Patents for B24B 37 - Lapping machines or devices; Accessories (20,836)
10/2004
10/19/2004US6805613 Multiprobe detection system for chemical-mechanical planarization tool
10/19/2004US6805051 Lithographic printing plate support and method of manufacturing the same
10/14/2004WO2004087375A1 Chip customized polish pads for chemical mechanical planarization (cmp)
10/14/2004WO2004087372A1 Finishing method and finishing device
10/14/2004WO2004087371A1 Machining method and machining device
10/14/2004WO2004077520A3 Wafer polishing and pad conditioning methods
10/14/2004WO2003038882A8 Method and pad for polishing wafer
10/14/2004US20040203328 Measuring apparatus
10/14/2004US20040203326 Conditioning mechanism for chemical mechanical polishing
10/14/2004US20040203325 Conditioner disk for use in chemical mechanical polishing
10/14/2004US20040203323 Chemical mechanical polishing apparatus
10/14/2004US20040203322 Method and system for in-situ monitoring of mixing ratio of high selectivity slurry
10/14/2004US20040203320 Abrasive pad, method and metal mold for manufacturing the same, and semiconductor wafer polishing method
10/14/2004US20040203252 CMP slurry for nitride and CMP method using the same
10/14/2004US20040203241 Chemical-mechanical planarization slurries and powders and methods for using same
10/14/2004US20040201093 Evaluating pattern for measuring and erosion of a semiconductor wafer polished by a chemical mechanical polishing
10/14/2004DE10314625B3 Process for post-processing precision surfaces on random workpieces comprises using a rotating polishing tool for fine grinding an polishing having a polishing element which is longitudinally guided in a guiding chamber of a housing
10/14/2004CA2519942A1 Chip customized polish pads for chemical mechanical planarization (cmp)
10/13/2004EP1467403A1 Polishing pad, process for producing the same, and method of polishing
10/13/2004EP1467402A1 Ic chip manufacturing method
10/13/2004EP1467105A1 Proportional pressure regulator having positive and negative pressure delivery capability
10/13/2004EP1466699A1 Abrasive pad, method and metal mold for manufacturing the same, and semiconductor wafer polishing method
10/13/2004EP1465957A1 Cmp systems and methods utilizing amine-containing polymers
10/13/2004EP1465753A2 Pads for cmp and polishing substrates
10/13/2004EP1465750A1 Abrasive article for the deposition and polishing of a conductive material
10/13/2004EP1330841B1 Method for assembling planar workpieces
10/13/2004EP1324859A4 Polishing pad with built-in optical sensor
10/13/2004CN1537324A Polising method and device
10/13/2004CN1537084A Aluminium-zirconium oxide and their preparing and using method
10/13/2004CN1537082A Method for preparing amorphous material and ceramics
10/13/2004CN1537038A Apparatus and method for controlling wafer temp. in chemical mechanical polishing
10/13/2004CN1537037A Multiport polishing fluid delivery system
10/13/2004CN1536046A Polishing composition
10/13/2004CN1535796A Ion bombardment electric grinding indicator for keducing noise in course of grinding process
10/13/2004CN1170903C Ta barrier slurry containing organic additive
10/13/2004CN1170655C Apparatus and method for the restoration of optical storage media
10/12/2004US6803293 Method of processing a semiconductor wafer
10/12/2004US6802983 Preparation of high performance silica slurry using a centrifuge
10/12/2004US6802762 Method for supplying slurry to polishing apparatus
10/12/2004US6802761 Pattern-electroplated lapping plates for reduced loads during single slider lapping and process for their fabrication
10/12/2004US6802760 Disk restoration service vending machine
10/07/2004US20040199293 System and method for point of use delivery, control and mixing chemical and slurry for CMP/cleaning system
10/07/2004US20040198621 Cleaning solutions including nucleophilic amine compound having reduction and oxidation potentials
10/07/2004US20040198204 Turning tool for grooving polishing pad, apparatus and method of producing polishing pad using the tool, and polishing pad produced by using the tool
10/07/2004US20040198203 Abrasive pad
10/07/2004US20040198200 Pad conditioner of CMP equipment
10/07/2004US20040198199 Turning tool for grooving polishing pad, apparatus and method of producing polishing pad using the tool, and polishing pad produced by using the tool
10/07/2004US20040198195 Apparatuses for making and using bi-modal abrasive slurries for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies
10/07/2004US20040198194 Methods for using bi-modal abrasive slurries for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies
10/07/2004US20040198193 Method of manufacturing glass substrate for data recording medium
10/07/2004US20040198190 Method and apparatus for reduction of defects in wet processed layers
