| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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| 02/02/2005 | EP1502703A1 Porous polyurethane polishing pads |
| 02/02/2005 | EP1501653A1 A method, an apparatus, a control system and a computer program to perform an automatic removal of cathode depositions during a bipolar electrochemical machining |
| 02/02/2005 | CN2675338Y Grinding unit for needle grinding machine |
| 02/02/2005 | CN1575325A Boron-containing polishing system and method |
| 02/02/2005 | CN1574238A Slurry for CMP, polishing method and method of manufacturing semiconductor device |
| 02/02/2005 | CN1572858A Method for manufacturing substrate |
| 02/02/2005 | CN1572424A Chemical mechanical polishing method for sti |
| 02/02/2005 | CN1572422A 抛光垫 Polishing pad |
| 02/02/2005 | CN1187427C Grinding fluid composition |
| 02/02/2005 | CN1187426C Optical polishing formulation |
| 02/02/2005 | CN1187162C Clamping tool for working |
| 02/01/2005 | US6849152 In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical polishing planarization |
| 02/01/2005 | US6849099 Colloidal silica, a periodic acid compound, ammonia, ammonium nitrate and water; pH is 1.8-4.0; reduces erosion when used in a final polishing step of manufacturing semiconductors |
| 02/01/2005 | US6848981 Dual-bulge flexure ring for CMP head |
| 02/01/2005 | US6848980 Vibration damping in a carrier head |
| 02/01/2005 | US6848977 Polishing pad for electrochemical mechanical polishing |
| 02/01/2005 | US6848976 Chemical mechanical polishing with multiple polishing pads |
| 02/01/2005 | US6848974 Polishing pad for semiconductor wafer and polishing process using thereof |
| 02/01/2005 | US6848970 Process control in electrochemically assisted planarization |
| 01/27/2005 | WO2005007770A1 Abrasive particles for chemical mechanical polishing |
| 01/27/2005 | WO2005007342A1 Polishing apparatus |
| 01/27/2005 | WO2005007339A1 Silicon wafer polishing holder and method of use thereof |
| 01/27/2005 | US20050020192 Method and apparatus for chemically, mechanically, and/or electrolytically removing material from microelectronic substrates |
| 01/27/2005 | US20050020191 Apparatus for planarizing microelectronic workpieces |
| 01/27/2005 | US20050020187 Chemical mechanical polishing (CMP); for use on nickel/phosphorus alloys; contains abrasive particles, oxidant, oxidant modifier, and accelerants to sequester removed materials containing phosphonate and ammonium or amine groups |
| 01/27/2005 | US20050020185 Closed-loop control of wafer polishing in a chemical mechanical polishing system |
| 01/27/2005 | US20050020084 Method of preparing a surface of a semiconductor wafer to make it epiready |
| 01/27/2005 | US20050020082 Polishing pads for chemical mechanical planarization |
| 01/27/2005 | US20050016960 Method for producing semiconductor device, polishing apparatus, and polishing method |
| 01/27/2005 | US20050016868 Providing a wafer electrical connection by holding the conductive surface against the surface of the belt pad, applying a potential difference between the electrode and the wafer electrical connection and establishing a relative motion between the surface of the belt pad and the wafer |
| 01/27/2005 | US20050016861 On a semiconductor wafer with an insulating layer of a field region and a plurality of features, forming a barrier layer overlying the field region; electrodepositing copper filling the features in the insulating layer, polishing to remove the copper layer and the barrier layer from the field region |
| 01/27/2005 | DE10195941T5 Halbleiter-Bearbeitungsverfahren zum Entfernen leitfähigen Materials Semiconductor processing method of removing conductive material |
| 01/27/2005 | CA2532114A1 Abrasive particles for chemical mechanical polishing |
| 01/26/2005 | EP1501119A1 Semiconductor wafer manufacturing method and wafer |
| 01/26/2005 | CN1572017A Polishing compound, method for production thereof, and polishing method |
| 01/26/2005 | CN1571015A Multi-chambered, compliant apparatus for restraining workpiece and applying variable pressure thereto during lapping to improve flatness characteristics of workpiece |
| 01/26/2005 | CN1569399A 抛光垫和化学机械抛光方法 Chemical mechanical polishing pad and polishing method |
| 01/26/2005 | CN1569398A Polishing pad and method of polishing a semiconductor wafer |
| 01/25/2005 | US6846227 Electro-chemical machining appartus |
| 01/25/2005 | US6846225 Selective chemical-mechanical polishing properties of a cross-linked polymer and specific applications therefor |
| 01/25/2005 | US6846224 Surface planarization equipment for use in the manufacturing of semiconductor devices |
| 01/25/2005 | US6846222 Multi-chambered, compliant apparatus for restraining workpiece and applying variable pressure thereto during lapping to improve flatness characteristics of workpiece |
| 01/25/2005 | CA2288590C Method and apparatus for lapping of workpieces |
| 01/20/2005 | WO2005005102A1 Application of heated slurry for cmp |
| 01/20/2005 | WO2005005101A1 Holder for flat workpieces, in particular semiconductor wafers for mechanochemical polishing |
| 01/20/2005 | WO2005005100A1 Viscoelastic polisher and polishing method using the same |
