Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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05/25/2005 | CN1620355A Chemical mechanical polishing of copper-oxide damascene structures |
05/25/2005 | CN1618570A Chemical mechanical grinding device and its control system and regulating method of grinding pad profile |
05/25/2005 | CN1203530C Method of manufacturing semiconductor wafer |
05/25/2005 | CN1203528C Improved method and apparatus for chemical mechanical planarization (CMP) of semiconductor wafer |
05/24/2005 | US6897079 Method of detecting and measuring endpoint of polishing processing and its apparatus and method of manufacturing semiconductor device using the same |
05/24/2005 | US6896776 Method and apparatus for electro-chemical processing |
05/24/2005 | US6896602 Wafer holding ring for chemical and mechanical polisher |
05/24/2005 | US6896600 Liquid dispense manifold for chemical-mechanical polisher |
05/24/2005 | US6896596 Polishing pad ironing system |
05/24/2005 | US6896594 Method for grinding lens |
05/24/2005 | US6896593 Microporous polishing pads |
05/24/2005 | US6896590 CMP slurry and method for manufacturing a semiconductor device |
05/24/2005 | US6896588 Chemical mechanical polishing optical endpoint detection |
05/24/2005 | US6896586 Method and apparatus for heating polishing pad |
05/24/2005 | US6896585 Polishing pad with transparent window having reduced window leakage for a chemical mechanical polishing apparatus |
05/24/2005 | US6896584 Method of controlling carrier head with multiple chambers |
05/24/2005 | US6896583 Method and apparatus for conditioning a polishing pad |
05/24/2005 | US6895776 Anti-stratification-solution delivery system for spin-on dielectrics |
05/19/2005 | US20050107016 Polishing equipment, and method of manufacturing semiconductor device using the equipment |
05/19/2005 | US20050107012 Method and apparatus for polishing a substrate while washing a polishing pad of the apparatus with at least one free-flowing vertical stream of liquid |
05/19/2005 | US20050107010 Planarizing solutions, planarizing machines and methods for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies |
05/19/2005 | US20050107009 Polishing pad having slurry utilization enhancing grooves |
05/19/2005 | US20050107007 Polishing pad process for producing the same and method of polishing |
05/19/2005 | US20050107003 Ultra fine particle film forming method and apparatus |
05/19/2005 | US20050106878 Polishing pad having a groove arrangement for reducing slurry consumption |
05/19/2005 | US20050106359 Method of processing substrate |
05/19/2005 | US20050105103 Optical techniques for measuring layer thicknesses and other surface characteristics of objects such as semiconductor wafers |
05/19/2005 | US20050104048 Compositions and methods for polishing copper |
05/18/2005 | EP1322449B1 Web-style pad conditioning system and methods for implementing the same |
05/18/2005 | CN1617786A Polishing method and polishing device |
05/18/2005 | CN1617308A Polishing pad having slurry utilization enhancing grooves |
05/18/2005 | CN1617307A Polishing pad having a groove arrangement for reducing slurry consumption |
05/18/2005 | CN1616574A High-rate barrier polishing composition |
05/18/2005 | CN1616573A Slurry for CMP, polishing method and method of manufacturing semiconductor device |
05/18/2005 | CN1616571A Barrier polishing fluid |
05/18/2005 | CN1202558C Semiconductor device manufacture method |
05/17/2005 | US6895360 Method to measure oxide thickness by FTIR to improve an in-line CMP endpoint determination |
05/17/2005 | US6893477 Cerium-based abrasive material slurry and method for producing cerium-based abrasive material slurry |
05/17/2005 | US6893337 Web-format polishing pads and methods for manufacturing and using web-format polishing pads in mechanical and chemical-mechanical planarization of microelectronic substrates |
05/17/2005 | US6893336 Polishing pad conditioner and chemical-mechanical polishing apparatus having the same |
05/17/2005 | US6893332 Carrier assemblies, planarizing apparatuses including carrier assemblies, and methods for planarizing micro-device workpieces |
05/17/2005 | US6893331 Gimbal assembly for semiconductor fabrication and other tools |
05/17/2005 | US6893328 Conductive polishing pad with anode and cathode |
05/17/2005 | US6893327 Chemical mechanical polishing apparatus and method having a retaining ring with a contoured surface |
05/17/2005 | US6893325 Configuring pad with predetermined duty cycle; removing one dielectric in presence of another |
05/17/2005 | US6893322 Method and apparatus for measuring and controlling solids composition of a magnetorheological fluid |
05/17/2005 | US6893321 Modular fluid-dispensing system |
05/12/2005 | WO2005043132A1 Polishing endpoint detection system and method using friction sensor |
05/12/2005 | WO2005042810A2 Membrane -mediated electropolishing |
