| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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| 01/06/2005 | WO2005000992A1 Cerium based polishing material and raw materials therefor |
| 01/06/2005 | WO2005000529A1 Synthesis of a functionally graded pad for chemical mechanical planarization |
| 01/06/2005 | WO2005000527A2 Multi-layer polishing pad material for cmp |
| 01/06/2005 | WO2005000526A1 Polishing pad with oriented pore structure |
| 01/06/2005 | WO2005000525A1 Polishing pad for electrochemical-mechanical polishing |
| 01/06/2005 | WO2002050336A3 Integrated mutli-step gap fill and all feature planarization for conductive materials |
| 01/06/2005 | US20050003749 Polishing pad |
| 01/06/2005 | US20050003746 Polishing composition |
| 01/06/2005 | US20050003745 Apparatus and method for feeding slurry |
| 01/06/2005 | US20050003743 Fine abrasive grains for polishing; polymeric particles |
| 01/06/2005 | US20050003742 Polishing method and polishing device |
| 01/06/2005 | US20050003738 Edge-sealed pad for CMP process |
| 01/06/2005 | US20050003670 Manufacturing method of semiconductor integrated circuit device |
| 01/06/2005 | US20050003666 CMP slurry and method of manufacturing semiconductor device |
| 01/06/2005 | US20050003218 Organic dielectric polymer containing polyarylene ethers |
| 01/06/2005 | US20050002124 Storage device slider with sacrificial lapping extension |
| 01/06/2005 | US20050001199 Mixture containing ceria particles with bromoalcohol, polypotassium or ammonium acrylate, ammonium citrate or ammonium dodecylbenzenesulfonic acid; storage stability; neutral pH |
| 01/06/2005 | US20050000943 Processing apparatus, method for fabrication of semiconductor device by using the processing apparatus, and semiconductor device fabricated by this method |
| 01/06/2005 | US20050000941 Apparatus and method for reducing removal forces for CMP pads |
| 01/06/2005 | US20050000801 Method and apparatus for electrochemical mechanical processing |
| 01/05/2005 | EP1493789A1 Aqueous dispersion for chemical/mechanical polishing |
| 01/05/2005 | EP1222056A4 Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization |
| 01/05/2005 | EP1214175B1 Unsupported polishing belt for chemical mechanical polishing |
| 01/05/2005 | DE10322468B3 Polyurethane for use as or with polishing cloth for polishing silicon wafers, contains special isocyanate-reactive complexing agent to remove copper and other contaminating metals arising from polishing materials |
| 01/05/2005 | CN1561538A Grinding work holding disk, work grinding device and grinding method |
| 01/05/2005 | CN1561376A Polishing composition |
| 01/05/2005 | CN1561280A Method and apparatus for avoiding particle accumulation in electrodeposition |
| 01/05/2005 | CN1559756A Grinding method for shaping bended surface of workpiece |
| 01/05/2005 | CN1182940C Small diameter chemical machinery polishing system |
| 01/05/2005 | CN1182939C Method and apparatus for deposition on and polishing of semiconductor surface |
| 01/04/2005 | US6838382 Method and apparatus for forming a planarizing pad having a film and texture elements for planarization of microelectronic substrates |
| 01/04/2005 | US6838371 Method of manufacturing semiconductor device |
| 01/04/2005 | US6838149 Abrasive article for the deposition and polishing of a conductive material |
| 01/04/2005 | US6838016 Abrasive comprising silicon dioxide, aluminum, cerium, zirconium, titanium oxides, polyalkyleneimine, quinaldic acid and derivatives, glycine, alanine, histidine and derivatives, benzotriazole, hydrogen peroxide; for semiconductors |
| 01/04/2005 | US6837983 Endpoint detection for electro chemical mechanical polishing and electropolishing processes |
| 01/04/2005 | US6837979 Plating conductive layer by applying a plating solution using an anode having a pad attached, when anode and substrate are energized with electric power; altering texture of top portion of conductive layer when pad makes contact with top portion |
| 01/04/2005 | US6837964 Integrated platen assembly for a chemical mechanical planarization system |
| 01/04/2005 | US6837781 Dissolving an inert gas in a polyurethane with raw materials; reaction injection molding yields foam with small and uniform cells; semiconductor wafers |
| 01/04/2005 | US6837780 Lapping and polishing device |
| 01/04/2005 | US6837779 Chemical mechanical polisher with grooved belt |
| 01/04/2005 | US6837774 Linear chemical mechanical polishing apparatus equipped with programmable pneumatic support platen and method of using |
| 01/04/2005 | US6837773 Method and apparatus for controlling a temperature of a polishing pad used in planarizing substrates |
| 12/30/2004 | US20040266327 Conductive polishing article for electrochemical mechanical polishing |
| 12/30/2004 | US20040266326 Method of machining semiconductor wafer-use polishing pad and semiconductor wafer-use polishing pad |
| 12/30/2004 | US20040266324 Polishing system having a carrier head with substrate presence sensing |
| 12/30/2004 | US20040266323 Method for manufacturing substrate |
| 12/30/2004 | US20040266322 Polishing pad, polishing apparatus and method for polishing wafer |
| 12/30/2004 | US20040266321 Method and apparatus to add slurry to a polishing system |
