| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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| 08/19/2004 | US20040159558 Electricoconductive compound formed into layer comprising mixture of polymer and filler; semiconductors, integrated circuits |
| 08/19/2004 | US20040159553 Semiconductor manufacturing apparatus and method for manufacturing semiconductor devices |
| 08/19/2004 | DE10392153T5 Abrasivum und Polierverfahren unter Verwendung desselben Same abrasive and polishing method using |
| 08/19/2004 | DE10303460A1 Verfahren und Vorrichtung zum Handhaben von scheibenförmigen Gegenständen Method and apparatus for handling disc-shaped objects |
| 08/19/2004 | DE10303407A1 Verfahren und Vorrichtung zur hochgenauen Bearbeitung der Oberfläche eines Objektes, insbesondere zum Polieren und Läppen von Halbleitersubstraten Method and device for highly accurate machining of the surface of an object, in particular for polishing and lapping of semiconductor substrates, |
| 08/18/2004 | EP1447841A1 Method of machining semiconductor wafer-use polishing pad and semiconductor wafer-use polishing pad |
| 08/18/2004 | EP1447840A1 Polishing pad and polishing method |
| 08/18/2004 | EP1447172A1 Surface finishing apparatus and method |
| 08/18/2004 | EP1447171A1 Surface finishing apparatus and method |
| 08/18/2004 | EP1446263A2 Method for polishing a substrate surface |
| 08/18/2004 | EP1349703B1 Belt polishing device with double retainer ring |
| 08/18/2004 | EP1252629B1 Reduced voltage input/reduced voltage output repeaters for high resistance or high capacitance signal lines and methods therefor |
| 08/18/2004 | CN1521813A 化学机械研磨垫 The chemical mechanical polishing pad |
| 08/18/2004 | CN1521226A Slurry for cmp, and method of manufacturing semiconductor device |
| 08/18/2004 | CN1520961A Lapping apparatus and lapping method |
| 08/18/2004 | CN1520960A Lapping apparatus and lapping method |
| 08/18/2004 | CN1162490C Composition and method for flatting surfaces |
| 08/18/2004 | CN1162253C Grinding method and appts. and grinding carrier used by grinding method and appts. |
| 08/17/2004 | US6777337 Planarizing method of semiconductor wafer and apparatus thereof |
| 08/17/2004 | US6777335 Polishing method |
| 08/17/2004 | US6776917 Chemical mechanical polishing thickness control in magnetic head fabrication |
| 08/17/2004 | US6776871 Method and apparatus for endpointing a chemical-mechanical planarization process |
| 08/17/2004 | US6776870 Ditch type floating ring for chemical mechanical polishing |
| 08/17/2004 | US6776810 Anionic abrasive particles treated with positively charged polyelectrolytes for CMP |
| 08/17/2004 | US6776699 Abrasive pad for CMP |
| 08/17/2004 | US6776696 Continuous chemical mechanical polishing process for polishing multiple conductive and non-conductive layers on semiconductor wafers |
| 08/17/2004 | US6776695 Platen design for improving edge performance in CMP applications |
| 08/17/2004 | US6776694 Methods for carrier head with multi-part flexible membrane |
| 08/17/2004 | US6776693 Method and apparatus for face-up substrate polishing |
| 08/17/2004 | US6776692 Closed-loop control of wafer polishing in a chemical mechanical polishing system |
| 08/17/2004 | US6776691 Polishing/cleaning method as well as method of making a wiring section using a polishing apparatus |
| 08/17/2004 | US6776690 Storage device slider with sacrificial lapping extension |
| 08/17/2004 | US6776688 Providing pad having embedded magnetorheological fluid, applying selective magnetic field to magnetorheological fluid to control stiffness of pad at selective regions to control polishing of object with pad |
| 08/12/2004 | WO2004068570A1 Cmp polishing compound and polishing method |
| 08/12/2004 | WO2004067230A1 Polishing piece, polishing lap, and method of polishing glass panel for crt |
| 08/12/2004 | WO2004067228A1 Method and device for the high-precision machining of the surface of an object, especially for polishing and lapping semiconductor substrates |
| 08/12/2004 | US20040157985 Polyurethane composition and polishing pad |
| 08/12/2004 | US20040157538 Apparatuses and methods for conditioning polishing pads used in polishing micro-device workpieces |
| 08/12/2004 | US20040157534 CMP pad with composite transparent window |
| 08/12/2004 | US20040157533 CMP pad with composite transparent window |
| 08/12/2004 | US20040157531 End-point detection apparatus |
| 08/12/2004 | US20040157530 Lapping apparatus and lapping method |
| 08/12/2004 | US20040157458 Methods for planarization of metal-containing surfaces using halogens and halides salts |
| 08/12/2004 | US20040157454 Chemical-mechanical polishing slurry and method |
| 08/12/2004 | US20040155013 Method and apparatus for polishing a substrate |
| 08/12/2004 | US20040154931 Polishing liquid, polishing method and polishing apparatus |
| 08/12/2004 | US20040154533 Apparatuses for forming a planarizing pad for planarization of microlectronic substrates |
| 08/12/2004 | US20040154452 Punching apparatus for backing-films of CMP machines and preventive maintenance method for the same |
| 08/12/2004 | US20040154231 Mixture of abrasive, deionizing water, pH controller and polyethylenimine; removal silica, silicon nitride; process control |
| 08/12/2004 | US20040154229 Cerium oxide overcoated with silicon compound and aluminum compound |