05/12/2005 | US20050101233 Polishing element |
05/12/2005 | US20050101228 Polishing pad comprising biodegradable polymer |
05/12/2005 | US20050101227 Materials and methods for low pressure chemical-mechanical planarization |
05/12/2005 | US20050101226 Finishing polishing method |
05/12/2005 | US20050101224 Combined eddy current sensing and optical monitoring for chemical mechanical polishing |
05/12/2005 | US20050101223 Chemical mechanical polishing slurry pump monitoring system and method |
05/12/2005 | US20050101138 System and method for applying constant pressure during electroplating and electropolishing |
05/12/2005 | US20050100666 Aerosol method and apparatus, coated particulate products, and electronic devices made therefrom |
05/12/2005 | US20050098764 Small particle size, narrow particle size distribution, spherical morphology and good crystallinity |
05/12/2005 | US20050098540 for use in chemical mechanical polishing; abrasion |
05/12/2005 | US20050098446 comprising backing layers secured to the polishing layers, having compressibility and hardness, used for chemical mechanical polishing |
05/12/2005 | US20050097988 Generating an aerosol including a nickel metal precursor and moving the droplets through a heating zone to form nickel particles; while in the aerosol stream forming a coating on the particles, the coating comprising a material is different than the nickel-containing material; flat panel displays |
05/12/2005 | US20050097825 For polishing semiconductor wafers comprising tantalum barrier material in presence of dielectric and interconnect metal; comprises triazole and/or tetrazole compounds as promoters |
05/12/2005 | US20050097727 Multi-layer wiring board, method for producing multi-layer wiring board, polishing machine for multi-layer wiring board, and metal sheet for producing wiring board |
05/11/2005 | EP1529598A1 Chemical mechanical polishing pad |
05/11/2005 | EP1320443B1 Polishing pad having an advantageous micro-texture |
05/11/2005 | CN2698520Y Grinding apparatus |
05/11/2005 | CN1615348A 抛光垫 Polishing pad |
05/11/2005 | CN1614749A 化学机械抛光垫 Chemical mechanical polishing pad |
05/11/2005 | CN1613941A Polishing composition |
05/11/2005 | CN1613607A Polishing kit for magnetic disk |
05/11/2005 | CN1201141C Manufacturing method of electronic microscope fixed point test piece |
05/10/2005 | US6890591 Multilayer polishing pad for microelectronics |
05/10/2005 | US6890402 Substrate holding apparatus and substrate polishing apparatus |
05/10/2005 | US6890249 Carrier head with edge load retaining ring |
05/10/2005 | US6890245 Byproduct control in linear chemical mechanical planarization system |
05/10/2005 | US6890244 Polishing pads useful in chemical mechanical polishing of substrates in the presence of a slurry containing abrasive particles |
05/05/2005 | US20050095964 Method and apparatus for two-part CMP retaining ring |
05/05/2005 | US20050095963 Chemical mechanical polishing system |
05/05/2005 | US20050095960 Polishing apparatus and method for producing semiconductors using the apparatus |
05/05/2005 | US20050095958 Chemical mechanical polishing apparatus and methods using a polishing surface with non-uniform rigidity |
05/05/2005 | US20050095957 Two-sided chemical mechanical polishing pad for semiconductor processing |
05/05/2005 | US20050095956 Apparatus and method for lapping thin film magnetic heads |
05/05/2005 | US20050095865 Selective chemical-mechanical polishing properties of a cross-linked polymer and specific applications therefor |
05/05/2005 | US20050095863 Chemical mechanical polishing method and apparatus |
05/05/2005 | US20050092962 Abrasives for copper CMP and methods for making |
05/05/2005 | US20050092620 Incrementally introducing abrasive particles; accurate removal of conductive barrier material; reduced defects |
05/05/2005 | US20050092434 Dynamic polishing fluid delivery system for a rotational polishing apparatus |
05/05/2005 | US20050092255 Edge-contact wafer holder for CMP load/unload station |
05/05/2005 | US20050091863 Calibration wafer and kit |
05/04/2005 | EP1526948A2 Uniform thin films produced by magnetorheological finishing |
05/04/2005 | CN1612217A Apparatus and method for grinding thin film magnetic heads |
05/04/2005 | CN1200449C Abrading head for chemical mechanical abrading |
05/04/2005 | CN1200066C Polishing composition |
05/03/2005 | US6889177 Large area pattern erosion simulator |
05/03/2005 | US6887338 300 mm platen and belt configuration |
05/03/2005 | US6887336 Method for fabricating a CMP pad having isolated pockets of continuous porosity |
05/03/2005 | US6887138 Chemical mechanical polish (CMP) conditioning-disk holder |
05/03/2005 | US6887137 Chemical mechanical polishing slurry and chemical mechanical polishing method using the same |
05/03/2005 | US6887136 Apparatus and methods for multi-step chemical mechanical polishing |
05/03/2005 | US6887133 Pad support method for chemical mechanical planarization |