| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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| 03/22/2005 | US6869344 Apparatus for polishing optical disk |
| 03/22/2005 | US6869343 Turning tool for grooving polishing pad, apparatus and method of producing polishing pad using the tool, and polishing pad produced by using the tool |
| 03/22/2005 | US6869340 Polishing cloth for and method of texturing a surface |
| 03/22/2005 | US6869339 Polishing pad and method of manufacture |
| 03/22/2005 | US6869337 System and method for polishing and planarizing semiconductor wafers using reduced surface area polishing pads and variable partial pad-wafer overlapping techniques |
| 03/22/2005 | US6869336 Planarization composition causes the ruthenium to be removed from the work piece as a ruthenium oxide |
| 03/22/2005 | US6869335 Retaining rings, planarizing apparatuses including retaining rings, and methods for planarizing micro-device workpieces |
| 03/22/2005 | US6869332 Chemical mechanical polishing of a metal layer with polishing rate monitoring |
| 03/17/2005 | WO2005024287A2 Working surface and system for production thereof |
| 03/17/2005 | WO2005023487A1 Polishing pad, and method and apparatus for producing same |
| 03/17/2005 | WO2005000529A8 Synthesis of a functionally graded pad for chemical mechanical planarization |
| 03/17/2005 | US20050059324 Methods and apparatus for removing conductive material from a microelectronic substrate |
| 03/17/2005 | US20050059247 Method for manufacturing SiC substrate |
| 03/17/2005 | US20050056810 Polishing composition for semiconductor wafers |
| 03/17/2005 | US20050056550 Methods and apparatus for removing conductive material from a microelectronic substrate |
| 03/17/2005 | US20050056537 Planarization of substrates using electrochemical mechanical polishing |
| 03/17/2005 | US20050055885 Polishing pad for chemical mechanical polishing |
| 03/17/2005 | DE10062496B4 Halter für flache Werkstücke, insbesondere Halbleiterwafer Holder for flat workpieces, in particular semiconductor wafers |
| 03/16/2005 | CN1192906C Printing plate support for lithographic printing and producing method thereof |
| 03/16/2005 | CN1192856C Oscillating fixed abrasive CMP system and methods for implementing the same |
| 03/15/2005 | US6867138 Method of chemical/mechanical polishing of the surface of semiconductor device |
| 03/15/2005 | US6866929 Glass powders, methods for producing glass powders and devices fabricated from same |
| 03/15/2005 | US6866784 Slurry recycling system and method for CMP apparatus |
| 03/15/2005 | US6866571 Boltless carrier ring/carrier plate attachment assembly |
| 03/15/2005 | US6866567 Activated slurry CMP system and methods for implementing the same |
| 03/15/2005 | US6866566 Apparatus and method for conditioning a contact surface of a processing pad used in processing microelectronic workpieces |
| 03/15/2005 | US6866564 Method of backgrinding wafers while leaving backgrinding tape on a chuck |
| 03/15/2005 | US6866560 Method for thinning specimen |
| 03/15/2005 | US6866559 Windows configurable to be coupled to a process tool or to be disposed within an opening in a polishing pad |
| 03/10/2005 | WO2005022621A1 Polishing composition and polishing method using same |
| 03/10/2005 | US20050054277 Polishing pad and method of polishing wafer |
| 03/10/2005 | US20050054276 Method for reducing wear of mechanically interacting surfaces |
| 03/10/2005 | US20050054275 Web-format polishing pads and methods for manufacturing and using web-format polishing pads in mechanical and chemical-mechanical planarization of microelectronic substrates |
| 03/10/2005 | US20050054273 Polishing kit for magnetic disk |
| 03/10/2005 | US20050054272 Polishing method |
| 03/10/2005 | US20050054268 Methods for detecting transitions of wafer surface properties in chemical mechanical polishing for process status and control |
| 03/10/2005 | US20050054266 Pressure control system and polishing apparatus |
| 03/10/2005 | US20050054203 Polishing composition |
| 03/10/2005 | US20050051267 Detecting physical properties; transmission signals; monitoring polishing |
| 03/10/2005 | US20050051266 Rotating pad on support surfaces; for semiconductor |
| 03/10/2005 | US20050050803 Polishing fluid and polishing method |
| 03/09/2005 | EP1512732A1 Polishing composition |
| 03/09/2005 | EP1512168A2 Subpad having robust, sealed edges |
| 03/09/2005 | EP1148976B1 Method and apparatus for deposition on and polishing of a semiconductor surface |
| 03/09/2005 | CN1592955A Method of machining semiconductor wafer-use polishing pad and semiconductor wafer-use polishing pad |
| 03/09/2005 | CN1590487A Chemical mechanical planarization compositions for reducing erosion in semiconductor wafers |
| 03/09/2005 | CN1590026A 化学机械抛光垫以及化学机械抛光方法 The chemical mechanical polishing pad and chemical mechanical polishing method |
| 03/09/2005 | CN1590024A Apparatus and method for preheating |
| 03/09/2005 | CN1590023A Electric current variable effect grinding method and its grinding device |
| 03/08/2005 | US6864176 Fabrication process for bonded wafer precision layer thickness control and its non-destructive measurement method |
| 03/08/2005 | US6864154 Process for lapping wafer and method for processing backside of wafer using the same |
