| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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| 12/22/2004 | EP1487931A1 Methanol-containing silica-based cmp compositions |
| 12/22/2004 | EP1487611A1 Apparatus and methods for detecting transitions of wafer surface properties in chemical mechanical polishing for process status and control |
| 12/22/2004 | CN2664836Y Grinding machine possessing function of sucking and removing dust |
| 12/22/2004 | CN1556840A Rare earth salt oxidizer based CMP method |
| 12/21/2004 | US6833046 Planarizing machines and methods for mechanical and/or chemical-mechanical planarization of microelectronic-device substrate assemblies |
| 12/21/2004 | US6832949 Window member for chemical mechanical polishing and polishing pad |
| 12/21/2004 | US6832948 Thermal preconditioning fixed abrasive articles |
| 12/21/2004 | US6832947 CMP pad with composite transparent window |
| 12/16/2004 | WO2004109787A1 Method for polishing wafer |
| 12/16/2004 | WO2004109758A2 Back pressure control system for cmp and wafer polishing |
| 12/16/2004 | WO2004108358A2 Conductive polishing article for electrochemical mechanical polishing |
| 12/16/2004 | WO2004108357A1 Polishing apparatus, method of manufacturing semiconductor device using the appratus, and semiconductor device manufactured by the method |
| 12/16/2004 | WO2004014603B1 Polishing pad with window |
| 12/16/2004 | US20040253910 Polishing pad, platen, method of monitoring, method of manufacturing, and method of detecting |
| 12/16/2004 | US20040250476 Colloidal silica, a periodic acid compound, ammonia, ammonium nitrate and water; pH is 1.8-4.0; reduces erosion when used in a final polishing step of manufacturing semiconductors |
| 12/16/2004 | DE10323743A1 Freilegemasse, Freilegeverfahren und Freilegevorrichtung Uncovering compound, uncovering process and uncovering apparatus |
| 12/15/2004 | EP1485440A1 Free radical-forming activator attached to solid and used to enhance cmp formulations |
| 12/15/2004 | EP1485439A1 Improved chemical-mechanical polishing slurry for polishing of copper or silver films |
| 12/15/2004 | EP1485232A1 Device for treating the surface of test pieces |
| 12/15/2004 | EP1421610A4 Slurry composition for use in chemical mechanical polishing of metal wiring |
| 12/15/2004 | CN1180043C 抛光组合物 The polishing composition |
| 12/15/2004 | CN1179825C Abrasive pad for chemical mechanical polishing |
| 12/15/2004 | CN1179821C Pneuamtic diaphragm polishing head having independent retaining ring and multi-region pressure contorl structure, and method to use the same |
| 12/14/2004 | US6830823 Gold powders, methods for producing powders and devices fabricated from same |
| 12/14/2004 | US6830505 Polishing machine |
| 12/14/2004 | US6830503 Chemical-mechanical polishing with abrasive and/or polishing pad, liquid carrier, peroxy-type oxidizer, and metal compound |
| 12/14/2004 | US6830500 Copper is oxidized at same or higher speed than tungsten barrier; chemical mechanical polishing |
| 12/14/2004 | US6830090 Polishing pad installation tool |
| 12/09/2004 | WO2004107429A1 Abrasive and method of polishing |
| 12/09/2004 | WO2004107428A1 Production method for semiconductor wafer |
| 12/09/2004 | WO2004107335A1 Stamper substrate and process for producing the same |
| 12/09/2004 | WO2004106000A1 A method and system for controlling the chemical mechanical polishing by using a sensor signal of a pad conditioner |
| 12/09/2004 | WO2004087375A8 Chip customized polish pads for chemical mechanical planarization (cmp) |
| 12/09/2004 | WO2003082522A8 Apparatus and methods for detecting transitions of wafer surface properties in chemical mechanical polishing for process status and control |
| 12/09/2004 | US20040249614 Method and system for endpoint detection |
| 12/09/2004 | US20040248508 Controlled penetration subpad |
| 12/09/2004 | US20040248501 Polishing pad for chemical mechanical polishing apparatus |
| 12/09/2004 | US20040248418 Fabrication method of semiconductor integrated circuit device |
| 12/09/2004 | US20040248415 Polishing method and polishing liquid |
| 12/09/2004 | US20040248412 Method and composition for fine copper slurry for low dishing in ECMP |
| 12/09/2004 | US20040248411 Method and device for simulation, method and device for polishing, method and device for preparing control parameters or control program, polishing system, recording medium, and method of manufacturing semiconductor device |
| 12/09/2004 | US20040248329 Semiconductor manufacturing apparatus having a built-in inspection apparatus and a device manufacturing method using said manufacturing apparatus |
| 12/09/2004 | US20040247852 Polishing sheet and polishing work method |
| 12/09/2004 | US20040247782 Palladium-containing particles, method and apparatus of manufacture, palladium-containing devices made therefrom |
| 12/09/2004 | US20040244911 Sluury composition for use in chemical mechanical polishing of metal wiring |
| 12/09/2004 | US20040244299 Composition for polishing pad and polishing pad using the same |