10/07/2004US20040198187 Polishing pad with a partial adhesive coating
10/07/2004US20040198186 Polishing apparatus
10/07/2004US20040198185 Linear polishing sheet with window
10/07/2004US20040198184 Planarizing machines and methods for dispensing planarizing solutions in the processing of microelectronic workpieces
10/07/2004US20040198183 Turbidity monitoring methods, apparatuses, and sensors
10/07/2004US20040198180 Method for chemical-mechanical polish control in semiconductor manufacturing
10/07/2004US20040198056 Polishing pad and semiconductor substrate manufacturing method using the polishing pad
10/07/2004US20040198052 Apparatus for manufacturing semiconductor device
10/07/2004US20040198011 Polishing method
10/07/2004US20040197541 Selective electroless deposition and interconnects made therefrom
10/07/2004US20040195548 Forming an aqueous solution containing soluble precursors of a sulfur-containing phosphor; generating an aerosol of droplets from above solution, heating droplets to form a particulate intermediate compound capable of being post-treated to form said sulfur-containing phosphor powder
10/07/2004US20040195110 Method and apparatus for electrochemical planarization of a workpiece
10/07/2004US20040194937 Heat exchanger
10/07/2004US20040194392 Polishing compound, method for production thereof, and polishing method
10/07/2004US20040194336 Pressure vessel systems and methods for dispensing liquid chemical compositions
10/06/2004EP1464444A1 Abrasive pad
10/06/2004EP1368157B1 Polishing disk with end-point detection port
10/06/2004CN2645851Y Diesel engine cylinder cover valve lapping abrasive machine
10/06/2004CN1535197A Fixed abrasive articles with wear indicators
10/06/2004CN1535196A Feed and feedback control of chemical mechanical polishing pad conditioning
10/06/2004CN1534736A Chemical mechanical polishing method and related washing/flushing method
10/06/2004CN1169654C Multilayer retaining ring for chemical mechanical polishing
10/05/2004US6801396 Substrate independent superpolishing process and slurry
10/05/2004US6801326 Method and apparatus for monitoring a chemical mechanical planarization process applied to metal-based patterned objects
10/05/2004US6801322 Method and apparatus for IN SITU measuring a required feature of a layer during a polishing process
10/05/2004US6800556 Polishing method using ceria slurry, and method of manufacturing semiconductor device
10/05/2004US6800360 Porous ceramics and method of preparing the same as well as microstrip substrate
10/05/2004US6800105 Abrasive for metal
10/05/2004US6800020 Web-style pad conditioning system and methods for implementing the same
10/05/2004US6800019 Abrasive cloth and polishing method
09/2004
09/30/2004WO2004084287A1 Material for purification of semiconductor polishing slurry, module for purification of semiconductor polishing slurry and process for producing semiconductor polishing slurry
09/30/2004WO2004083285A1 Composite material
09/30/2004WO2004082890A1 Wafer-retaining carrier, double side-grinding device using the same, and double side-grinding method for wafer
09/30/2004WO2004030860A3 Flow control system
09/30/2004WO2002087825A8 Integrated endpoint detection system with optical and eddy current monitoring
09/30/2004US20040192179 Dual-bulge flexure ring for CMP head
09/30/2004US20040192178 Diamond conditioning of soft chemical mechanical planarization/polishing (CMP) polishing pads
09/30/2004US20040192177 Microelectronic substrate assembly planarizing machines and methods of mechanical and chemical-mechanical planarization of microelectronic substrate assemblies
09/30/2004US20040192176 Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads
09/30/2004US20040192175 Polishing pad, method of manufacturing glass substrate for use in data recording medium using the pad, and glass substrate for use in data recording medium obtained by using the method
09/30/2004US20040192174 Method for controlling PH during planarization and cleaning of microelectronic substrates
09/30/2004US20040192173 Carrier head with flexible membrane to provide controllable pressure and loading area
09/30/2004US20040192172 Slurry of nonoxidized particles and oxidized particles and separation of particles for semiconductors
09/30/2004US20040192171 Method of producing a glass substrate for a mask blank and method of producing a mask blank
09/30/2004US20040192169 Chemical mechanical polishing endpoint detection system and method
09/30/2004US20040192168 Arrangement and method for conditioning a polishing pad
09/30/2004US20040192063 Method of producing a glass substrate for a mask blank and method of producing a mask blank
09/30/2004US20040192035 Method of manufacturing semiconductor device
09/30/2004US20040188273 Measurement electrical resistance of electroconductive coatings on substrate; detection of end-points