| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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| 04/12/2005 | US6878038 Combined eddy current sensing and optical monitoring for chemical mechanical polishing |
| 04/12/2005 | US6878037 Slurry pump control system |
| 04/12/2005 | US6878036 Apparatus for monitoring a metal layer during chemical mechanical polishing using a phase difference signal |
| 04/07/2005 | WO2005031836A1 Polishing composition and polishing method |
| 04/07/2005 | WO2005030439A1 Polishing cloth, polishing cloth processing method, and substrate manufacturing method using same |
| 04/07/2005 | WO2005013340B1 Eddy current system for in-situ profile measurement |
| 04/07/2005 | US20050075062 Retaining ring for wafer carriers |
| 04/07/2005 | US20050075056 Multi-tool, multi-slurry chemical mechanical polishing |
| 04/07/2005 | US20050075055 Chemical mechanical polishing optical endpoint detection |
| 04/07/2005 | US20050075054 Method for grinding lens |
| 04/07/2005 | US20050075052 Method and system for planarizing integrated circuit material |
| 04/07/2005 | US20050075049 Configuration and method for mounting a backing film to a polish head |
| 04/07/2005 | US20050074976 Method for polishing copper layer and method for forming copper layer wiring using the same |
| 04/07/2005 | US20050074967 Polishing method |
| 04/07/2005 | US20050072528 Integration of sensor based metrology into semiconductor processing tools |
| 04/07/2005 | US20050072527 Substrate holding apparatus and substrate polishing apparatus |
| 04/07/2005 | US20050072524 System for the preferential removal of silicon oxide |
| 04/06/2005 | EP1520894A1 Barrier polishing fluid |
| 04/06/2005 | EP1520893A1 High-rate barrier polishing composition |
| 04/06/2005 | EP1520281A2 Low-force electrochemical mechanical processing method and apparatus |
| 04/06/2005 | CN1604834A Abrasive article for the deposition and polishing of a conductive material |
| 04/06/2005 | CN1196182C Monitor, method of monitoring, polishing device, and method of manufacturing semiconductor wafer |
| 04/06/2005 | CN1196107C Method for polishing magnetic-head floating block |
| 04/06/2005 | CN1195896C Chemical mechanical polishing (CMP) slurry for copper and method of use in integrated circuit manufacture |
| 04/05/2005 | US6876454 Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations |
| 04/05/2005 | US6875372 Fine particle size; monodispersion; crystal structure |
| 04/05/2005 | US6875322 Electrochemical assisted CMP |
| 04/05/2005 | US6875097 Fixed abrasive CMP pad with built-in additives |
| 04/05/2005 | US6875096 Chemical mechanical polishing pad having holes and or grooves |
| 04/05/2005 | US6875091 Method and apparatus for conditioning a polishing pad with sonic energy |
| 04/05/2005 | US6875089 Constant pH polish and scrub |
| 04/05/2005 | US6875088 Polishing member and method of manufacturing semiconductor device |
| 04/05/2005 | US6875087 Method for chemical mechanical planarization (CMP) and chemical mechanical cleaning (CMC) of a work piece |
| 04/05/2005 | US6875086 Surface planarization |
| 04/05/2005 | US6875085 Polishing system including a hydrostatic fluid bearing support |
| 04/05/2005 | US6875082 Nitride semiconductor wafer and method of processing nitride semiconductor wafer |
| 04/05/2005 | US6875079 Methods of working, especially polishing, inhomogeneous materials |
| 04/05/2005 | US6875078 Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations |
| 04/05/2005 | US6875077 Forming area through porous fibrous matrix of pad from working polishing surface to back, non-working surface, filling region with material transparent to light beams emanating from chemical mechanical polishing end-point detection device |
| 04/05/2005 | US6875076 Polishing machine and method |
| 04/05/2005 | CA2374373C Improved ceria powder |
| 03/31/2005 | WO2005028157A1 A polishing pad for chemical mechanical polishing |
| 03/31/2005 | WO2005002794A3 Cell, system and article for electrochemical mechanical processing (ecmp) |
| 03/31/2005 | WO2004093177B1 Polishing pad and method for producing same |
| 03/31/2005 | US20050070217 Polishing pad and fabricating method thereof |
| 03/31/2005 | US20050070216 Resilient polishing pad for chemical mechanical polishing |
| 03/31/2005 | US20050070215 Chemical mechanical polishing apparatus having conditioning cleaning device |
| 03/31/2005 | US20050070214 Uniform fluid distribution and exhaust system for a chemical-mechanical planarization device |
| 03/31/2005 | US20050070212 System, method and apparatus for applying liquid to a cmp polishing pad |
| 03/31/2005 | US20050070211 Barrier polishing fluid |
| 03/31/2005 | US20050070209 Method and system for controlling the chemical mechanical polishing by using a sensor signal of a pad conditioner |
