| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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| 02/22/2005 | US6857950 Polishing apparatus, semiconductor device manufacturing method using the polishing apparatus, and semiconductor device manufactured by the manufacturing method |
| 02/22/2005 | US6857947 Advanced chemical mechanical polishing system with smart endpoint detection |
| 02/22/2005 | US6857946 Carrier head with a flexure |
| 02/22/2005 | US6857945 Multi-chamber carrier head with a flexible membrane |
| 02/22/2005 | US6857942 Apparatus and method for pre-conditioning a conditioning disc |
| 02/22/2005 | US6857941 Multi-phase polishing pad |
| 02/22/2005 | US6857940 Electrodes configured to apply pressure to a fluid including dielectric abrasive particles on the workpiece and arrange the particles uniformly by a Coulomb force produced by applying an alternating current voltage; antiagglomerants |
| 02/22/2005 | US6857938 Lot-to-lot feed forward CMP process |
| 02/22/2005 | US6857434 CMP slurry additive for foreign matter detection |
| 02/17/2005 | WO2004103636A3 Substrate polishing apparatus |
| 02/17/2005 | WO2004073922A3 Abrasives for copper cmp and methods for making |
| 02/17/2005 | US20050037698 Carrier head with a flexible membrane |
| 02/17/2005 | US20050037696 Method and apparatus for forming a planarizing pad having a film and texture elements for planarization of microelectronic substrates |
| 02/17/2005 | US20050037694 Retaining rings, planarizing apparatuses including retaining rings, and methods for planarizing micro-device workpieces |
| 02/17/2005 | US20050037692 Assembly and method for generating a hydrodynamic air bearing |
| 02/17/2005 | US20050037690 Substrate retainer wear detection method and apparatus |
| 02/17/2005 | US20050034976 Method and apparatus for plating and polishing semiconductor substrate |
| 02/17/2005 | US20050034746 Method of cleaning abrasive plates of abrasive machine and cleaning device |
| 02/17/2005 | DE19929929B4 Verfahren und Vorrichtung zum chemisch-mechanischen Polieren von Halbleiterscheiben Method and apparatus for chemical mechanical polishing of semiconductor wafers |
| 02/16/2005 | EP1506572A1 Substrate processing apparatus and substrate processing method |
| 02/16/2005 | CN1582262A Glass-ceramics |
| 02/16/2005 | CN1580173A Polishing composition for magnetic disk |
| 02/16/2005 | CN1579706A Substrate for magnetic disc |
| 02/16/2005 | CN1189924C System for controlling instant-compensuted grinded curved surface |
| 02/15/2005 | US6855634 Polishing method and polishing apparatus |
| 02/15/2005 | US6855267 For horizontally planarizing various kinds of layers, such as oxide layers, nitride layers, metal layers during manufacturing of semiconductor devices |
| 02/15/2005 | US6855043 Carrier head with a modified flexible membrane |
| 02/15/2005 | US6855037 Method of sealing wafer backside for full-face electrochemical plating |
| 02/15/2005 | US6855035 Apparatus and method for producing substrate with electrical wire thereon |
| 02/15/2005 | US6855034 Polishing pad for semiconductor wafer and laminated body for polishing of semiconductor wafer equipped with the same as well as method for polishing of semiconductor wafer |
| 02/15/2005 | US6855032 Fine force control of actuators for chemical mechanical polishing apparatuses |
| 02/15/2005 | US6855031 Slurry flow rate monitoring in chemical-mechanical polisher using pressure transducer |
| 02/15/2005 | US6855030 Modular method for chemical mechanical planarization |
| 02/15/2005 | US6854484 Valve for a slurry outlet opening of a chemical mechanical polishing device and chemical mechanical polishing device having a valve |
| 02/10/2005 | WO2005013340A1 Eddy current system for in-situ profile measurement |
| 02/10/2005 | WO2005012592A2 Cvd diamond-coated composite substrate for making same |
| 02/10/2005 | US20050032465 Substrate for magnetic disk |
| 02/10/2005 | US20050032464 Polishing pad having edge surface treatment |
| 02/10/2005 | US20050032463 Polishing composition for magnetic disk |
| 02/10/2005 | US20050032462 In situ activation of a three-dimensional fixed abrasive article |
| 02/10/2005 | US20050032461 Systems and methods for monitoring characteristics of a polishing pad used in polishing micro-device workpieces |
| 02/10/2005 | US20050032459 Technique for process-qualifying a semiconductor manufacturing tool using metrology data |
| 02/10/2005 | US20050032381 Method and apparatus for polishing metal and dielectric substrates |
| 02/10/2005 | US20050031789 Comprises a corrosion inhibitor for limiting removal of an interconnect metal with an acidic pH; includes an organic-containing ammonium salt |
| 02/10/2005 | US20050030669 Storage device slider with sacrificial lapping extension |
| 02/10/2005 | US20050029491 Aqueous solution mixture of oxidizer and abrasive; using polymaleic acid; acidity pH |
| 02/10/2005 | US20050028931 Substrate holding apparatus and polishing apparatus |
| 02/10/2005 | US20050028843 Cleaning apparatus; rotating nozzle for jetting water toward face of abrasive plates; brushes to confing spray |
| 02/10/2005 | US20050028354 Device and method for measuring amount of grinding in magnetic head producing process |
