| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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| 09/30/2004 | US20040188244 Electro-chemical machining apparatus |
| 09/30/2004 | US20040188083 Flow completion system |
| 09/30/2004 | US20040187393 Polishing composition |
| 09/29/2004 | EP1349705B1 Polishing pad and method of use thereof |
| 09/29/2004 | CN2644093Y High-speed grinder |
| 09/29/2004 | CN1533595A Polishing method and grinding fluid |
| 09/29/2004 | CN1533420A Additive compositon, slurry composition including the same, and method of polishing an object using the slurry composition |
| 09/29/2004 | CN1533316A Projected gimbal point drive |
| 09/29/2004 | CN1532245A 抛光组合物 The polishing composition |
| 09/29/2004 | CN1532025A Grinder with easily detached grinding sheet |
| 09/29/2004 | CN1168575C Method for repairing and maintaining grinding board by using double-board grinding machine |
| 09/28/2004 | US6799136 Method of estimation of wafer polish rates |
| 09/28/2004 | US6798529 In-situ method and apparatus for end point detection in chemical mechanical polishing |
| 09/28/2004 | US6797626 Method of polishing copper layer of substrate |
| 09/28/2004 | US6797624 Solution for ruthenium chemical mechanical planarization |
| 09/28/2004 | US6797623 Methods of producing and polishing semiconductor device and polishing apparatus |
| 09/28/2004 | US6797190 Wafer carrier assembly for a chemical mechanical polishing apparatus and a polishing method using the same |
| 09/28/2004 | US6797132 Apparatus for plating and polishing a semiconductor workpiece |
| 09/28/2004 | US6796887 Wear ring assembly |
| 09/28/2004 | US6796885 Pad conditioner coupling and end effector for a chemical mechanical planarization system and method therfor |
| 09/28/2004 | US6796883 Controlled lubricated finishing |
| 09/28/2004 | US6796881 Sensing the presence of a wafer |
| 09/28/2004 | US6796880 Linear polishing sheet with window |
| 09/28/2004 | US6796879 Dual wafer-loss sensor and water-resistant sensor holder |
| 09/28/2004 | US6796877 Abrading machine |
| 09/28/2004 | US6796703 Conductivity feedback control system for slurry bending |
| 09/23/2004 | WO2004080654A1 Polishing tool and polishing apparatus |
| 09/23/2004 | US20040185756 Method of planarizing substrates |
| 09/23/2004 | US20040185755 Method of reducing defectivity during chemical mechanical planarization |
| 09/23/2004 | US20040185753 Pattern-electroplated lapping plates for reduced loads during single slider lapping and process for their fabrication |
| 09/23/2004 | US20040185639 Ic chip manufacturing method |
| 09/23/2004 | US20040185187 comprises liquid crystal compounds for fixing a pad for chemical mechanical polishing of semiconductor wafers |
| 09/23/2004 | US20040184890 Fluid transport system with vibrators |
| 09/23/2004 | US20040182721 Process control in electro-chemical mechanical polishing |
| 09/23/2004 | US20040182720 Measuring thickness equivalent data of a film on a wafer, making a cathode member smaller than the surface face a region, interposing an electrolytic solution between the surface and the cathode member, applying a voltage using the cathode member as a cathode and the film an anode, electrolytic polishing |
| 09/23/2004 | DE10218483B4 Vorrichtung zur gleichzeitig beidseitigen Material abtragenden Bearbeitung von Werkstücken Apparatus for simultaneous bilateral material-removing machining of workpieces |
| 09/22/2004 | EP1459371A1 Methods for planarization of group viii metal-containing surfaces using complexing agents |
| 09/22/2004 | EP1459370A2 Methods for planarization of group viii metal-containing surfaces using oxidizing gases |
| 09/22/2004 | EP1459368A1 Novel use of alkaline earth metal salts |
| 09/22/2004 | EP1458830A1 Polishing pad |
| 09/22/2004 | EP1458829A1 Methods for planarization of metal-containing surfaces using halogens and halide salts |
| 09/22/2004 | EP1458522A1 Apparatus and methods for controlling wafer temperature in chemical mechanical polishing |
| 09/22/2004 | EP1458520A1 Methods for planarization of group viii metal-containing surfaces using a fixed abrasive article |
| 09/22/2004 | CN2643479Y Wafer polishing cramp ring |
| 09/22/2004 | CN1531748A Method for chemical mechanical polishing (CMP) with altering concentration of oxidizing agent in slurry |
| 09/22/2004 | CN1531747A Planarization of substrates using electrochemical mechanical polishing |
| 09/22/2004 | CN1531473A Conductive polishing article for electrochemical mechanical polishing |
| 09/22/2004 | CN1530205A Reflective resistant layer for polsihig pad window |
| 09/22/2004 | CN1168123C Correction of metal inlaid wiring form |
| 09/21/2004 | US6794605 Method for fabricating chemical mechanical polshing pad using laser |
| 09/21/2004 | US6794289 Method and apparatuses for making and using bi-modal abrasive slurries for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies |
| 09/21/2004 | US6794285 Slurry for CMP, and method of manufacturing semiconductor device |
