| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
|---|
| 05/03/2005 | US6887132 Slurry distributor for chemical mechanical polishing apparatus and method of using the same |
| 05/03/2005 | US6887131 Polishing pad design |
| 05/03/2005 | US6887130 Chemical mechanical polishing apparatus |
| 05/03/2005 | US6887129 Chemical mechanical polishing with friction-based control |
| 05/03/2005 | US6887127 Polishing apparatus |
| 05/03/2005 | US6886442 Punching apparatus for backing-films of CMP machines and preventive maintenance method for the same |
| 04/28/2005 | WO2005037488A1 Polishing apparatus |
| 04/28/2005 | WO2004070778A3 Apparatus and method for polishing semiconductor wafers using one or more pivotable load-and-unload cups |
| 04/28/2005 | US20050090188 Method and apparatus for polishing workpiece |
| 04/28/2005 | US20050090187 Polishing pad having grooved window therein and method of forming the same |
| 04/28/2005 | US20050090121 Chemical mechanical electropolishing system |
| 04/28/2005 | US20050090106 Method of second step polishing in copper CMP with a polishing fluid containing no oxidizing agent |
| 04/28/2005 | US20050090105 Methods and systems for planarizing workpieces, e.g., Microelectronic workpieces |
| 04/28/2005 | US20050088001 Polish pad tool |
| 04/28/2005 | US20050087441 Revolution member supporting apparatus and semiconductor substrate processing apparatus |
| 04/28/2005 | US20050086870 Diamond polishing particles and method of producing same |
| 04/28/2005 | US20050086869 Plurality of spaced apart members projecting protruding from substrate comprising abrasive and chemical additive layers |
| 04/27/2005 | EP1526163A1 Method of second step polishing in copper CMP with a polishing fluid containing no oxidizing agent |
| 04/27/2005 | EP1525947A1 Method for finish-polishing |
| 04/27/2005 | EP1525074A1 Abrasive articles with a liner with protrusions and methods of making and using the same |
| 04/27/2005 | CN2695177Y Hand-held precision grinding polishing machine |
| 04/27/2005 | CN1610963A Polishing fluid and polishing method |
| 04/27/2005 | CN1610962A Polishing pad, process for producing the same, and method of polishing |
| 04/27/2005 | CN1610730A Alkali metal-containing polishing system and method |
| 04/27/2005 | CN1610072A Method of second step polishing in copper CMP with a polishing fluid containing no oxidizing agent |
| 04/27/2005 | CN1610069A Process for polishing a semiconductor wafer |
| 04/27/2005 | CN1609156A Composition for polishing semiconductor layers |
| 04/27/2005 | CN1609155A Polishing composition for semiconductor wafers |
| 04/27/2005 | CN1608801A Polishing pad having grooved window therein and method of forming the same |
| 04/27/2005 | CN1608800A Grinding apparatus and method for refining grinding glass substrate |
| 04/26/2005 | US6884723 Methods for planarization of group VIII metal-containing surfaces using complexing agents |
| 04/26/2005 | US6884156 Multi-layer polishing pad material for CMP |
| 04/26/2005 | US6884155 Diamond grid CMP pad dresser |
| 04/26/2005 | US6884154 Method for apparatus for polishing outer peripheral chamfered part of wafer |
| 04/26/2005 | US6884153 Apparatus for electrochemical processing |
| 04/26/2005 | US6884152 Apparatuses and methods for conditioning polishing pads used in polishing micro-device workpieces |
| 04/26/2005 | US6884149 Combining an abrasive with an ultraviolet absorption spectra, diluting and analyzing; chemical mechanical polishing |
| 04/26/2005 | US6884148 Independently controlled read and write head stripe height parameters in slider back end process |
| 04/26/2005 | US6884147 Method for chemical-mechanical polish control in semiconductor manufacturing |
| 04/26/2005 | US6884146 Systems and methods for characterizing a polishing process |
| 04/26/2005 | US6884144 Methods and systems for planarizing microelectronic devices with Ge-Se-Ag layers |
| 04/21/2005 | WO2005036605A2 Improved retaining ring for wafer carriers |
| 04/21/2005 | WO2005035194A2 Stacked pad and method of use |
| 04/21/2005 | WO2005035191A1 Method and apparatus for wafer mechanical stress monitoring and wafer thermal stress monitoring |
| 04/21/2005 | US20050085169 Polishing pad for use in chemical - mechanical palanarization of semiconductor wafers and method of making same |
| 04/21/2005 | US20050085168 Cerium oxide abrasive and method of polishing substrates |
| 04/21/2005 | US20050085166 Process for chemical-mechanical polishing of metal substrates |
| 04/21/2005 | US20050085165 Blasting apparatus and process for accelerating blast media |
| 04/21/2005 | US20050082165 Electro-chemical machining apparatus |
| 04/21/2005 | US20050081998 Chemical-mechanical planarization slurries and powders and methods for using same |
| 04/20/2005 | EP1318891B1 Polishing pad comprising particulate polymer and crosslinked polymer binder |
| 04/20/2005 | EP1294536B1 Base-pad for a polishing pad |
| 04/20/2005 | EP1292428B1 A multi-zone grinding and/or polishing sheet |