| 03/31/2005 | US20050070208 System and apparatus for achieving very high crown-to-camber ratios on magnetic sliders |
| 03/31/2005 | US20050070207 Method of achieving very high crown-to-camber ratios on magnetic sliders |
| 03/31/2005 | US20050070206 Slider fabrication system for sliders with integrated electrical lapping guides |
| 03/31/2005 | US20050070205 Integrated pressure control system for workpiece carrier |
| 03/31/2005 | US20050070091 Method of chemical mechanical polishing |
| 03/31/2005 | US20050069640 Small particle size, narrow size distribution and a spherical morphology; spray pyrolysis |
| 03/31/2005 | US20050066739 Method and apparatus for wafer mechanical stress monitoring and wafer thermal stress monitoring |
| 03/31/2005 | US20050066585 Comprises oxidizer (hydrogen peroxide), inhibitor of nonferrous metal, abrasive, complexing agent, imine derivatives (acetamidine hydrochloride), hydrazine derivatives (carbohydrazide), and water; for use with polyurethane polishing pads; for semiconductor substrates |
| 03/31/2005 | DE19629286B4 Polierkissen und Poliervorrichtung The polishing pad and polishing apparatus |
| 03/30/2005 | EP1518910A1 Polishing composition for semiconductor wafers |
| 03/30/2005 | EP1518646A2 Resilient polishing pad for chemical mechanical polishing |
| 03/30/2005 | EP1294537B1 Wafer carrier with groove for decoupling retainer ring from wafer |
| 03/30/2005 | EP1218465B1 Polishing system with stopping compound and method of its use |
| 03/30/2005 | CN1602547A Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing |
| 03/30/2005 | CN1602546A In situ sensor based control of semiconductor processing procedure |
| 03/29/2005 | US6872662 Method for detecting the endpoint of a chemical mechanical polishing (CMP) process |
| 03/29/2005 | US6872329 Chemical mechanical polishing composition and process |
| 03/29/2005 | US6872328 Method of polishing or planarizing a substrate |
| 03/29/2005 | US6872132 Systems and methods for monitoring characteristics of a polishing pad used in polishing micro-device workpieces |
| 03/29/2005 | US6872131 Method and apparatus for chemical-mechanical planarization of microelectronic substrates with a carrier and membrane |
| 03/29/2005 | US6872130 Carrier head with non-contact retainer |
| 03/29/2005 | US6872129 Edge contact loadcup |
| 03/29/2005 | US6872128 System, method and apparatus for applying liquid to a CMP polishing pad |
| 03/29/2005 | US6872127 Polishing pad conditioning disks for chemical mechanical polisher |
| 03/29/2005 | US6872123 Method of and apparatus for lapping magnetic head slider |
| 03/29/2005 | US6872122 Apparatus and method of detecting a substrate in a carrier head |
| 03/24/2005 | WO2005027206A1 Polishing plate, stage unit, and exposure apparatus |
| 03/24/2005 | WO2005025804A1 Polished state monitoring apparatus and polishing apparatus using the same |
| 03/24/2005 | US20050064802 Polishing pad with window |
| 03/24/2005 | US20050064798 Methods and compositions for chemical mechanical planarization of ruthenium |
| 03/24/2005 | US20050064797 Methods for removing doped silicon material from microfeature workpieces |
| 03/24/2005 | US20050064796 Slurry for CMP, polishing method and method of manufacturing semiconductor device |
| 03/24/2005 | US20050064793 Apparatus and method for polishing row bars |
| 03/24/2005 | US20050064792 Pad conditioner setup |
| 03/24/2005 | US20050064709 Grinding pad and method of producing the same |
| 03/24/2005 | US20050064703 Substrate processing method |
| 03/24/2005 | US20050063103 Method of forming an embedded read element |
| 03/24/2005 | US20050063101 Ion bombardment of electrical lapping guides to decrease noise during lapping process |
| 03/24/2005 | US20050061674 Endpoint compensation in electroprocessing |
| 03/24/2005 | US20050061107 Coated silver-containing particles, method and apparatus of manufacture, and silver-containing devices made therefrom |
| 03/24/2005 | US20050060943 Polishing pad with recessed window |
| 03/23/2005 | EP1284841B1 Grooved polishing pads for chemical mechanical planarization |
| 03/23/2005 | CN1599951A Method for copper CMP using polymeric complexing agents |
| 03/23/2005 | CN1598062A Particle-free polishing fluid for nickel-based coating planarization |
| 03/22/2005 | US6869498 Chemical mechanical polishing with shear force measurement |
| 03/22/2005 | US6869350 Forming the polishing surface without cutting or skiving parallel to the polishing surface |
| 03/22/2005 | US6869348 Retaining ring for wafer carriers |
| 03/22/2005 | US6869347 Fabrication of devices with fibers engaged to grooves on substrates |
| 03/22/2005 | US6869345 Method and apparatus for chemical-mechanical planarization of microelectronic substrates with a carrier and membrane |