| 01/20/2005 | WO2005005096A1 Perforated plate for wafer chuck |
| 01/20/2005 | WO2004090502A3 Whole-substrate spectral imaging system for cmp |
| 01/20/2005 | US20050014457 Apparatus and method for conditioning a contact surface of a processing pad used in processing microelectronic workpieces |
| 01/20/2005 | US20050014456 Processing device, processing method and method of manufacturing semiconductor device |
| 01/20/2005 | US20050014455 Method and pad for polishing wafer |
| 01/20/2005 | US20050014454 Chemical mechanical polishing (CMP) process using fixed abrasive pads |
| 01/20/2005 | US20050014452 Retaining ring with trigger for chemical mechanical polishing apparatus |
| 01/20/2005 | US20050014376 Chemical mechanical polishing pad and chemical mechanical polishing method |
| 01/20/2005 | US20050014373 Method for managing polishing apparatus |
| 01/19/2005 | EP1498222A1 Chemical mechanical polishing pad and chemical mechanical polishing method |
| 01/19/2005 | EP1497076A1 Method and apparatus for heating polishing pad |
| 01/19/2005 | CN1568244A Assembly system for stationing semiconductor wafer suitable for processing and process for manufacturing semiconductor wafer |
| 01/19/2005 | CN1567539A Chemically machinery milling technique and device |
| 01/19/2005 | CN1565824A Electroconductive grinding cushion and manufacturing method thereof |
| 01/18/2005 | US6844262 CMP process |
| 01/18/2005 | US6843816 Cerium-based abrasive material and method for preparation thereof |
| 01/18/2005 | US6843712 Polymer pad material selected from urethane, carbonate, amide, sulfone, vinyl chloride, acrylate, methacrylate, vinyl alcohol, ester and acrylamide; polishing layer is porous, formed without cutting to the polishing surface |
| 01/18/2005 | US6843711 Chemical mechanical polishing pad having a process-dependent groove configuration |
| 01/18/2005 | US6843709 Chemical mechanical polishing method for reducing slurry reflux |
| 01/18/2005 | US6843708 Method of reducing defectivity during chemical mechanical planarization |
| 01/18/2005 | US6843707 Methods for aligning a surface of an active retainer ring with a wafer surface for chemical mechanical polishing |
| 01/18/2005 | US6843706 Polishing apparatus |
| 01/18/2005 | US6843705 Apparatus for finishing a magnetic slider |
| 01/18/2005 | US6843704 Method and apparatus for automatically loading a double-sided polishing machine with wafer crystals |
| 01/18/2005 | CA2307154C Polishing slurry |
| 01/13/2005 | WO2005004218A1 Polishing apparatus and polishing method |
| 01/13/2005 | WO2005002794A2 Cell, system and article for electrochemical mechanical processing (ecmp) |
| 01/13/2005 | US20050009456 Polishing apparatus |
| 01/13/2005 | US20050009453 CMP polishing heads and methods of using the same |
| 01/13/2005 | US20050009452 Orbiting indexable belt polishing station for chemical mechanical polishing |
| 01/13/2005 | US20050009450 Apparatus for optical inspection of wafers during processing |
| 01/13/2005 | US20050009449 Polishing pad with built-in optical sensor |
| 01/13/2005 | US20050009448 Customized polish pads for chemical mechanical planarization |
| 01/13/2005 | US20050009322 Slurry for CMP, and method of manufacturing semiconductor device |
| 01/13/2005 | US20050005629 Anti-stratification-solution delivery system for spin-on dielectrics |
| 01/13/2005 | US20050005416 Method for hardening the wear portion of a retaining ring |
| 01/13/2005 | DE10338819B3 Method for finishing hard surfaces, e.g. glass, ceramics and glass-ceramics, especially polishing microstructures, uses polishing agent which is formed as precipitate by chemical or electrochemical reaction in applicator |
| 01/13/2005 | DE102004014179A1 Chemical mechanical polishing pad for monitoring chemical mechanical polishing process or detecting end point, comprises polishing layer including pseudo window area, having thickness less than thickness of polishing layer |
| 01/12/2005 | EP1496543A1 Polishing device and substrate processing device |
| 01/12/2005 | EP1495837A1 Polishing method |
| 01/12/2005 | EP1494835A1 Lapping carrier for use in fabricating sliders |
| 01/12/2005 | EP1469971A4 Grooved rollers for a linear chemical mechanical planarization system |
| 01/12/2005 | EP1455988A4 Air platen for leading edge and trailing edge control |
| 01/12/2005 | CN2670055Y Grinder with alarming effect |
| 01/12/2005 | CN1565049A 抛光装置及基片处理装置 A polishing apparatus and a substrate processing apparatus |
| 01/12/2005 | CN1565048A Polishing pad for CMP, method for polishing substrate using it and method for producing polishing pad for CMP |
| 01/12/2005 | CN1184271C 抛光组合物 The polishing composition |
| 01/11/2005 | US6841480 Polyelectrolyte dispensing polishing pad, production thereof and method of polishing a substrate |
| 01/11/2005 | US6840971 Chemical mechanical polishing systems and methods for their use |
| 01/11/2005 | US6840846 Polishing station of a chemical mechanical polishing apparatus |
| 01/11/2005 | US6840845 Wafer polishing apparatus |
| 01/11/2005 | US6840843 Method for manufacturing a polishing pad having a compressed translucent region |
| 01/11/2005 | US6840841 Wafer edge polishing system |
| 01/11/2005 | US6840840 Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization |