| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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| 07/29/2004 | WO2004048032A3 Automated lapping system |
| 07/29/2004 | WO2004027411A8 System and method for metal residue detection and mapping within a multi-step sequence |
| 07/29/2004 | US20040147420 Cleaning compositions containing hydroxylamine derivatives and processes using same for residue removal |
| 07/29/2004 | US20040147206 CMP abrasive, liquid additive for CMP abrasive and method for polishing substrate |
| 07/29/2004 | US20040147205 Surface planarization |
| 07/29/2004 | US20040147123 Chemical mechanical polishing slurry for ruthenium titanium nitride and polishing process using the same |
| 07/29/2004 | US20040147116 Novel method to reduce stress for copper CMP |
| 07/29/2004 | US20040144755 Aqueous dispersion for chemical mechanical polishing |
| 07/29/2004 | US20040144160 Pad conditioning head offline testing kit |
| 07/29/2004 | US20040144038 Composition and associated method for oxide chemical mechanical planarization |
| 07/28/2004 | EP1441386A1 Method and pad for polishing wafer |
| 07/28/2004 | EP1440457A2 A semiconductor manufacturing apparatus having a built-in inspection apparatus and method therefor |
| 07/28/2004 | EP1440043A1 Abrasive particles and methods of making and using the same |
| 07/28/2004 | EP1439935A2 Electrochemical mechanical processing with advancible sweeper |
| 07/28/2004 | CN1516894A Microelectronic substrate having conductive material with blunt cornered apertures, and associated methods for removing conductive material |
| 07/28/2004 | CN1516245A Grinding pad collation device |
| 07/28/2004 | CN1159134C Device and method for measuring amount of grinding in magnetic head producing process |
| 07/27/2004 | US6767476 Polishing composition for metal CMP |
| 07/27/2004 | US6767428 Method and apparatus for chemical mechanical planarization |
| 07/27/2004 | US6767427 Apparatus and method for conditioning polishing pad in a chemical mechanical planarization process |
| 07/27/2004 | US6767409 Method for cleaning semiconductor wafer after chemical mechanical polishing on copper wiring |
| 07/27/2004 | US6767377 High activity material for chemical mechanical polishing; reproducibly adjustable particle size |
| 07/27/2004 | US6767276 Holder for flat workpieces, particularly semiconductor wafers |
| 07/27/2004 | US6767274 Method to reduce defect/slurry residue for copper CMP |
| 07/22/2004 | WO2004061925A1 Slurry composition for chemical mechanical polishing, method for planarization of surface of semiconductor element using the same, and method for controlling selection ratio of slurry composition |
| 07/22/2004 | WO2004060610A2 Substrate holding mechanism, substrate polishing apparatus and substrate polishing method |
| 07/22/2004 | WO2004060609A1 Modular method for chemical mechanical planarization |
| 07/22/2004 | WO2004040621A3 Method and apparatus for planarizing a semiconductor wafer |
| 07/22/2004 | US20040142646 Vibration damping in a chemical mechanical polishing system |
| 07/22/2004 | US20040142641 Polishing pad and method |
| 07/22/2004 | US20040142638 Polishing pad for use in chemical - mechanical planarization of semiconductor wafers and method of making same |
| 07/22/2004 | US20040142637 Polishing pad for use in chemical-mechanical planarization of semiconductor wafers and method of making same |
| 07/22/2004 | US20040142636 Slurry pump control system |
| 07/22/2004 | US20040142635 Carrier assemblies, polishing machines including carrier assemblies, and methods for polishing micro-device workpieces |
| 07/22/2004 | US20040142563 Methods and systems for exchanging messages in a controller for a substrate processing system |
| 07/22/2004 | US20040139820 a powder batch and method of making copper metal particles that are substantially spherical, have a weight average particle size of less than about 5 mu m and a narrow particle size distribution and high crystallinity |
| 07/21/2004 | EP0954407B1 Polishing apparatus |
| 07/21/2004 | CN1515027A Wafer holding ring for chemical and mechanical polisher |
| 07/21/2004 | CN1514862A CMP polishing pad including solid catalyst |
| 07/21/2004 | CN1514760A Adjustable force applying air platen, spindle system and its use |
| 07/21/2004 | CN1513931A 抛光液组合物 A polishing solution composition |
| 07/21/2004 | CN1513741A Thinfilm for vacuum adsorped chip |
| 07/21/2004 | CN1158694C Material for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using same |
| 07/21/2004 | CN1158167C Abrasive articles comprising fluorochemical agent for wafer surface modification |
| 07/21/2004 | CN1158165C 抛光垫 Polishing pad |
| 07/20/2004 | US6764868 Use of slurry waste composition to determine the amount of metal removed during chemical mechanical polishing, and system for accomplishing same |
| 07/20/2004 | US6764574 Polishing pad composition and method of use |
| 07/20/2004 | US6764392 Wafer polishing method and wafer polishing device |