| 09/21/2004 | US6794206 Method of polishing a film |
| 09/21/2004 | US6793837 Process for material-removing machining of both sides of semiconductor wafers |
| 09/21/2004 | US6793565 Orbiting indexable belt polishing station for chemical mechanical polishing |
| 09/21/2004 | US6793561 Removable/disposable platen top |
| 09/21/2004 | US6793559 Composition and method for polishing rigid disks |
| 09/21/2004 | US6793558 Method and apparatus for planarizing a microelectronic substrate with a tilted planarizing surface |
| 09/21/2004 | US6793557 Removable lapping guide for magnetic recording head and method of use |
| 09/16/2004 | WO2004078411A2 Method and apparatus for local polishing control |
| 09/16/2004 | WO2004078410A2 Agent for increasing selection ratio of polishing rates |
| 09/16/2004 | WO2004069470A3 Cmp pad with composite transparent window |
| 09/16/2004 | US20040180612 Boron-containing polishing system and method |
| 09/16/2004 | US20040180611 Glass substrate for data recording medium, manufacturing method thereof and polishing pad used in the method |
| 09/16/2004 | US20040180610 Polishing apparatus and polishing method |
| 09/16/2004 | US20040180608 Ion bombardment of electrical lapping guides to decrease noise during lapping process |
| 09/16/2004 | US20040180607 Polishing method and polishing apparatus |
| 09/16/2004 | US20040179310 Embedded lapping guide |
| 09/16/2004 | US20040177563 For chemical-mechanical polishing; combining a polymer resin with a supercritical gas to produce a single phase solution and forming a pad from the solution; gas is generated by subjecting a gas to an elevated temperature and pressure. |
| 09/16/2004 | DE10308064A1 Mechanism for chemo-mechanical polishing (CMP) of semiconductor wafers with polishing medium specified supply, polishing plate and polishing head, which presses wafer onto plate, with supply appliance for polishing medium |
| 09/15/2004 | EP1455988A1 Air platen for leading edge and trailing edge control |
| 09/15/2004 | CN2640700Y Double-side grinding precision grinding equipment |
| 09/15/2004 | CN1167109C Mechanical chemical polishing method for aluminium or aluminium alloy conducting layer |
| 09/15/2004 | CN1166986C Leveling method |
| 09/14/2004 | US6790883 Composition for polishing pad and polishing pad using the same |
| 09/14/2004 | US6790769 CMP slurry and method of manufacturing semiconductor device |
| 09/14/2004 | US6790768 Methods and apparatus for polishing substrates comprising conductive and dielectric materials with reduced topographical defects |
| 09/14/2004 | US6790763 Substrate processing method |
| 09/14/2004 | US6790135 Finishing machine having a sandpaper positioning function |
| 09/14/2004 | US6790130 Semiconductor processing methods of removing conductive material |
| 09/14/2004 | US6790129 Method for polishing angular substrates |
| 09/14/2004 | US6790128 Fluid conserving platen for optimizing edge polishing |
| 09/14/2004 | US6790127 Apparatus and method for feeding slurry |
| 09/14/2004 | US6790125 Backside integrated circuit die surface finishing technique and tool |
| 09/14/2004 | US6790123 Method for processing a work piece in a multi-zonal processing apparatus |
| 09/10/2004 | WO2004077538A1 Polishing device, polishing method, and semiconductor device producing method |
| 09/10/2004 | WO2004077520A2 Wafer polishing and pad conditioning methods |
| 09/10/2004 | WO2004076574A2 Cmp composition comprising a sulfonic acid and a method for polishing noble metals |
| 09/10/2004 | WO2004076126A1 Materials and methods for chemical-mechanical planarization |
| 09/10/2004 | WO2004042529A3 Method and apparatus for processing sliders for use in disk drives and the like |
| 09/10/2004 | WO2004028746A3 Brazed diamond tools and methods for making the same |
| 09/09/2004 | US20040177297 Apparatus with resolution enhancement feature for improving accuracy of conversion of required chemical mechanical polishing pressure to force to be applied by polishing head to wafer |
| 09/09/2004 | US20040176018 Systems and methods for monitoring characteristics of a polishing pad used in polishing micro-device workpieces |
| 09/09/2004 | US20040176017 Apparatus and methods for abrading a work piece |
| 09/09/2004 | US20040176014 Chemical mechanical polishing apparatus with non-conductive elements |
| 09/09/2004 | US20040176013 Multi-chambered, compliant apparatus for restraining workpiece and applying variable pressure thereto during lapping to improve flatness characteristics of workpiece |
| 09/09/2004 | US20040175951 Substrate carrier with a textured membrane |
| 09/09/2004 | US20040174029 Workpiece handling end-effector and a method for processing workpieces using a workpiece handling end-effector |
| 09/09/2004 | US20040173461 Method and apparatus for local polishing control |
| 09/09/2004 | US20040173307 Apparatus and method for supplying chemicals in chemical mechanical polishing systems |