B24B 37 - Lapping machines or devices; Accessories

Patents for B24B 37 - Lapping machines or devices; Accessories (20,836)
11/2004
11/09/2004	US6814835 Apparatus and method for supplying chemicals in chemical mechanical polishing systems
11/09/2004	US6814834 Apparatus and method for reducing removal forces for CMP pads
11/09/2004	US6814767 Polishing composition
11/09/2004	US6814766 Polishing composition and polishing method employing it
11/04/2004	WO2004095558A1 Cmp polishing method and method for manufacturing semiconductor device
11/04/2004	WO2004095516A2 Apparatus and method for polishing semiconductor wafers using one or more polishing surfaces
11/04/2004	WO2004094108A1 Polishing pad with a window
11/04/2004	WO2004094107A1 Conductive polishing pad with anode and cathode
11/04/2004	WO2004094106A1 Diamond conditioning of soft chemical mechanical planarization/polishing (cmp) polishing pads
11/04/2004	WO2004094105A1 Vacuum suction holding apparatus and method, grinding apparatus using the holding apparatus, and device producing method using the grinding apparatus
11/04/2004	WO2004078410A3 Agent for increasing selection ratio of polishing rates
11/04/2004	US20040219870 Two part retaining ring
11/04/2004	US20040219867 Apparatus and method for controlling fluid material composition on a polishing pad
11/04/2004	US20040219865 Substrate polishing apparatus
11/04/2004	US20040216842 Apparatus and method for polishing semiconductor wafers using one or more pivotable load-and-unload cups
11/04/2004	US20040216389 Chemical mechanical polishing slurry
11/04/2004	DE10230146B4 Verfahren zum Bearbeiten eines scheibenförmigen Werkstückes A method for processing a disk-shaped workpiece
11/04/2004	DE102004014953A1 Verfahren zur Herstellung eines Glassubstrats für einen Maskenrohling und Verfahren zur Herstellung eines Maskenrohlings A process for producing a glass substrate for a mask blank and process for the production of a mask blank
11/03/2004	EP1473115A1 Polishing method and polishing device
11/03/2004	EP1472047A1 Advanced chemical mechanical polishing system with smart endpoint detection
11/03/2004	EP1365889A4 System for magnetorheological finishing of substrates
11/03/2004	EP1345733B1 Methods for making reinforced wafer polshing pads and apparatuses implementing the same
11/03/2004	EP1169162B1 Method and apparatus for plating and polishing a semiconductor substrate
11/03/2004	EP0706582B9 Improved compositions and methods for polishing
11/03/2004	CN1543670A Chemical mechanical polishing pad having wave shaped grooves
11/03/2004	CN1543669A Chemical mechanical polishing pad having holes and or grooves
11/03/2004	CN1543668A Forming a semiconductor structure using a combination of planarizing methods and electropolishing
11/03/2004	CN1543595A Apparatus with resolution enhancement feature for improving accuracy of conversion of required chemical mechanical polishing pressure to force to be applied by polishing head to wafer
11/03/2004	CN1543493A Cerium-based abrasive material and method for preparation thereof
11/03/2004	CN1543492A Polishing slurry comprising silica-coated ceria
11/03/2004	CN1543491A Silica-based slurry
11/03/2004	CN1543387A Reinforced polishing pad with a shaped or flexible window structure
11/03/2004	CN1542741A Method for polishing dielectric relative surface of thin-film magnetic head
11/03/2004	CN1542580A Proportional pressure regulator having positive and negative pressure delivery capability
11/03/2004	CN1541807A Polishing pad with optimized grooves and method of using same
11/02/2004	US6812478 In-situ detection of thin-metal interface using optical interference via a dynamically updated reference
11/02/2004	US6811680 Forming a passivation layer on a substrate surface; polishing substrate in an electrolyte solution; applying an anodic bias to substrate surface; removing material from portion of substrate surface
11/02/2004	US6811583 Polishing composition for a substrate for a magnetic disk and polishing method employing it
11/02/2004	US6811473 Process for machining a wafer-like workpiece
11/02/2004	US6811468 Polishing apparatus
11/02/2004	US6811467 Methods and apparatus for polishing glass substrates
11/02/2004	US6811466 System and method for in-line metal profile measurement
10/2004
10/28/2004	WO2004093177A1 Polishing pad and method for producing same
10/28/2004	WO2004092297A1 Cerium-based polishing material
10/28/2004	US20040214514 Polishing machines including under-pads and methods for mechanical and/or chemical-mechanical polishing of microfeature workpieces
10/28/2004	US20040214513 Method for assembling a polishing head and apparatus for detecting air leakage in the polishing head while assembling the same
10/28/2004	US20040214511 Visual wear confirmation polishing pad
10/28/2004	US20040214510 Conductive polishing pad with anode and cathode
10/28/2004	US20040214509 Systems and methods for mechanical and/or chemical-mechanical polishing of microfeature workpieces