| 07/20/2004 | US6764389 Conditioning bar assembly having an abrasion member supported on a polycarbonate member |
| 07/20/2004 | US6764388 High-pressure pad cleaning system |
| 07/20/2004 | US6764387 Control of a multi-chamber carrier head |
| 07/20/2004 | US6764381 Polishing apparatus |
| 07/20/2004 | US6764380 Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing |
| 07/20/2004 | US6764379 Method and system for endpoint detection |
| 07/15/2004 | WO2004059715A1 Polishing pads, conditioner and methods for polishing using the same |
| 07/15/2004 | WO2004059714A1 Polishing device and method of producing semiconductor device |
| 07/15/2004 | WO2004058453A1 Polishing pad having multi-windows |
| 07/15/2004 | WO2004058450A1 Method for producing glass substrate for information recording medium, polishing apparatus and glass substrate for information recording medium |
| 07/15/2004 | WO2003073448A3 Control of semiconductor fabrication process using scanning electron microscopy and a focused ion beam device |
| 07/15/2004 | WO2003012000A8 Abrasive particles, and methods of making and using the same |
| 07/15/2004 | US20040137832 Polishing head and chemical mechanical polishing apparatus |
| 07/15/2004 | US20040137831 Pad constructions for chemical mechanical planarization applications |
| 07/15/2004 | US20040137830 Lapping method and lapping machine |
| 07/15/2004 | US20040137829 Polishing apparatus and related polishing methods |
| 07/15/2004 | US20040137826 Method of using a soft subpad for chemical mechanical polishing |
| 07/15/2004 | US20040137823 Polishing apparatus |
| 07/15/2004 | US20040137739 CMP in-situ conditioning with pad and retaining ring clean |
| 07/15/2004 | US20040137738 Backside integrated circuit die surface finishing technique and tool |
| 07/15/2004 | US20040134793 for plating conductive material on semiconductor substrate by rotating pad/blade/anode; eliminates dishing and voids; for production of integrated circuits |
| 07/15/2004 | US20040134792 electroplating; ball assemblies comprises interior housing, annular seat, conductive adapter, and coupled conductive contact |
| 07/15/2004 | US20040134376 Polishing composition |
| 07/15/2004 | US20040134287 Polishing head test station |
| 07/15/2004 | US20040134230 Dental glass powders |
| 07/15/2004 | DE10258128A1 Semiconductor wafer polishing method, by pressing semiconductor wafer against polishing disc with two respective pressures, and two respective concentrations of polishing agent |
| 07/15/2004 | DE10159848B4 Vorrichtung zur beidseitigen Bearbeitung von Werkstücken Apparatus for two-sided machining of workpieces |
| 07/14/2004 | EP1437767A1 Grinding work holding disk, work grinding device and grinding method |
| 07/14/2004 | EP1437197A1 Apparatus and method for chemical-mechanical polishing (CMP) using a head having a direct pneumatic wafer polishing pressure system |
| 07/14/2004 | EP1436674A1 An integrated micro-optical and photonics elements batch preparation, polishing, cleaning and inspection system and method therefore |
| 07/14/2004 | CN1513008A Polyurethane composition and polishing pad |
| 07/14/2004 | CN1512929A Polishing apparatus and polishing method |
| 07/14/2004 | CN1512539A Water recovery pipeline system for semiconductor chemical and mechanical grinder |
| 07/13/2004 | US6763208 Photoreceptor regenerating apparatus and image forming apparatus using regenerated photoreceptor and method of regenerating photoreceptor |
| 07/13/2004 | US6761747 Dispersion containing pyrogenically manufactured abrasive particles with superparamagnetic domains |
| 07/13/2004 | US6761626 Air platen for leading edge and trailing edge control |
| 07/13/2004 | US6761625 Reclaiming virgin test wafers |
| 07/13/2004 | US6761624 Chemical mechanical polishing apparatus |
| 07/13/2004 | US6761620 Finishing pad design for multidirectional use |
| 07/13/2004 | US6761619 Method and system for spatial uniform polishing |
| 07/13/2004 | US6761618 Defect-free magnetic stampers/imprinters for contact patterning of magnetic media |
| 07/13/2004 | US6761616 Polishing method and polishing apparatus |
| 07/08/2004 | WO2004013656A3 Uniform thin films produced by magnetorheological finishing |
| 07/08/2004 | US20040132386 Apparatus and method for feeding slurry |
| 07/08/2004 | US20040132384 Method for post-chemical mechanical polishing cleaning |
| 07/08/2004 | US20040132382 Reel-to-reel substrate tape polishing system |
| 07/08/2004 | DE4306642B4 Verfahren zur Präparation von Substratoberflächen für Verklebungen Process for the preparation of substrate surfaces for bonding |
| 07/07/2004 | CN1510722A Grinding method and producing method for semiconductor device, and grinder |
| 07/06/2004 | US6758939 Laminated wear ring |
| 07/06/2004 | US6758872 Dispersion of abrasive grains comprisng compounds of cerium, copper, and/or ammonium |
| 07/06/2004 | US6758735 Methods and apparatuses for making and using planarizing pads for mechanical and chemical-mechanical planarization of microelectronic substrates |
| 07/06/2004 | US6758726 Partial-membrane carrier head |