| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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| 06/14/2005 | US6905632 Powder of pyrogenically produced silicon dioxide doped with 0.01 and 3 wt. % aluminium oxide having an average particle diameter of not more than 0.1 mu m. |
| 06/14/2005 | US6905526 Fabrication of an ion exchange polish pad |
| 06/14/2005 | US6905402 Polishing pad for planarization |
| 06/14/2005 | US6905399 Conditioning mechanism for chemical mechanical polishing |
| 06/14/2005 | US6905398 Chemical mechanical polishing tool, apparatus and method |
| 06/14/2005 | US6905397 Apparatus for enhanced rate chemical mechanical polishing with adjustable selectivity |
| 06/14/2005 | US6905394 Apparatus and method for polishing row bars |
| 06/14/2005 | US6905392 Polishing system having a carrier head with substrate presence sensing |
| 06/14/2005 | CA2249965C Slurry mixing apparatus and method |
| 06/09/2005 | WO2005053017A1 Semiconductor surface protecting sheet and method |
| 06/09/2005 | WO2005052994A2 Protecting thin semiconductor wafers during back-grinding in high-volume production |
| 06/09/2005 | WO2004111314A3 Algorithm for real-time process control of electro-polishing |
| 06/09/2005 | WO2004108358A3 Conductive polishing article for electrochemical mechanical polishing |
| 06/09/2005 | US20050124273 Method of forming a polishing pad for endpoint detection |
| 06/09/2005 | US20050124269 Polishing head and polishing apparatus |
| 06/09/2005 | US20050124267 Rinse apparatus and method for wafer polisher |
| 06/09/2005 | US20050124266 End effectors and methods for manufacturing end effectors with contact elements to condition polishing pads used in polishing micro-device workpieces |
| 06/09/2005 | US20050124264 Double side polishing device for wafer and double side polishing method |
| 06/09/2005 | US20050124262 Processing pad assembly with zone control |
| 06/09/2005 | US20050124165 Method for CMP removal rate compensation |
| 06/09/2005 | US20050121141 Real time process control for a polishing process |
| 06/08/2005 | EP1537949A2 Polishing apparatus including attitude controller for wafer carrier and turntable |
| 06/08/2005 | EP1536920A1 Novel finishing pad design for multidirectional use |
| 06/08/2005 | EP1536919A1 Method and apparatus for electromechanically and/or electrochemically-mechanically removing conductive material from a microelectronic substrate |
| 06/08/2005 | EP1536918A1 A method of polishing a wafer of material |
| 06/08/2005 | EP1278936B1 Tubing hanger with annulus bore |
| 06/08/2005 | CN1625575A Manufacturing method of potishing pad use polyurethane foam and polyurethane foam |
| 06/08/2005 | CN1624878A Method for polishing material layer on a semiconductor wafer |
| 06/07/2005 | US6903021 Method of polishing a semiconductor device |
| 06/07/2005 | US6903018 Methods and apparatuses for planarizing microelectronic substrate assemblies |
| 06/07/2005 | US6902659 Deposition and polishing of a conductive material on a semiconductor wafer |
| 06/07/2005 | US6902590 Chemical mechanical polishing compositions and methods relating thereto |
| 06/07/2005 | US6902470 Apparatuses for conditioning surfaces of polishing pads |
| 06/07/2005 | US6902466 Oscillating chemical mechanical planarization apparatus |
| 06/02/2005 | WO2005049274A2 Retaining ring with shaped surface |
| 06/02/2005 | WO2005000527A3 Multi-layer polishing pad material for cmp |
| 06/02/2005 | US20050118938 Wafer processing machine |
| 06/02/2005 | US20050118937 Polishing apparatus, polishing method, and semiconductor device fabrication method |
| 06/02/2005 | US20050118936 Integrated pad and belt for chemical mechanical polishing |
| 06/02/2005 | US20050118935 Substrate holding apparatus |
| 06/02/2005 | US20050118933 Wafer polishing method |
| 06/02/2005 | US20050118932 Adjustable gap chemical mechanical polishing method and apparatus |
| 06/02/2005 | US20050118930 Carrier assemblies, planarizing apparatuses including carrier assemblies, and methods for planarizing micro-device workpieces |
| 06/02/2005 | US20050118839 Chemical mechanical polish process control method using thermal imaging of polishing pad |
| 06/02/2005 | US20050118821 Slurry for CMP, polishing method and method of manufacturing semiconductor device |
| 06/02/2005 | US20050118820 CMP abrasive, liquid additive for CMP abrasive and method for polishing substrate |
| 06/02/2005 | US20050117164 Method and apparatus for measuring thickness of thin film and device manufacturing method using same |
| 06/02/2005 | US20050116369 Aerosol method and apparatus, particulate products, and electronic devices made therefrom |
| 06/01/2005 | EP1535979A2 Compositions and methods for chemical mechanical polishing silica and silicon nitride |
| 06/01/2005 | EP1535978A1 Polishing cloth and method of manufacturing semiconductor device |
| 06/01/2005 | EP1535699A1 Polishing pad with high optical transmission window |