| 02/10/2005 | DE10350598B3 One-piece dummy plate of wear-resistant material for replacement of carrier plate during batch polishing of semiconductor discs in polishing machine with channels incorporated in its contact surface |
| 02/09/2005 | EP1505639A1 Polishing fluid and polishing method |
| 02/09/2005 | EP1505134A1 Chemical mechanical planarization compositions for reducing erosion in semiconductor wafers |
| 02/09/2005 | EP1505133A1 Composition for polishing semiconductor layers |
| 02/09/2005 | EP1504846A1 Polishing plate with a polishing cloth that does adhere only horizontally to the holder |
| 02/09/2005 | EP1056816B1 Cerium oxide slurry for polishing, process for preparing the slurry, and process for polishing with the slurry |
| 02/09/2005 | CN1579014A Method and pad for polishing wafer |
| 02/09/2005 | CN1579003A Semiconductor manufacturing apparatus having a built-in inspection apparatus and a device manufacturing method using said manufacturing apparatus |
| 02/09/2005 | CN1577795A Manufacturing method of semiconductor integrated circuit device |
| 02/09/2005 | CN1577759A Method for managing polishing apparatus |
| 02/09/2005 | CN1577758A Polishing pad, polishing apparatus and method for polishing wafer |
| 02/09/2005 | CN1576346A Polishing composition |
| 02/09/2005 | CN1576345A Aqueous dispersion for chemical/mechanical polishing |
| 02/09/2005 | CN1576339A 抛光组合物 The polishing composition |
| 02/09/2005 | CN1188251C Method of polishing semiconductor wafer by using double-sided polisher |
| 02/08/2005 | US6853873 Enhanced throughput of a metrology tool |
| 02/08/2005 | US6852633 Method for operating chemical mechanical polishing (“CMP”) tool for the manufacture of semiconductor devices |
| 02/08/2005 | US6852632 Method of polishing a multi-layer substrate |
| 02/08/2005 | US6852629 Backside integrated circuit die surface finishing technique and tool |
| 02/08/2005 | US6852020 Polishing pad for use in chemical—mechanical planarization of semiconductor wafers and method of making same |
| 02/08/2005 | US6852019 Substrate holding apparatus |
| 02/08/2005 | US6852017 Method and apparatus for chemical-mechanical planarization of microelectronic substrates with a carrier and membrane |
| 02/08/2005 | US6852016 End effectors and methods for manufacturing end effectors with contact elements to condition polishing pads used in polishing micro-device workpieces |
| 02/08/2005 | US6852012 Cluster tool systems and methods for in fab wafer processing |
| 02/08/2005 | US6852009 Polishing formulation for polishing semiconductor wafer consists of a silicon dioxide, a base selected from inorganic salt of alkali metal, an ammonum salt, piperazine and ethylenediamine, at least one chelating agent free of EDTA |
| 02/08/2005 | US6852007 Robotic method of transferring workpieces to and from workstations |
| 02/08/2005 | US6852003 Method of manufacturing glass substrate for data recording medium |
| 02/03/2005 | WO2005010966A1 Method for polishing wafer |
| 02/03/2005 | WO2005009684A1 Method for epiready surface treatment on sic thin films |
| 02/03/2005 | WO2005009679A2 Retainiing ring with trigger for chemical mechanical polishing apparatus |
| 02/03/2005 | WO2003028048A3 Low-force electrochemical mechanical processing method and apparatus |
| 02/03/2005 | US20050026555 Carrier assemblies, planarizing apparatuses including carrier assemblies, and methods for planarizing micro-device workpieces |
| 02/03/2005 | US20050026554 Retaining ring with wear pad for use in chemical mechanical planarization |
| 02/03/2005 | US20050026552 Porous polyurethane polishing pads |
| 02/03/2005 | US20050026551 Method to improve control in CMP processing |
| 02/03/2005 | US20050026549 Zone polishing using variable slurry solid content |
| 02/03/2005 | US20050026547 Semiconductor processor control systems, semiconductor processor systems, and systems configured to provide a semiconductor workpiece process fluid |
| 02/03/2005 | US20050026546 Systems and methods for monitoring characteristics of a polishing pad used in polishing micro-device workpieces |
| 02/03/2005 | US20050026545 Systems and methods for monitoring characteristics of a polishing pad used in polishing micro-device workpieces |
| 02/03/2005 | US20050026544 Carrier assemblies, polishing machines including carrier assemblies, and methods for polishing micro-device workpieces |
| 02/03/2005 | US20050026543 Apparatus and method for chemical mechanical polishing process |
| 02/03/2005 | US20050026542 Detection system for chemical-mechanical planarization tool |
| 02/03/2005 | US20050026442 Method of chemical mechanical polishing with high throughput and low dishing |
| 02/03/2005 | US20050026441 Abrasive used for planarization of semiconductor device and method of manufacturing semiconductor device using the abrasive |
| 02/03/2005 | US20050026439 Semiconductor device fabrication method |
| 02/03/2005 | US20050026425 Semiconductor device manufacturing method |
| 02/03/2005 | US20050026205 Method of polishing metal and metal/dielectric structures |
| 02/03/2005 | US20050025973 CVD diamond-coated composite substrate containing a carbide-forming material and ceramic phases and method for making same |
| 02/03/2005 | US20050024047 Eddy current system for in-situ profile measurement |
| 02/03/2005 | US20050023247 Chemical-mechanical polishing methods |
| 02/03/2005 | US20050022931 Chemical mechanical polishing apparatus |