Patents for B24B 37 - Lapping machines or devices; Accessories (20,836)
05/2005
05/25/2005CN1620355A Chemical mechanical polishing of copper-oxide damascene structures
05/25/2005CN1618570A Chemical mechanical grinding device and its control system and regulating method of grinding pad profile
05/25/2005CN1203530C Method of manufacturing semiconductor wafer
05/25/2005CN1203528C Improved method and apparatus for chemical mechanical planarization (CMP) of semiconductor wafer
05/24/2005US6897079 Method of detecting and measuring endpoint of polishing processing and its apparatus and method of manufacturing semiconductor device using the same
05/24/2005US6896776 Method and apparatus for electro-chemical processing
05/24/2005US6896602 Wafer holding ring for chemical and mechanical polisher
05/24/2005US6896600 Liquid dispense manifold for chemical-mechanical polisher
05/24/2005US6896596 Polishing pad ironing system
05/24/2005US6896594 Method for grinding lens
05/24/2005US6896593 Microporous polishing pads
05/24/2005US6896590 CMP slurry and method for manufacturing a semiconductor device
05/24/2005US6896588 Chemical mechanical polishing optical endpoint detection
05/24/2005US6896586 Method and apparatus for heating polishing pad
05/24/2005US6896585 Polishing pad with transparent window having reduced window leakage for a chemical mechanical polishing apparatus
05/24/2005US6896584 Method of controlling carrier head with multiple chambers
05/24/2005US6896583 Method and apparatus for conditioning a polishing pad
05/24/2005US6895776 Anti-stratification-solution delivery system for spin-on dielectrics
05/19/2005US20050107016 Polishing equipment, and method of manufacturing semiconductor device using the equipment
05/19/2005US20050107012 Method and apparatus for polishing a substrate while washing a polishing pad of the apparatus with at least one free-flowing vertical stream of liquid
05/19/2005US20050107010 Planarizing solutions, planarizing machines and methods for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies
05/19/2005US20050107009 Polishing pad having slurry utilization enhancing grooves
05/19/2005US20050107007 Polishing pad process for producing the same and method of polishing
05/19/2005US20050107003 Ultra fine particle film forming method and apparatus
05/19/2005US20050106878 Polishing pad having a groove arrangement for reducing slurry consumption
05/19/2005US20050106359 Method of processing substrate
05/19/2005US20050105103 Optical techniques for measuring layer thicknesses and other surface characteristics of objects such as semiconductor wafers
05/19/2005US20050104048 Compositions and methods for polishing copper
05/18/2005EP1322449B1 Web-style pad conditioning system and methods for implementing the same
05/18/2005CN1617786A Polishing method and polishing device
05/18/2005CN1617308A Polishing pad having slurry utilization enhancing grooves
05/18/2005CN1617307A Polishing pad having a groove arrangement for reducing slurry consumption
05/18/2005CN1616574A High-rate barrier polishing composition
05/18/2005CN1616573A Slurry for CMP, polishing method and method of manufacturing semiconductor device
05/18/2005CN1616571A Barrier polishing fluid
05/18/2005CN1202558C Semiconductor device manufacture method
05/17/2005US6895360 Method to measure oxide thickness by FTIR to improve an in-line CMP endpoint determination
05/17/2005US6893477 Cerium-based abrasive material slurry and method for producing cerium-based abrasive material slurry
05/17/2005US6893337 Web-format polishing pads and methods for manufacturing and using web-format polishing pads in mechanical and chemical-mechanical planarization of microelectronic substrates
05/17/2005US6893336 Polishing pad conditioner and chemical-mechanical polishing apparatus having the same
05/17/2005US6893332 Carrier assemblies, planarizing apparatuses including carrier assemblies, and methods for planarizing micro-device workpieces
05/17/2005US6893331 Gimbal assembly for semiconductor fabrication and other tools
05/17/2005US6893328 Conductive polishing pad with anode and cathode
05/17/2005US6893327 Chemical mechanical polishing apparatus and method having a retaining ring with a contoured surface
05/17/2005US6893325 Configuring pad with predetermined duty cycle; removing one dielectric in presence of another
05/17/2005US6893322 Method and apparatus for measuring and controlling solids composition of a magnetorheological fluid
05/17/2005US6893321 Modular fluid-dispensing system
05/12/2005WO2005043132A1 Polishing endpoint detection system and method using friction sensor
05/12/2005WO2005042810A2 Membrane -mediated electropolishing
05/12/2005US20050101233 Polishing element
