| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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| 09/08/2004 | EP0852063B1 Method of modifying an exposed surface of a semiconductor wafer |
| 09/08/2004 | CN2640035Y Vernier screw set of semiconductor chip pushing apparatus |
| 09/08/2004 | CN1527870A Cerium based abrasive material and abrasive material slurry, and method for producing cerium based abrasive material |
| 09/08/2004 | CN1526786A Cerium oxide abrasive material and grinding method of base plate |
| 09/08/2004 | CN1165975C Method of planarizing upper surface of semiconductor wafer |
| 09/08/2004 | CN1165589C Mixed polishing paste |
| 09/08/2004 | CN1165408C Fluid dispensing fixed abrasive polishing pad |
| 09/07/2004 | US6787055 Carrier heads, planarizing machines and methods for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies |
| 09/07/2004 | US6786945 Polishing compound and method for polishing substrate |
| 09/07/2004 | US6786944 For use in micro isolating step or a planarizing step of an inter layer dielectric in production of semiconductor devices |
| 09/07/2004 | US6786810 Curing abrasive coating having a backing to make transparent to visible light |
| 09/07/2004 | US6786809 Wafer carrier, wafer carrier components, and CMP system for polishing a semiconductor topography |
| 09/07/2004 | US6786805 Method and apparatus for planarizing a microelectronic substrate with a tilted planarizing surface |
| 09/02/2004 | WO2004075276A1 Polishing apparatus, method of polishing and process for producing semiconductor device |
| 09/02/2004 | WO2004075275A1 Carrier head for chemical mechanical polishing apparatus |
| 09/02/2004 | WO2004074180A1 Alkali-resistant cocoon-shaped colloidal silica particle and process for producing the same |
| 09/02/2004 | WO2004073926A1 Polishing article for electro-chemical mechanical polishing |
| 09/02/2004 | WO2004073922A2 Abrasives for copper cmp and methods for making |
| 09/02/2004 | US20040171340 Microporous polishing pads |
| 09/02/2004 | US20040171339 Microporous polishing pads |
| 09/02/2004 | US20040171338 Microporous polishing pads |
| 09/02/2004 | US20040171336 End face polishing apparatus |
| 09/02/2004 | US20040171332 End face polishing apparatus |
| 09/02/2004 | US20040171331 Chemical mechanical polishing head assembly having floating wafer carrier and retaining ring |
| 09/02/2004 | US20040171329 Fabrication of devices with fibers engaged to grooves on substrates |
| 09/02/2004 | US20040171269 Substrate processing method |
| 09/02/2004 | US20040171266 Method for operating chemical mechanical polishing ("CMP") tool for the manufacture of semiconductor devices |
| 09/02/2004 | US20040171264 Methods of polishing, interconnect-fabrication, and producing semiconductor devices |
| 09/02/2004 | US20040169474 Fine particle sizes; narrow particle size distribution |
| 09/02/2004 | US20040168926 Electrodeposition; supplying solution; rotating wafers |
| 09/01/2004 | EP1451863A2 Method for copper cmp using polymeric complexing agents |
| 09/01/2004 | EP1252628B1 Full swing voltage input/full swing voltage output bi-directional repeaters for high resistance or high capacitance bi-directional signal lines and methods therefor |
| 09/01/2004 | EP1124912A4 A chemical mechanical polishing slurry system having an activator solution |
| 09/01/2004 | CN2637098Y Electro rhoological effect grinding device |
| 09/01/2004 | CN1525900A 基片抛光机 Substrate polishing machine |
| 09/01/2004 | CN1524918A Chemically machinery polishing serum |
| 09/01/2004 | CN1524917A Cerium oxide abrasive and method of polishing substrates |
| 08/31/2004 | US6785010 Substrate film thickness measurement method, substrate film thickness measurement apparatus and substrate processing apparatus |
| 08/31/2004 | US6783446 Chemical mechanical polishing apparatus and method of chemical mechanical polishing |
| 08/31/2004 | US6783445 Polishing apparatus |
| 08/31/2004 | US6783441 Apparatus and method for transferring a torque from a rotating hub frame to a one-piece hub shaft |
| 08/31/2004 | US6783440 Polishing apparatus |
| 08/31/2004 | US6783437 Edge-sealed pad for CMP process |
| 08/31/2004 | US6783436 Polishing pad with optimized grooves and method of forming same |
| 08/31/2004 | US6783434 Cerium oxide slurry containing cerium oxide particles, a dispersant polymer containing ammonium acrylate as a copolymerized ingredient, a polyammonium-acrylate or a polyamine-acrylate, and water |
| 08/31/2004 | US6783432 Applying composition to polishing media, comprising: a pressure sensitive solution; one or more chemical agents comprising a complexing agent for complexing with a metal or oxidized metal, a corrosion inhibitor; and polishing |
| 08/31/2004 | US6783427 Polishing system with air exhaust system |
| 08/31/2004 | US6783426 Method and apparatus for detection of chemical mechanical planarization endpoint and device planarity |
| 08/26/2004 | WO2004073055A1 Method for simulating slurry flow for a grooved polishing pad |