| 04/20/2005 | EP1189730B1 Abrasive processing apparatus and method employing encoded abrasive product |
| 04/20/2005 | CN1608116A Methods for planarization of metal-containing surfaces using halogens and halides salts |
| 04/20/2005 | CN1607994A Method and apparatus for applying downward force on wafer during cmp |
| 04/20/2005 | CN1607992A Grooved rollers for a linear chemical mechanical planarization system |
| 04/20/2005 | CN1607067A Planarization system and method using a carbonate containing fluid |
| 04/20/2005 | CN1198488C Electro-deposition copper foil through surface processing and its producing method and use |
| 04/20/2005 | CN1197930C Polishing fluid composition |
| 04/20/2005 | CN1197688C Method for surface roughening of object to be processed and apparatus used thereof |
| 04/19/2005 | US6881134 Method and apparatus for chemical-mechanical planarization of microelectronic substrates with a carrier and membrane |
| 04/19/2005 | US6881129 Fixed-abrasive chemical-mechanical planarization of titanium nitride |
| 04/19/2005 | US6881127 Substrate assemblies on fixed-abrasive polishing pads with non- abrasive lubricating planarizing solutions. One aspect of the invention is to deposit a lubricating planarizing solution without abrasive particles onto a fixed-abrasive |
| 04/19/2005 | US6881124 Method of manufacturing magnetic head |
| 04/19/2005 | US6880727 Precision liquid mixing apparatus and method |
| 04/14/2005 | WO2005034226A1 Metal polishing composition |
| 04/14/2005 | WO2005032765A1 Polishing pad with recessed window |
| 04/14/2005 | WO2005032764A1 System, method and apparatus for applying liquid to a cmp polishing pad |
| 04/14/2005 | WO2005032763A1 A method and system for controlling the chemical mechanical polishing by using a sensor signal of a pad conditioner |
| 04/14/2005 | US20050079811 Defect reduction using pad conditioner cleaning |
| 04/14/2005 | US20050079806 Polishing pad |
| 04/14/2005 | US20050079805 Fiber embedded polishing pad |
| 04/14/2005 | US20050079803 Chemical-mechanical planarization composition having PVNO and associated method for use |
| 04/14/2005 | US20050079801 Methods for enhancing within-wafer CMP uniformity |
| 04/14/2005 | US20050079709 Planarization system and method using a carbonate containing fluid |
| 04/14/2005 | US20050079689 Semiconductor devices having alignment marks aligned with device features and methods for fabricating the same |
| 04/14/2005 | US20050079349 Producing large quantities of a high quality, dense aerosol for spray pyrolysis operations; multi-phase particles for use in manufacturing electrically-conductive metallic films for electronic products |
| 04/14/2005 | US20050077188 Establishing electrically conductive path through electrolyte between exposed layer of barrier material on substrate and electrode, electrochemically removing portion of exposed layer during first processing step in barrier processing station, detecting endpoint, processing exposed barrier layer |
| 04/14/2005 | US20050076581 Particulate or particle-bound chelating agents |
| 04/14/2005 | US20050076580 Acidic aqueous slurry comprising silica abrasive particles, oxidizer (hydrogen peroxide), quaternary ammonium hydroxide, phosphoric acid, and water; semiconductors; integrated circuits; photolithography; chemical mechanical polishing |
| 04/14/2005 | US20050076579 Bicine/tricine containing composition and method for chemical-mechanical planarization |
| 04/14/2005 | US20050076578 Tunable composition and method for chemical-mechanical planarization with aspartic acid/tolyltriazole |
| 04/13/2005 | EP1522567A1 Composition and method for temporarily fixing solid |
| 04/13/2005 | EP1522565A2 Polishing composition and use thereof |
| 04/13/2005 | EP1522385A2 Polishing Pad |
| 04/13/2005 | CN1606720A Cmp process involving frequency analysis-based monitoring |
| 04/13/2005 | CN1606486A Methods for planarization of group viii metal-containing surfaces using a fixed abrasive article |
| 04/13/2005 | CN1606485A Air platen for leading edge and trailing edge control |
| 04/13/2005 | CN1606133A Resilient polishing pad for chemical mechanical polishing |
| 04/13/2005 | CN1196760C Method for polishing or planarizing substrate |
| 04/13/2005 | CN1196759C Process for preparation of metal oxide slurry adaptable to chemical-mechanical polishing of semiconductor |
| 04/12/2005 | US6878631 Abrasive used for planarization of semiconductor device and method of manufacturing semiconductor device using the abrasive |
| 04/12/2005 | US6878629 Method for detecting CMP endpoint in acidic slurries |
| 04/12/2005 | US6878302 Method of polishing wafers |
| 04/12/2005 | US6878048 CMP belt stretch compensation apparatus and methods for using the same |
| 04/12/2005 | US6878045 Ultrasonic conditioning device cleaner for chemical mechanical polishing systems |
| 04/12/2005 | US6878044 Polishing apparatus |
| 04/12/2005 | US6878040 Method and apparatus for polishing and planarization |
| 04/12/2005 | US6878039 Polishing pad window for a chemical-mechanical polishing tool |