Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
11/1996
11/05/1996US5570504 Multi-Layer circuit construction method and structure
11/05/1996US5570502 Fabricating metal matrix composites containing electrical insulators
11/05/1996CA2056737C Via resistors within multi-layer, 3-dimensional structure/substrates
11/03/1996CA2174275A1 High resolution polyimide images using non-photosensitive layers of poly(amic acid) or salts thereof
10/1996
10/31/1996WO1996034361A2 Laminating device for joining a metal strip and an insulating material strip
10/31/1996WO1996033892A1 Control system for an automotive vehicle multi-functional apparatus
10/31/1996WO1996033818A1 Aqueous cleaner for removing solder pastes
10/31/1996WO1996033813A1 Process for preparing an insulated multilayer structure
10/31/1996WO1996033812A1 Methods and system for applying a uniform coating to a moving workpiece using an ultrasonic spray head
10/31/1996DE4192038C2 PCB assembly mfr. permitting wave soldering
10/30/1996EP0740497A1 Electric interconnection substrate
10/30/1996EP0740496A1 Method for fabricating highly conductive vias
10/30/1996EP0740495A2 Method and apparatus for printing solder paste
10/30/1996EP0740212A1 Aqueous processable, multilayer, photoimageable permanent coatings for printed circuits
10/30/1996EP0740211A1 Aqueous processable, multilayer, photoimageable permanent coatings for printed circuits
10/30/1996EP0740210A1 Flexible, aqueous processable, photoimageable permanent coatings for printed circuits
10/30/1996EP0739675A2 Liquid crystal display panel holding metal fixture
10/30/1996EP0739579A1 A circuit board with specifically designed connection terminals
10/30/1996EP0659287B1 Image-transfer process
10/30/1996EP0516819B1 Direct bonding of copper to aluminum nitride substrates
10/30/1996CN1134601A Organic chip carriers for wire bond-type chips
10/30/1996CN1134397A Aluminum nitride body having graded metallurgy
10/30/1996CN1033175C Method of depositing conductors in high aspect ratio apertures
10/29/1996US5570274 High density multichip module packaging structure
10/29/1996US5570032 For burning-in and testing of a semiconductor integrated circuit
10/29/1996US5569963 Preformed planar structures for semiconductor device assemblies
10/29/1996US5569960 Electronic component, electronic component assembly and electronic component unit
10/29/1996US5569958 Electrically conductive, hermetic vias and their use in high temperature chip packages
10/29/1996US5569955 High density integrated circuit assembly combining leadframe leads with conductive traces
10/29/1996US5569886 Flexible printed circuit board
10/29/1996US5569880 Surface mountable electronic component and method of making same
10/29/1996US5569739 Terminally unsaturated polyimide
10/29/1996US5569545 Copper clad laminate, multilayer printed circuit board and their processing method
10/29/1996US5569493 Preparation of cured cyanate ester resins and composites for metal plating
10/29/1996US5569330 Method and device for chemically treating substrates
10/29/1996US5569321 Adhesion accelerating agent comprising sulfuric acid, a halide, an organic acid and water
10/29/1996US5569075 Gas injection apparatus and process to form a controlled atmosphere in a confined space
10/29/1996US5569056 Electrical connection device and process for the production thereof
10/29/1996US5568892 Alignment and bonding techniques
10/29/1996US5568682 Orthogonal grid circuit interconnect method
10/24/1996WO1996033419A2 Method of cleaning probe tips of probe cards and apparatus for implementing the method
10/24/1996WO1996033299A1 An improved process for manufacture of uniformly sized metal spheres
10/24/1996WO1996033261A1 Cold cleaning composition based on alkanes or cycloalkanes and an organic compound comprising a ketone group
10/24/1996WO1996033260A1 Cycloalkane-based cleaning agent
10/24/1996WO1996033239A1 Polyimide resin composition
10/24/1996WO1996033065A1 Process for producing resin molding having minute cavities on the surface
10/24/1996WO1996033039A1 Fluxless soldering method
10/24/1996DE19511553A1 System und Verfahren zur Erzeugung elektrisch leitfähiger Verbindungsstrukturen sowie Verfahren zur Herstellung von Schaltungen und von bestückten Schaltungen System and method for producing an electrically conductive connection structures and methods for the preparation of circuits and circuits of loaded
10/24/1996CA2218633A1 An improved process for manufacture of uniformly sized metal spheres
