| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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| 11/25/2004 | WO2004101223A1 Substrate polishing apparatus |
| 11/25/2004 | WO2004083285A8 Composite material |
| 11/25/2004 | WO2004060610A3 Substrate holding mechanism, substrate polishing apparatus and substrate polishing method |
| 11/25/2004 | US20040235407 Fixed abrasive CMP pad with built-in additives |
| 11/25/2004 | US20040235404 Embedding tool designed to embed grains into faceplate for lapping apparatus |
| 11/25/2004 | US20040235402 Wafer carrier |
| 11/25/2004 | US20040235399 Method using active retainer rings for improving edge performance in CMP applications |
| 11/25/2004 | US20040235398 Chemical mechanical planarization method and apparatus for improved process uniformity, reduced topography and reduced defects |
| 11/25/2004 | US20040235396 Chemical/mechanical polishing method for STI |
| 11/25/2004 | US20040235394 Method of lapping medium-opposing surface in thin-film magnetic head |
| 11/25/2004 | US20040235393 Substrate polishing apparatus |
| 11/25/2004 | US20040235392 Polishing apparatus and polishing pad |
| 11/25/2004 | US20040235390 Reclaiming virgin test wafers |
| 11/25/2004 | US20040235301 Method and device for polishing |
| 11/25/2004 | US20040232379 Multi-oxidizer-based slurry for nickel hard disk planarization |
| 11/25/2004 | US20040232121 Method for fabricating polishing pad using laser beam and mask |
| 11/25/2004 | US20040231793 Method of processing a workpiece, and a work carrier, in particular of porous ceramic |
| 11/25/2004 | US20040231758 Silver-containing particles, method and apparatus of manufacture, silver-containing devices made therefrom |
| 11/25/2004 | US20040231245 Composite material and processing method using the material |
| 11/25/2004 | DE19925696B4 Vorrichtung und Verfahren zum Filtern eines CMP-Breis Device and method for filtering a CMP slurry |
| 11/24/2004 | EP1479741A2 Chemical mechanical polishing method for STI |
| 11/24/2004 | EP1479479A1 Polishing pad |
| 11/24/2004 | EP1478708A1 Method and composition for polishing a substrate |
| 11/24/2004 | EP1478494A1 Method and system for controlling the chemical mechanical polishing of substrates by calculating an overpolishing time and/or a polishing time of a final polishing step |
| 11/24/2004 | EP1478492A2 Polishing composition |
| 11/24/2004 | EP0984846B1 Method of manufacturing a polymeric polishing pad having photolithographically induced surface pattern |
| 11/24/2004 | CN1550034A Constant pH polish and scrub |
| 11/24/2004 | CN1549756A Method for fabricating polishing pad using laser beam and mask |
| 11/24/2004 | CN1549357A Nitride semiconductor wafer and method of processing nitride semiconductor wafer |
| 11/24/2004 | CN1177012C Cerium based abrasive material and method for producing cerium based abrasive material |
| 11/24/2004 | CN1176786C Abrasive cloth and grinding method thereof |
| 11/23/2004 | US6821897 Method for copper CMP using polymeric complexing agents |
| 11/23/2004 | US6821895 Dynamically adjustable slurry feed arm for wafer edge profile improvement in CMP |
| 11/23/2004 | US6821881 Method for chemical mechanical polishing of semiconductor substrates |
| 11/23/2004 | US6821794 Flexible snapshot in endpoint detection |
| 11/23/2004 | US6821570 Method for preparing a polymer for chemical mechanical polishing |
| 11/23/2004 | US6821309 Applying slurry to soft surface layer |
| 11/23/2004 | US6821195 Carrier head having location optimized vacuum holes |
| 11/23/2004 | US6821192 Retaining ring for use in chemical mechanical polishing |
| 11/23/2004 | US6821190 Static pad conditioner |
| 11/23/2004 | US6821189 Abrasive article comprising a structured diamond-like carbon coating and method of using same to mechanically treat a substrate |
| 11/18/2004 | WO2004098832A1 Polishing machines including under-pads and methods for mechanical and/or chemical-mechanical polishing of microfeature workpieces |
| 11/18/2004 | WO2004098829A2 Systems and methods for mechanical and/or chemical-mechanical polishing of microfeature workpieces |
| 11/18/2004 | US20040229552 Anionic abrasive particles treated with positively charged polyelectrolytes for CMP |
| 11/18/2004 | US20040229551 Systems for making and using bi-modal abrasive slurries for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies |
| 11/18/2004 | US20040229550 Method for chemical mechanical planarization (CMP) and chemical mechanical cleaning (CMC) of a work piece |
| 11/18/2004 | US20040229549 Slurry delivery arm |
| 11/18/2004 | US20040229548 Process for polishing a semiconductor wafer |
| 11/18/2004 | US20040229546 Method and apparatus for inline measurement of material removal during a polishing or grinding process |