| 12/30/2004 | US20040266319 Method and apparatus for measuring and controlling solids composition of a magnetorheological fluid |
| 12/30/2004 | US20040266193 Means to improve center-to edge uniformity of electrochemical mechanical processing of workpiece surface |
| 12/30/2004 | US20040266192 Application of heated slurry for CMP |
| 12/30/2004 | US20040266188 Polishing method, metallization fabrication method, method for manufacturing semiconductor device and semiconductor device |
| 12/30/2004 | US20040266085 Integrated multi-step gap fill and all feature planarization for conductive materials |
| 12/30/2004 | US20040265615 Fineness particle sizes; spraying pyrolysis |
| 12/30/2004 | US20040263868 Method for measuring thickness of thin film-like material during surface polishing, and surface polishing method and surface polishing apparatus |
| 12/30/2004 | US20040261944 Polishing device and substrate processing device |
| 12/30/2004 | US20040261323 Abrasive grains which are sufficiently small relative to the line width of wirings so as to make it possible to perform fine and delicate polishing |
| 12/29/2004 | WO2004113023A1 Chemical-solution supplying apparatus |
| 12/29/2004 | WO2004113022A1 Apparatus and method for controlling the film thickness on a polishing pad |
| 12/29/2004 | WO2004113021A1 Data processing for monitoring chemical mechanical polishing |
| 12/29/2004 | WO2004113020A1 Substrate polishing apparatus and substrate polishing method |
| 12/29/2004 | WO2004097929A3 Method and apparatus for reduction of defects in wet processed layers |
| 12/29/2004 | EP1491605A1 Cerium based abrasive material and method for preparation thereof |
| 12/29/2004 | EP1490898A2 System and method of broad band optical end point detection for film change indication |
| 12/29/2004 | EP1490897A1 Tantalum barrier removal solution |
| 12/29/2004 | EP1490830A1 Abrasive articles and methods for the manufacture and use of same |
| 12/29/2004 | CN1559082A Chemical mechanical polishing pad with micro-holes |
| 12/29/2004 | CN1558876A Method of making amorphous materials and ceramics |
| 12/28/2004 | US6835300 Electropolishing solution and methods for its use and recovery |
| 12/28/2004 | US6835292 Electrochemical thin film polishing method and polishing apparatus |
| 12/28/2004 | US6835125 Retainer with a wear surface for chemical mechanical polishing |
| 12/28/2004 | US6835121 Chemical-mechanical polishing methods |
| 12/28/2004 | US6835120 Method and apparatus for mechanochemical polishing |
| 12/28/2004 | US6835119 Method for lapping and a lapping apparatus |
| 12/28/2004 | US6835118 Rigid plate assembly with polishing pad and method of using |
| 12/23/2004 | WO2004111314A2 Algorithm for real-time process control of electro-polishing |
| 12/23/2004 | WO2004111157A1 Polishing fluid for metal and polishing method |
| 12/23/2004 | WO2004111146A1 Polishing composition and method for polishing a conductive material |
| 12/23/2004 | WO2004098829A3 Systems and methods for mechanical and/or chemical-mechanical polishing of microfeature workpieces |
| 12/23/2004 | WO2004076574A3 Cmp composition comprising a sulfonic acid and a method for polishing noble metals |
| 12/23/2004 | WO2004038698A3 Method and apparatus for grounding a magnetic recording head |
| 12/23/2004 | US20040259487 Chemical mechanical polish (CMP) conditioning-disk holder |
| 12/23/2004 | US20040259486 Polishing apparatus |
| 12/23/2004 | US20040259485 Retaining ring for holding semiconductor wafers in a chemical mechanical polishing apparatus |
| 12/23/2004 | US20040259484 Multi-layer polishing pad material for CMP |
| 12/23/2004 | US20040259482 Chemical mechanical polishing apparatus and method of chemical mechanical polishing |
| 12/23/2004 | US20040259481 Method of polishing semiconductor copper interconnect integrated with extremely low dielectric constant material |
| 12/23/2004 | US20040259480 [polishing pad and process of chemical mechanical use thereof] |
| 12/23/2004 | US20040259479 Polishing pad for electrochemical-mechanical polishing |
| 12/23/2004 | US20040259477 Pad conditioner control using feedback from a measured polishing pad roughness level |
| 12/23/2004 | US20040259476 Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece |
| 12/23/2004 | US20040259472 Whole-substrate spectral imaging system for CMP |
| 12/23/2004 | US20040259470 Data processing for monitoring chemical mechanical polishing |
| 12/23/2004 | US20040258882 Polishing pad with oriented pore structure |
| 12/23/2004 | US20040256055 CMP pad with long user life |
| 12/23/2004 | US20040255521 Polishing pad of CMP equipment for polishing a semiconductor wafer |
| 12/23/2004 | DE10349083A1 Method of improving the smoothness of a one sided polishing machine for multiple semiconductor wafers adjusts fixing projections to deform the polishing plates |
| 12/22/2004 | EP1489652A2 Method of modifying a surface of a semiconductor wafer |
| 12/22/2004 | EP1489649A1 Double side polishing device for wafer and double side polishing method |
| 12/22/2004 | EP1487938A1 Slurry and method for chemical mechanical polishing of metal structures including refractory metal based barrier layers |