10/28/2004	US20040214508 Apparatus and method for controlling film thickness in a chemical mechanical planarization system
10/28/2004	US20040214444 Chemical mechanical polishing slurry and process for ruthenium films
10/28/2004	US20040214443 Silane containing polishing composition for CMP
10/28/2004	US20040214432 Thinning of semiconductor wafers
10/28/2004	US20040211337 for polishing the surface of a thin film layer of a semiconductor or electroluminescent device; silica coating prevents tendency of ceria particles tends to easily agglomerate when compared to other abrasive particles
10/27/2004	EP1471124A1 Polishing composition
10/27/2004	EP1470893A1 Polishing pad and chemical mechanical polishing method
10/27/2004	EP1470892A1 Polishing pad and method of polishing a semiconductor wafer
10/27/2004	EP1470576A1 Electrolytic processing apparatus and substrate processing apparatus and method
10/27/2004	EP1469971A2 Grooved rollers for a linear chemical mechanical planarization system
10/27/2004	EP1349701A4 Jet-induced finishing of a substrate surface
10/27/2004	CN2650938Y Opti-fiber grinder
10/27/2004	CN1541151A 抛光方法 Polishing method
10/27/2004	CN1539598A Polishing pad and its prodn. method
10/27/2004	CN1173334C Terminal test in chemical machinery polishing of cloisonnee structure
10/26/2004	US6809032 Method and apparatus for detecting the endpoint of a chemical-mechanical polishing operation using optical techniques
10/26/2004	US6809029 Semiconductor production device and production method for semiconductor device
10/26/2004	US6808802 Equipment coating
10/26/2004	US6808617 Measuring thickness equivalent data of a film on wafer, making cathode member smaller than surface face region thereof, interposing electrolytic solution between surface and cathode member, applying voltage, electrolytic polishing
10/26/2004	US6808443 Projected gimbal point drive
10/26/2004	US6808442 Apparatus for removal/remaining thickness profile manipulation
10/26/2004	US6807705 Polishing pad and system
10/26/2004	US6807701 Method of cleaning abrasive plates of abrasive machine and cleaning device
10/21/2004	WO2004090963A1 Polishing pad, process for producing the same and method of polishing therewith
10/21/2004	WO2004090502A2 Whole-substrate spectral imaging system for cmp
10/21/2004	US20040209560 Substrate polishing machine
10/21/2004	US20040209559 Chemical mechanical polishing apparatus with rotating belt
10/21/2004	US20040209556 Methods for a multilayer retaining ring
10/21/2004	US20040209554 Polishing material and method of polishing therewith
10/21/2004	US20040209551 Turning tool for grooving polishing pad, apparatus and method of producing polishing pad using the tool, and polishing pad produced by using the tool
10/21/2004	US20040209550 Apparatus and method for polishing semiconductor wafers using one or more polishing surfaces
10/21/2004	US20040209549 Planarizing machines and methods for dispensing planarizing solutions in the processing of microelectronic workpieces
10/21/2004	US20040209548 Planarizing machines and methods for dispensing planarizing solutions in the processing of microelectronic workpieces
10/21/2004	US20040209066 Polishing pad with window for planarization
10/21/2004	US20040206634 Electrolytic processing apparatus and substrate processing apparatus and method
10/21/2004	US20040206454 Inline monitoring of pad loading for CuCMP and developing an endpoint technique for cleaning
10/21/2004	US20040206374 Inline monitoring of pad loading for CuCMP and developing an endpoint technique for cleaning
10/20/2004	EP1468785A2 Polishing pad and production method thereof
10/20/2004	EP1468057A1 Tungsten polishing solution
10/20/2004	EP1467840A1 Process control in electro-chemical mechanical polishing
10/20/2004	EP1467839A2 Method and apparatus for applying downward force on wafer during cmp
10/20/2004	EP1135236B1 Reverse linear polisher with loadable housing
10/20/2004	EP1011919B1 Method of manufacturing a polishing pad
10/20/2004	CN1539162A Slurry composition for use in chemical mechanical polishing of metal wiring
10/20/2004	CN1539000A Silica and silica-based slurry
10/20/2004	CN1171963C Compositions for chemical-mechanical polishing
10/19/2004	US6806948 System and method of broad band optical end point detection for film change indication
10/19/2004	US6806193 Reducing particle deposits on scouring pads used for chemical mechanical polishing (cmp) of semiconductor wafers, using cleaners comprising mixtures of water, ammonium citrate, surfactants and benzotriazole
10/19/2004	US6806100 Molded end point detection window for chemical mechanical planarization
10/19/2004	US6805616 Wafer planarization apparatus and planarization method thereof
10/19/2004	US6805615 Particle size distribution comprising ceria, alumina, titania, and/or tantalum oxide; abrasive slurry

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