| 08/26/2004 | WO2004072332A1 Polishing fluid, method of polishing, and polishing apparatus |
| 08/26/2004 | WO2004072203A1 Process for producing polishing composition |
| 08/26/2004 | WO2004027837B1 Temperature-controlled substrate holder |
| 08/26/2004 | WO2003105191A3 Subpad having robust, sealed edges |
| 08/26/2004 | US20040166792 Planarizing pads for planarization of microelectronic substrates |
| 08/26/2004 | US20040166789 Method of sealing wafer backside for full-face processing |
| 08/26/2004 | US20040166783 Polishing apparatus and method |
| 08/26/2004 | US20040166782 System and method for polishing and planarizing semiconductor wafers using reduced surface area polishing pads and variable partial pad-wafer overlapping techniques |
| 08/26/2004 | US20040166780 Polishing pad apparatus and methods |
| 08/26/2004 | US20040166779 Materials and methods for chemical-mechanical planarization |
| 08/26/2004 | US20040166778 Method for lapping and a lapping apparatus |
| 08/26/2004 | US20040166773 Polishing apparatus |
| 08/26/2004 | US20040166771 Methods with resolution enhancement feature for improving accuracy of conversion of required chemical mechanical polishing pressure to force to be applied by polishing head to wafer |
| 08/26/2004 | US20040166769 Apparatus and method for abrading a workpiece |
| 08/26/2004 | US20040166767 Lapping apparatus and lapping method |
| 08/26/2004 | US20040166686 Dynamically adjustable slurry feed arm for wafer edge profile improvement in CMP |
| 08/26/2004 | US20040166685 Methods and apparatus for polishing control |
| 08/26/2004 | US20040165177 System and method of broad band optical end point detection for film change indication |
| 08/26/2004 | US20040163946 Pad assembly for electrochemical mechanical processing |
| 08/26/2004 | DE10305711A1 Polishing head holder in chemo-mechanical polishing system, has ring-shaped gimbal plate movably supported by gimbal rod |
| 08/25/2004 | EP1448737A1 Additive composition, slurry composition including the same, and method of polishing an object using the slurry composition |
| 08/25/2004 | EP1448736A1 Boron-containing polishing system and method |
| 08/25/2004 | EP1448340A1 Assembly system for stationing semiconductor wafer and process for manufactoring semiconductor wafer |
| 08/25/2004 | CN1524030A Polishing pad and system |
| 08/25/2004 | CN1524027A Control of chemical mechanical polishing pad conditioner directional velocity to improve pad life |
| 08/25/2004 | CN1523461A Automatic control device and method for grinding slurry feed arm |
| 08/25/2004 | CN1522833A Method of and apparatus for lapping magnetic head slider |
| 08/24/2004 | US6780773 Method of chemical mechanical polishing with high throughput and low dishing |
| 08/24/2004 | US6780350 Metal-carbon composite powders, methods for producing powders and devices fabricated from same |
| 08/24/2004 | US6780095 Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates |
| 08/24/2004 | US6780092 Polishing tool used for CMP |
| 08/24/2004 | US6780091 Machining strain removal apparatus |
| 08/24/2004 | US6780086 Determining an endpoint in a polishing process |
| 08/24/2004 | US6780085 Fiber optical sensor embedded into the polishing pad for in-situ, real-time, monitoring of thin films during the chemical mechanical planarization process |
| 08/24/2004 | US6780083 Apparatus and method for the chemical mechanical polishing of the surface of circular flat workpieces, in particular semi-conductor wafers |
| 08/19/2004 | WO2004070806A1 Substrate holding apparatus and polishing apparatus |
| 08/19/2004 | WO2004070778A2 Apparatus and method for polishing semiconductor wafers using one or more pivotable load-and-unload cups |
| 08/19/2004 | WO2004069477A1 Modeling an abrasive process to achieve controlled material removal |
| 08/19/2004 | WO2004069476A1 Cmp pad with composite transparent window |
| 08/19/2004 | WO2004069475A1 Wafer polishing with counteraction of centrifugal forces on polishing slurry |
| 08/19/2004 | WO2004069470A2 Cmp pad with composite transparent window |
| 08/19/2004 | WO2004048037A3 Spring-loaded contour following end effectors for lapping/polishing |
| 08/19/2004 | WO2004048031A3 Contour following end effectors for lapping/polishing |
| 08/19/2004 | US20040162688 Method for simulating slurry flow for a grooved polishing pad |
| 08/19/2004 | US20040162013 Polishing pads with polymer filled fibrous web, and methods for fabricating and using same |
| 08/19/2004 | US20040162007 Chemical mechanical polishing atomizing rinse system |
| 08/19/2004 | US20040162006 Abrasives for copper CMP and methods for making |
| 08/19/2004 | US20040162005 Method of and apparatus for lapping magnetic head slider |
| 08/19/2004 | US20040161939 Method and apparatus for applying downward force on wafer during CMP |
| 08/19/2004 | US20040161938 Chemical-mechanical planarization using ozone |
| 08/19/2004 | US20040161932 Slurry for cmp, and method of manufacturing semiconductor device |