| 08/11/2004 | EP1445796A1 POLISHING COMPOUND, METHOD FOR PRODUCTION THEREOF AND POLISHING METHOD |
| 08/11/2004 | EP1445067A2 Polishing pad and method of manufacturing semiconductor devices |
| 08/11/2004 | EP1349704B1 Polishing platen with pressurized membrane |
| 08/11/2004 | CN1520449A Cerium-based polish and cerium-based polish slurry |
| 08/11/2004 | CN1520348A End point detection system for mechanical polishing applications |
| 08/11/2004 | CN1519894A Polishing mat and method of mfg. semiconductor device |
| 08/11/2004 | CN1161211C Platen coating structure for chemical mechanical polishing and method |
| 08/10/2004 | US6774660 Evaluating pattern for measuring an erosion of a semiconductor wafer polished by a chemical mechanical polishing |
| 08/10/2004 | US6774041 Polishing method, metallization fabrication method, method for manufacturing semiconductor device and semiconductor device |
| 08/10/2004 | US6773939 Method and apparatus for determining critical dimension variation in a line structure |
| 08/10/2004 | US6773476 Silicon dioxide or aluminum oxide abrasive; polyether; citric acid, oxalic acid, tartaric acid, glycine, alpha -alanine or histidine accelerant; benzotriazole, benzimidazole, triazole, imidazole or tolyltriazole stabilizer; h2o2 and water |
| 08/10/2004 | US6773338 Polishing head and chemical mechanical polishing apparatus including the same |
| 08/10/2004 | US6773337 Method and apparatus to recondition an ion exchange polish pad |
| 08/10/2004 | US6773332 Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization |
| 08/10/2004 | US6772784 Proportional pressure regulator having positive and negative pressure delivery capability |
| 08/05/2004 | WO2004064965A1 Transmitter for wireless control |
| 08/05/2004 | WO2004014603A3 Polishing pad with window |
| 08/05/2004 | US20040153197 Modeling an abrasive process to achieve controlled material removal |
| 08/05/2004 | US20040152403 Retaining ring with flange for chemical mechanical polishing |
| 08/05/2004 | US20040152402 Wafer polishing with counteraction of centrifugal forces on polishing slurry |
| 08/05/2004 | US20040152401 Arrangement of a chemical-mechanical polishing tool and method of chemical-mechanical polishing using such a chemical-mechanical polishing tool |
| 08/05/2004 | US20040152400 Polishing apparatus |
| 08/05/2004 | US20040152397 Method of planarizing a semiconductor die |
| 08/05/2004 | US20040152396 Substrate monitoring during chemical mechanical polishing |
| 08/05/2004 | US20040152337 Manufacturing method of semiconductor device |
| 08/05/2004 | US20040152325 Chemical mechanical polishing method, and washing/rinsing method associated therewith |
| 08/05/2004 | US20040152318 Semiconductor device manufacturing method |
| 08/05/2004 | US20040152316 Method of manufacturing semiconductor device |
| 08/05/2004 | US20040152310 Signal improvement in eddy current sensing |
| 08/05/2004 | US20040152308 heating a rare earth carboxylates with alkoxyalcoholst to form solutions, then adding a silicon alkoxide and activators, mixing with water to form gels and thermal decomposition under slightly reductive atmosphere, to form rare earth element-activated rare earth silicate phosphors |
| 08/05/2004 | US20040149690 Computer integrated manufacturing control system for oxide chemical mechanical polishing |
| 08/05/2004 | US20040148867 Metal abrasive composition and polishing method |
| 08/05/2004 | DE10261306A1 Haltering mit reduzierter Abnutzungs- und Kontaminationsrate für einen Polierkopf einer CMP-Anlage Retaining ring for minimal wear and contamination rate for a polishing head of a CMP tool |
| 08/04/2004 | EP1442840A1 Anti-scattering layer for polishing pad windows |
| 08/04/2004 | EP1442839A1 Method and apparatus for handling disc shaped objects |
| 08/04/2004 | EP1189729B1 Method of modifying a surface of a structured wafer |
| 08/04/2004 | CN1160430C Composition and method for planarizing surfaces |
| 08/03/2004 | US6770929 Surrounding an active area or array to be polished with a border of the active material so the border is wider than a single active area within the array |
| 08/03/2004 | US6769972 CMP polishing unit with gear-driven conditioning disk drive transmission |
| 08/03/2004 | US6769970 Fluid venting platen for optimizing wafer polishing |
| 08/03/2004 | US6769969 Raised island abrasive, method of use and lapping apparatus |
| 08/03/2004 | US6769968 Interchangeable conditioning disk apparatus |
| 08/03/2004 | US6769967 Apparatus and method for refurbishing polishing pads used in chemical-mechanical planarization of semiconductor wafers |
| 08/03/2004 | US6769966 Workpiece holder for polishing, polishing apparatus and polishing method |
| 08/03/2004 | US6769961 Chemical mechanical planarization (CMP) apparatus |
| 08/03/2004 | US6769960 System for manufacturing a semiconductor device, polishing slurry feeder and method for manufacturing a semiconductor device |
| 08/03/2004 | US6769959 Method and system for slurry usage reduction in chemical mechanical polishing |
| 07/29/2004 | WO2004062853A1 Method of using a soft subpad for chemical mechanical polishing |
| 07/29/2004 | WO2004062849A1 Pad constructions for chemical mechanical planarization applications |
| 07/29/2004 | WO2004062847A2 Polishing head test station |