| 12/09/2004 | DE10205233B4 Verfahren und Vorrichtung zum Läppen einer Oberfläche Method and apparatus for lapping a surface |
| 12/08/2004 | EP1483785A1 Method and apparatus for integrated chemical mechanical polishing of copper and barrier layers |
| 12/08/2004 | EP1483351A2 Abrasive particles, and methods of making and using the same |
| 12/08/2004 | EP1483349A1 Anionic abrasive particles treated with positively-charged polyelectrolytes for cmp |
| 12/08/2004 | EP1483182A2 Reinforced chemical mechanical planarization belt |
| 12/08/2004 | CN1554118A Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles |
| 12/08/2004 | CN1553484A Bumper machining method |
| 12/08/2004 | CN1178766C Magnetic head grinding device and method |
| 12/07/2004 | US6829054 Integrated surface metrology |
| 12/07/2004 | US6828227 Method for applying uniform pressurized film across wafer |
| 12/07/2004 | US6828225 Substrate processing method |
| 12/07/2004 | US6827752 Cerium oxide slurry, and method of manufacturing substrate |
| 12/07/2004 | US6827638 Polishing device and method |
| 12/07/2004 | US6827635 Method of planarizing substrates |
| 12/07/2004 | US6827634 Ultra fine particle film forming method and apparatus |
| 12/07/2004 | US6827629 Method of and apparatus for controlling the chemical mechanical polishing of multiple layers on a substrate |
| 12/02/2004 | WO2004105113A1 Polishing body for cmp polishing, cmp polishing apparatus, cmp polishing method, and method for manufacturing semiconductor device |
| 12/02/2004 | WO2004105112A1 Substrate holding apparatus and polishing apparatus |
| 12/02/2004 | WO2004103640A1 Exposing substance, exposing method, and exposing device |
| 12/02/2004 | WO2004103636A2 Substrate polishing apparatus |
| 12/02/2004 | WO2004062847A3 Polishing head test station |
| 12/02/2004 | US20040242136 Air platen for leading edge and trailing edge control |
| 12/02/2004 | US20040242135 Back pressure control system for CMP and wafer polishing |
| 12/02/2004 | US20040242132 Polishing element, cmp polishing device and productionj method for semiconductor device |
| 12/02/2004 | US20040242127 Apparatus and method for feeding slurry |
| 12/02/2004 | US20040242126 CMP apparatus, CMP polishing method, semiconductor device and its manufacturing method |
| 12/02/2004 | US20040242124 Apparatus methods for controlling wafer temperature in chemical mechanical polishing |
| 12/02/2004 | US20040242123 Method for monitoring a substrate during chemical mechanical polishing |
| 12/02/2004 | US20040242121 Substrate polishing apparatus |
| 12/02/2004 | US20040241379 where fine texturing marks are precisely formed in the radial direction and there are no abnormal protrusions; adding a polishing slurry to the substrate, pressing a polishing tape on the surface and running it in a direction opposite the rotation |
| 12/02/2004 | US20040238493 Method for chemical mechanical planarization |
| 12/02/2004 | US20040238121 Mirror polishing; preventing unevenness on nanotopography level |
| 12/02/2004 | US20040237414 Manufacture of lapping board |
| 12/02/2004 | US20040237331 Intergrated micro-optical and photonics elements batch preparation polishing cleaning and inspection system and method therefore |
| 12/01/2004 | EP1480784A1 Methods and apparatus for electrochemical-mechanical processing of microelectronic workpieces |
| 12/01/2004 | EP1307320A4 Apparatus and method for chemical mechanical polishing of substrates |
| 12/01/2004 | CN2659632Y Optical grinder |
| 12/01/2004 | CN2659631Y Main ruler end grinding appts. with depth gage |
| 12/01/2004 | CN1552093A Method for uniform polish microelectronic device |
| 12/01/2004 | CN1551304A CMP sizing material, polishing method and method for manufacturing semiconductor device |
| 12/01/2004 | CN1551303A Polishing disk, polishing machine and method for manufacturing semiconductor |
| 12/01/2004 | CN1550537A Abrasive slurry having high dispersion stability and manufacturing method for a substrate |
| 12/01/2004 | CN1550532A 抛光组合物 The polishing composition |
| 12/01/2004 | CN1550531A 抛光组合物 The polishing composition |
| 12/01/2004 | CN1550526A Multi oxidant based sizing material for nickel hard disk flattening |
| 12/01/2004 | CN1550288A Abrasive pad, method and metal mold for manufacturing the same, and semiconductor wafer polishing method |
| 11/30/2004 | US6824578 Abrasive material |
| 11/30/2004 | US6824458 Retaining ring for holding semiconductor wafers in a chemical mechanical polishing apparatus |
| 11/30/2004 | US6824455 Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus |
| 11/30/2004 | US6824452 Polishing pad and process of chemical mechanical use thereof |
| 11/30/2004 | US6824451 Process for the abrasive machining of surfaces, in particular of semiconductor wafers |
| 11/30/2004 | US6824448 CMP polisher substrate removal control mechanism and method |
| 11/30/2004 | US6824447 Transparent window is formed on a part of the polishing pad so as to let a laser beam or visible light pass therethrough to detect the end point of polishing rate |
| 11/30/2004 | US6824446 Method and apparatus for polishing an outer edge ring on a semiconductor wafer |