10/24/1996CA2216820A1 Cold cleaning composition based on alkanes or cycloalkanes and an organic compound comprising a ketone group
10/23/1996EP0739063A2 Connection of printed board to board connector and using this connection for plug in units of electronic equipment
10/23/1996EP0738998A1 Display apparatus and assembly of its driving circuit
10/23/1996EP0738768A1 Silicone coating compositions for protecting packaged circuit boards
10/23/1996EP0738744A2 Cross-linked polymers
10/23/1996EP0738457A1 Flexible multilayer printed circuit boards and methods of manufacture
10/23/1996EP0738456A1 Method of producing a feedthrough on a circuit board
10/23/1996EP0738385A1 Measuring probe
10/23/1996EP0647389B1 Annular circuit components coupled with printed circuit board through-hole
10/23/1996EP0613590B1 Die mounting with uniaxial conductive adhesive
10/22/1996US5568363 Surface mount components and semifinished products thereof
10/22/1996US5567984 Process for fabricating an electronic circuit package
10/22/1996US5567792 Prepared from an amine and an epoxy with subsequent modification by a polyisocyanate compound; small spherical particles
10/22/1996US5567752 Silicon- and nitrogen- containing adhesion promotors and compositions containing them
10/22/1996US5567648 Process for providing interconnect bumps on a bonding pad by application of a sheet of conductive discs
10/22/1996US5567554 Mask for producing radomes to high precision
10/22/1996US5567534 Copper foil for printed circuits, zinc alloy of nickel and/or cobalt, a layer of benzotriazole and phosphorous compound
10/22/1996US5567336 Laser ablation forward metal deposition with electrostatic assisted bonding
10/22/1996US5567330 Electroconductive film on substrate with dielectric material, depositing second electroconductive film to form substructures then depositing a superconductive film for epitaxial growth and patterns, then forming metal pads
10/22/1996US5567329 Method and system for fabricating a multilayer laminate for a printed wiring board, and a printed wiring board formed thereby
10/22/1996US5567328 Medical circuit forming process
10/22/1996US5567304 Elimination of island formation and contact resistance problems during electroetching of blanket or patterned thin metallic layers on insulating substrate
10/22/1996US5567295 Method and apparatus for making staggered blade edge connectors
10/22/1996US5567240 Apparatus for manufacturing ceramic green sheet laminate for an electronic component
10/22/1996US5567237 Continuous drier for board-shaped piece material and coating installation comprising such a continuous drier
10/22/1996US5567167 Printed wiring board connection apparatus
10/22/1996US5566840 Device for aligning printed circuit boards and pattern carriers
10/22/1996US5566441 Attaching an electronic circuit to a substrate
10/22/1996CA2095068C Laser machining apparatus
10/17/1996WO1996032828A1 Drum-side treated metal foil and laminate for use in printed circuit boards and methods of manufacture
10/17/1996WO1996032453A1 Melt-flowable materials and method of sealing surfaces
10/17/1996WO1996032209A1 Method and apparatus for circuit board treatment
10/17/1996DE19541406C1 Continuous resin-bonded laminate simple prodn. for electrical industry
10/17/1996DE19513721A1 Etching the surface of printed circuit boards
10/17/1996CA2216285A1 Melt-flowable materials and method of sealing surfaces
10/16/1996EP0738007A2 Metal-base multilayer circuit substrate
10/16/1996EP0737710A1 Resin composition for electroless metal deposition and method for electroless metal deposition
10/16/1996EP0737701A2 Epoxy acrylate resins and their uses
10/16/1996EP0737536A1 Soldering
10/16/1996EP0737127A1 Process and apparatus for resin impregnation of a porous web
10/16/1996EP0737126A1 Process and apparatus for resin impregnation of a porous web
10/16/1996EP0737125A1 Process for resin impregnation of a porous web
10/16/1996EP0496899B1 Method for cleaning
10/16/1996CN1133547A Printed-circuit board and making method thereof
10/16/1996CN1133498A Installation for circuit elements
10/15/1996US5565837 Low profile printed circuit board
10/15/1996US5565789 Process for encoding printed circuit boards
10/15/1996US5565733 Electroluminescent modular lamp unit
10/15/1996US5565280 Electrical interconnect using particle enhanced joining of metal surfaces
10/15/1996US5565267 Composite substrates for preparation of printed circuits
10/15/1996US5565262 Electrical feedthroughs for ceramic circuit board support substrates
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