05/12/2005US20050101228 Polishing pad comprising biodegradable polymer
05/12/2005US20050101227 Materials and methods for low pressure chemical-mechanical planarization
05/12/2005US20050101226 Finishing polishing method
05/12/2005US20050101224 Combined eddy current sensing and optical monitoring for chemical mechanical polishing
05/12/2005US20050101223 Chemical mechanical polishing slurry pump monitoring system and method
05/12/2005US20050101138 System and method for applying constant pressure during electroplating and electropolishing
05/12/2005US20050100666 Aerosol method and apparatus, coated particulate products, and electronic devices made therefrom
05/12/2005US20050098764 Small particle size, narrow particle size distribution, spherical morphology and good crystallinity
05/12/2005US20050098540 for use in chemical mechanical polishing; abrasion
05/12/2005US20050098446 comprising backing layers secured to the polishing layers, having compressibility and hardness, used for chemical mechanical polishing
05/12/2005US20050097988 Generating an aerosol including a nickel metal precursor and moving the droplets through a heating zone to form nickel particles; while in the aerosol stream forming a coating on the particles, the coating comprising a material is different than the nickel-containing material; flat panel displays
05/12/2005US20050097825 For polishing semiconductor wafers comprising tantalum barrier material in presence of dielectric and interconnect metal; comprises triazole and/or tetrazole compounds as promoters
05/12/2005US20050097727 Multi-layer wiring board, method for producing multi-layer wiring board, polishing machine for multi-layer wiring board, and metal sheet for producing wiring board
05/11/2005EP1529598A1 Chemical mechanical polishing pad
05/11/2005EP1320443B1 Polishing pad having an advantageous micro-texture
05/11/2005CN2698520Y Grinding apparatus
05/11/2005CN1615348A 抛光垫 Polishing pad
05/11/2005CN1614749A 化学机械抛光垫 Chemical mechanical polishing pad
05/11/2005CN1613941A Polishing composition
05/11/2005CN1613607A Polishing kit for magnetic disk
05/11/2005CN1201141C Manufacturing method of electronic microscope fixed point test piece
05/10/2005US6890591 Multilayer polishing pad for microelectronics
05/10/2005US6890402 Substrate holding apparatus and substrate polishing apparatus
05/10/2005US6890249 Carrier head with edge load retaining ring
05/10/2005US6890245 Byproduct control in linear chemical mechanical planarization system
05/10/2005US6890244 Polishing pads useful in chemical mechanical polishing of substrates in the presence of a slurry containing abrasive particles
05/05/2005US20050095964 Method and apparatus for two-part CMP retaining ring
05/05/2005US20050095963 Chemical mechanical polishing system
05/05/2005US20050095960 Polishing apparatus and method for producing semiconductors using the apparatus
05/05/2005US20050095958 Chemical mechanical polishing apparatus and methods using a polishing surface with non-uniform rigidity
05/05/2005US20050095957 Two-sided chemical mechanical polishing pad for semiconductor processing
05/05/2005US20050095956 Apparatus and method for lapping thin film magnetic heads
05/05/2005US20050095865 Selective chemical-mechanical polishing properties of a cross-linked polymer and specific applications therefor
05/05/2005US20050095863 Chemical mechanical polishing method and apparatus
05/05/2005US20050092962 Abrasives for copper CMP and methods for making
05/05/2005US20050092620 Incrementally introducing abrasive particles; accurate removal of conductive barrier material; reduced defects
05/05/2005US20050092434 Dynamic polishing fluid delivery system for a rotational polishing apparatus
05/05/2005US20050092255 Edge-contact wafer holder for CMP load/unload station
05/05/2005US20050091863 Calibration wafer and kit
05/04/2005EP1526948A2 Uniform thin films produced by magnetorheological finishing
05/04/2005CN1612217A Apparatus and method for grinding thin film magnetic heads
05/04/2005CN1200449C Abrading head for chemical mechanical abrading
05/04/2005CN1200066C Polishing composition
05/03/2005US6889177 Large area pattern erosion simulator
05/03/2005US6887338 300 mm platen and belt configuration
05/03/2005US6887336 Method for fabricating a CMP pad having isolated pockets of continuous porosity
05/03/2005US6887138 Chemical mechanical polish (CMP) conditioning-disk holder
05/03/2005US6887137 Chemical mechanical polishing slurry and chemical mechanical polishing method using the same
05/03/2005US6887136 Apparatus and methods for multi-step chemical mechanical polishing
05/03/2005US6887133 Pad support method for chemical mechanical planarization