| 11/18/2004 | US20040229468 Polishing method |
| 11/18/2004 | US20040226656 Wafer carrier pivot mechanism |
| 11/17/2004 | EP1478012A1 Polishing method and polishing fluid |
| 11/17/2004 | EP1478011A1 Method and device for polishing |
| 11/17/2004 | EP1476519A1 Process for chemical-mechanical polishing of metal substrates |
| 11/17/2004 | EP1476518A1 Cmp formulations for the use on nickel-phosphorus alloys |
| 11/17/2004 | EP1299210A4 Polishing pad grooving method and apparatus |
| 11/17/2004 | CN1546283A Optical grinding machine and method for processing sapphire crystal substrate for semiconductor use |
| 11/16/2004 | US6818301 Thermoconductive polymer of a substrate and filler particle of a group ii salt and within; planarizing a surface on a semiconductor wafer |
| 11/16/2004 | US6818095 Chemical mechanical polishing apparatus |
| 11/16/2004 | US6818031 Polishing composition |
| 11/16/2004 | US6817934 Abrasive molding and abrasive disc provided with same |
| 11/16/2004 | US6817928 Method and apparatus for planarizing and cleaning microelectronic substrates |
| 11/16/2004 | US6817926 Polishing pad and method of use thereof |
| 11/16/2004 | US6817925 Multistage fine hole machining method and device |
| 11/16/2004 | US6817924 Chemical mechanical polishing apparatus, profile control system and conditioning method thereof |
| 11/16/2004 | US6817923 Chemical mechanical processing system with mobile load cup |
| 11/16/2004 | CA2263241C Cerium oxide abrasive and method of abrading substrates |
| 11/11/2004 | WO2004097929A2 Method and apparatus for reduction of defects in wet processed layers |
| 11/11/2004 | WO2004097899A2 Wafer carrier pivot mechanism |
| 11/11/2004 | WO2004096492A1 Polishing apparatus |
| 11/11/2004 | US20040224623 Polishing pad for cmp, method for polishing substrate using it and method for producing polishing pad for cmp |
| 11/11/2004 | US20040224622 Polishing pad and production method thereof |
| 11/11/2004 | US20040224617 Static pad conditioner |
| 11/11/2004 | US20040224616 Polishing pad and chemical mechanical polishing method |
| 11/11/2004 | US20040224615 Profile control platen |
| 11/11/2004 | US20040224614 Methods of treating surfaces of substrates |
| 11/11/2004 | US20040224613 Polishing apparatus |
| 11/11/2004 | US20040224611 Polishing pad and method of polishing a semiconductor wafer |
| 11/11/2004 | US20040224610 CMP belt stretch compensation apparatus and methods for using the same |
| 11/11/2004 | US20040224522 Lapping carrier, apparatus for lapping a wafer and method of fabricating a lapping carrier |
| 11/11/2004 | US20040224519 Process for manufacturing semiconductor wafer and semiconductor wafer |
| 11/11/2004 | US20040224511 Metal polishing |
| 11/11/2004 | US20040224426 Method of using an aqueous solution and composition thereof |
| 11/11/2004 | US20040224142 Method of polishing a semiconductor device |
| 11/11/2004 | US20040223166 Substrate film thickness measurement method, substrate film thickness measurement apparatus and substrate processing apparatus |
| 11/11/2004 | US20040222100 Process and system for providing electrochemical processing solution with reduced oxygen and gas content |
| 11/11/2004 | US20040221956 Semiconductor processing methods of removing conductive material |
| 11/11/2004 | US20040221955 Chemical mechanical polishing apparatus |
| 11/11/2004 | US20040221874 Cleaning method and polishing apparatus employing such cleaning method |
| 11/11/2004 | US20040221799 Nitride semiconductor wafer and method of processing nitride semiconductor wafer |
| 11/11/2004 | US20040221516 Abrasive slurry of metal oxide colloid with stability using metal oxides such as cerium oxide on silica |
| 11/11/2004 | DE102004008246A1 Verfahren zum Planarisieren von Substraten A method for planarizing substrates |
| 11/11/2004 | DE102004002407A1 Chemisch-mechanisches Polierverfahren (CMP-Verfahren) unter Verwendung feststehender Schleifkissen Chemical-mechanical polishing (CMP) process using fixed abrasive pad |
| 11/10/2004 | EP1475827A1 Polishing pad, polishing plate hole cover, polishing apparatus, polishing method, and method for manufacturing semiconductor device |
| 11/10/2004 | EP1475826A2 Nitride semiconductor wafer and method of processing nitride semiconductor wafer |
| 11/10/2004 | EP1474729A1 System and method for point of use delivery, control and mixing chemical and slurry for cmp/cleaning system |
| 11/10/2004 | CN1545441A Method for fabricating chemical mechanical polishing pad using laser |
| 11/10/2004 | CN1174833C Apparatus for polishing magnetic head and polishing method |
| 11/09/2004 | US6816806 Method of characterizing a semiconductor surface |
| 11/09/2004 | US6816748 Smart automatic recording system and method for monitoring wafer fragmentation |