical mechanical planarization |
| 06/15/2004 | US6749484 Chemical mechanical polishing (CMP) apparatus with temperature control |
| 06/15/2004 | US6749483 Chemical mechanical planarization (CMP) system and method for determining an endpoint in a CMP operation |
| 06/10/2004 | WO2004049417A1 Polishing pad and method for manufacturing semiconductor device |
| 06/10/2004 | WO2004048038A1 Methods and apparatus for polishing control |
| 06/10/2004 | WO2004048037A2 Spring-loaded contour following end effectors for lapping/polishing |
| 06/10/2004 | WO2004048032A2 Automated lapping system |
| 06/10/2004 | WO2004048031A2 Contour following end effectors for lapping/polishing |
| 06/10/2004 | WO2004009289A8 Rising after chemical-mechanical planarization process applied on a wafer |
| 06/10/2004 | US20040111175 Method of and apparatus for controlling the chemical mechanical polishing of multiple layers on a substrate |
| 06/10/2004 | US20040110453 Polishing pad conditioning method and apparatus |
| 06/10/2004 | US20040110451 Apparatuses for conditioning surfaces of polishing pads |