| 03/08/2005 | US6863797 Electrolyte with good planarization capability, high removal rate and smooth surface finish for electrochemically controlled copper CMP |
| 03/08/2005 | US6863774 Polishing pad for use in chemical-mechanical planarization of semiconductor wafers and method of making same |
| 03/08/2005 | US6863771 Differential pressure application apparatus for use in polishing layers of semiconductor device structures and methods |
| 03/08/2005 | US6863770 Method and apparatus for polishing a substrate while washing a polishing pad of the apparatus with at least one free-flowing vertical stream of liquid |
| 03/08/2005 | US6863700 Cerium oxide abrasive and method of polishing substrates |
| 03/08/2005 | US6863599 CMP pad having isolated pockets of continuous porosity and a method for using such pad |
| 03/08/2005 | US6863595 Methods for polishing a semiconductor topography |
| 03/08/2005 | US6863593 Chemical mechanical polishing a substrate having a filler layer and a stop layer |
| 03/08/2005 | US6863592 Chemical/mechanical polishing slurry and chemical mechanical polishing method using the same |
| 03/08/2005 | US6863590 Wafer planarization apparatus |
| 03/03/2005 | US20050048882 Polishing apparatus and method |
| 03/03/2005 | US20050048880 Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion |
| 03/03/2005 | US20050048877 Method of chemical mechanical polishing using abrasive particles of alkaline earth metal salts |
| 03/03/2005 | US20050048875 Chemical mechanical polishing apparatus |
| 03/03/2005 | US20050048874 System and method for in-line metal profile measurement |
| 03/03/2005 | US20050047858 Slide-type cylinder coupling for CMP load cup |
| 03/03/2005 | US20050045852 Particle-free polishing fluid for nickel-based coating planarization |
| 03/03/2005 | US20050045491 Alkylene glycol and alkali and/or alkaline earth chlorides; smoothness; lower cost and corrosion; environmentally friendly; recycling spent electrolyte |
| 03/03/2005 | US20050044957 System and method for characterizing a textured surface |
| 03/02/2005 | EP1509364A1 Microporous polishing pad |
| 03/02/2005 | EP1303381B1 Grooved polishing pads and methods of use |
| 03/02/2005 | CN1587711A Method for working fan and working auxiliary tool in said method |
| 03/02/2005 | CN1586814A Novel high precision ceramic ball grinder |
| 03/01/2005 | US6861360 Double-sided polishing process for producing a multiplicity of silicon semiconductor wafers |
| 03/01/2005 | US6861353 Methods for planarization of metal-containing surfaces using halogens and halide salts |
| 03/01/2005 | US6861010 Copper-based metal polishing composition, method for manufacturing a semiconductor device, polishing composition, aluminum-based metal polishing composition, and tungsten-based metal polishing composition |
| 03/01/2005 | US6860803 Polishing plate |
| 03/01/2005 | US6860802 Polishing pads for chemical mechanical planarization |
| 03/01/2005 | US6860801 Pedestal of a load-cup which supports wafers loaded/unloaded onto/from a chemical mechanical polishing apparatus |
| 03/01/2005 | US6860798 Carrier assemblies, planarizing apparatuses including carrier assemblies, and methods for planarizing micro-device workpieces |
| 03/01/2005 | US6860793 Window portion with an adjusted rate of wear |
| 03/01/2005 | US6860791 Polishing pad for in-situ endpoint detection |
| 02/24/2005 | WO2005017989A1 Abrasive compound for semiconductor planarization |
| 02/24/2005 | WO2005016822A1 Silica and silica-based slurry |
| 02/24/2005 | WO2005016597A1 Polishing pad having edge surface treatment |
| 02/24/2005 | WO2005016596A1 In situ activation of a three-dimensional fixed abrasive article |
| 02/24/2005 | WO2005016595A1 Grinding apparatus, semiconductor device producing method using the same, and semiconductor device produced by the method |
| 02/24/2005 | US20050042976 Low friction planarizing/polishing pads and use thereof |
| 02/24/2005 | US20050042975 Platen and head rotation rates for monitoring chemical mechanical polishing |
| 02/24/2005 | US20050042875 Carrier heads, planarizing machines and methods for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies |
| 02/24/2005 | US20050040140 Using a species analyzer that analyzes the slurry resulting from the planarization process to determine the presence of an end-point material implanted beneath the surface of a microelectronic substrate; including a mass spectrometer or a spectrum analyzer or detector of intensity of impinging radiation |
| 02/24/2005 | US20050040050 Polishing apparatus |
| 02/24/2005 | DE10332624A1 Retaining ring for a wafer in chemical mechanical polishing has rounded edges and a roughness of at least two microns on the surface touching the polishing cloth |
| 02/23/2005 | CN1586002A Grinding pad and method of producing the same |
| 02/23/2005 | CN1583842A Porous polyurethane polishing pads |
| 02/23/2005 | CN1190826C Method and device for mfg. adhesion bound joint between semiconductor wafer and carrier disk |
| 02/22/2005 | US6858538 Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies |
| 02/22/2005 | US6858537 Process for smoothing a rough surface on a substrate by dry etching |
| 02/22/2005 | US6858449 Process and device for the abrasive machining of surfaces, in particular semiconductor wafers |