| 06/01/2005 | EP1534795A2 Method for chemical mechanical polishing (cmp) of low-k dielectric materials |
| 06/01/2005 | CN1622985A 钨抛光溶液 Tungsten polishing solution |
| 06/01/2005 | CN1622290A Polishing cloth and method of manufacturing semiconductor device |
| 06/01/2005 | CN1622289A Polishing pad with high optical transmission window |
| 06/01/2005 | CN1204600C Method for cutting material on two-sided of semiconductor piece |
| 05/31/2005 | US6899804 Electrolyte composition and treatment for electrolytic chemical mechanical polishing |
| 05/31/2005 | US6899762 Epitaxially coated semiconductor wafer and process for producing it |
| 05/31/2005 | US6899612 Polishing pad apparatus and methods |
| 05/31/2005 | US6899611 Polishing pad for a semiconductor device having a dissolvable substance |
| 05/31/2005 | US6899610 Retaining ring with wear pad for use in chemical mechanical planarization |
| 05/31/2005 | US6899607 Polishing systems for use with semiconductor substrates including differential pressure application apparatus |
| 05/31/2005 | US6899603 Polishing apparatus |
| 05/31/2005 | US6899602 Porous polyurethane polishing pads |
| 05/31/2005 | US6899601 Method and apparatus for conditioning a polishing pad |
| 05/31/2005 | US6899598 For chemical-mechanical polishing; combining a polymer resin with a supercritical gas to produce a single phase solution and forming a pad from the solution; gas is generated by subjecting a gas to an elevated temperature and pressure. |
| 05/31/2005 | US6899597 Chemical mechanical polishing (CMP) process using fixed abrasive pads |
| 05/31/2005 | US6899596 Chemical mechanical polishing of dual orientation polycrystalline materials |
| 05/31/2005 | US6899595 Seal assembly manufacturing methods and seal assemblies manufactured thereby |
| 05/31/2005 | US6899594 Relative lateral motion in linear CMP |
| 05/31/2005 | US6899592 Polishing apparatus and dressing method for polishing tool |
| 05/31/2005 | US6899116 Pressure vessel systems and methods for dispensing liquid chemical compositions |
| 05/26/2005 | WO2005046935A1 Materials and methods for low pressure chemical-mechanical planarization |
| 05/26/2005 | WO2005012592A3 Cvd diamond-coated composite substrate for making same |
| 05/26/2005 | WO2005009679A3 Retainiing ring with trigger for chemical mechanical polishing apparatus |
| 05/26/2005 | US20050113011 Chemical mechanical polishing pad |
| 05/26/2005 | US20050113010 Chemical mechanical polishing apparatus |
| 05/26/2005 | US20050113008 Polishing pad with high optical transmission window |
| 05/26/2005 | US20050113007 Polishing apparatus and method of polishing work piece |
| 05/26/2005 | US20050113006 Chemical mechanical polishing apparatus and method to minimize slurry accumulation and scratch excursions |
| 05/26/2005 | US20050113002 CMP polishing heads retaining ring groove design for microscratch reduction |
| 05/26/2005 | US20050113001 Semiconductor device fabrication method and apparatus |
| 05/26/2005 | US20050113000 High selectivity colloidal silica slurry |
| 05/26/2005 | US20050112998 Polishing apparatus |
| 05/26/2005 | US20050112997 Advanced process control approach for Cu interconnect wiring sheet resistance control |
| 05/26/2005 | US20050112893 Method for producing a silicon wafer |
| 05/26/2005 | US20050112892 Chemical mechanical abrasive slurry and method of using the same |
| 05/26/2005 | US20050112354 Polishing sheet and manufacturing method of elastic plastic foam sheet |
| 05/26/2005 | US20050108947 An acidic aqueous solution of a quaternary C1 to C6 (cyclo)alkylammonium hydroxide, phthalic acid and monopotassium phthalate, polyacrylic acid, and an abraisive; improved selectivity in shallow trench isolation processes |
| 05/25/2005 | EP1533352A1 Compositions and methods for polishing copper |
| 05/25/2005 | EP1533077A1 Polishing apparatus and method of polishing work piece |
| 05/25/2005 | EP1533076A1 Polishing pad having a groove arrangement for reducing slurry consumption |
| 05/25/2005 | EP1533075A1 Polishing pad having slurry utilization enhancing grooves |
| 05/25/2005 | EP1532222A1 Method and apparatus for chemically, mechanically, and/or electrolytically removing material from microelectronic substrates |
| 05/25/2005 | EP1227912B1 Methods and apparatuses for planarizing microelectronic substrate assemblies |
| 05/25/2005 | CN2701587Y Abrasive disc structure |
| 05/25/2005 | CN2701586Y High precise ceramic ball grinding device |
| 05/25/2005 | CN1620639A System and method for point of use delivery, control and mixing chemical and slurry for CMP/cleaning system |
| 05/25/2005 | CN1620488A Cmp systems and methods utilizing amine-containing polymers |
| 05/25/2005 | CN1620357A Method and system for controlling the chemical mechanical polishing of substrates by calculating an overpolishing time and/or a polishing time of a final polishing step |