| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 02/18/1997 | US5603158 Method for producing flexible circuit boards |
| 02/13/1997 | WO1997005758A1 Process and device for producing through-connected printed circuit boards and multilayered printed circuit boards |
| 02/13/1997 | WO1997005675A1 Electrical connection between printed circuit boards |
| 02/13/1997 | WO1997005674A1 Co-axial connector systen |
| 02/13/1997 | WO1997005231A1 Cleaning composition containing an aliphatic hydrocarbon compound with at least two aromatic substituents |
| 02/13/1997 | WO1997005192A1 Plated molding and process for preparing plated moldings |
| 02/13/1997 | WO1997004910A1 Fluxless contacting of components |
| 02/13/1997 | WO1997004885A1 Vacuum flash evaporated polymer composites |
| 02/13/1997 | CA2227600A1 Process and device for producing through-connected printed circuit boards and multilayered printed circuit boards |
| 02/12/1997 | EP0758145A2 Method of manufacturing circuit module |
| 02/12/1997 | EP0757885A1 Method of forming metallic conductive patterns on insulating substrates |
| 02/12/1997 | CN1142743A Laser processing method for PCB, apparatus therefor and carbon dioxide laser oscillator |
| 02/12/1997 | CN1142686A Apparatus and method for manufacturing electronic components with project electrodes |
| 02/11/1997 | US5603000 Integrated circuit memory with verification unit which resets an address translation register upon failure to define one-to-one correspondences between addresses and memory cells |
| 02/11/1997 | US5602491 Integrated circuit testing board having constrained thermal expansion characteristics |
| 02/11/1997 | US5602422 Flexible leads for tape ball grid array circuit |
| 02/11/1997 | US5602221 Pressure sensitive adhesives with good low energy surface adhesion |
| 02/11/1997 | US5601965 Contains hydroxy-modified vinyl chloride/vinyl acetate polymer; useful as photoresists |
| 02/11/1997 | US5601941 Improved battery assembly |
| 02/11/1997 | US5601905 Laminate for insulation protection of circuit boards |
| 02/11/1997 | US5601902 Moisture-resistant |
| 02/11/1997 | US5601740 Method and apparatus for wirebonding, for severing bond wires, and for forming balls on the ends of bond wires |
| 02/11/1997 | US5601737 Surface treating process involving energy beam irradiation onto multilayered conductor parts of printed circuit board |
| 02/11/1997 | US5601678 Depositing trace metal layer on circuit board, forming via hole, depositing via metal, depositing electrical contact on second board, aligning, laminating boards |
| 02/11/1997 | US5601672 Method for making ceramic substrates from thin and thick ceramic greensheets |
| 02/11/1997 | US5601638 Thick film paste |
| 02/11/1997 | US5601459 Solder bearing lead and method of fabrication |
| 02/11/1997 | US5601438 Independent socket for use with stacked memory card connector assembly |
| 02/11/1997 | US5601229 Conductive metal ball attaching apparatus and method, and bump forming method |
| 02/11/1997 | US5601228 Solder-precipitating composition and mounting method using the composition |
| 02/11/1997 | US5601227 Welding the printed circuit board with an alloy of tin and antimony |
| 02/11/1997 | US5600877 Applying flux containing activator of nonionic halogen group to element to be soldered, soldering, applying resin, hardening |
| 02/06/1997 | WO1997004629A1 Metal ball grid electronic package |
| 02/06/1997 | WO1997004628A1 Improvements in or relating to printed circuit board manufacture |
| 02/06/1997 | WO1997004627A1 Copper foil for the manufacture of printed circuits and method of producing same |
| 02/06/1997 | WO1997004483A1 Ceramic circuit board |
| 02/06/1997 | WO1997004481A1 Carrier, semiconductor device, and method of their mounting |
| 02/06/1997 | WO1997004361A1 Heterogeneous photo-initiators, photopolymerisable compositions and their use |
| 02/06/1997 | WO1997003833A1 Apparatus for supporting and tensioning a stencil |
| 02/06/1997 | WO1997003829A1 Method for producing input/output connections in a ceramic device |
| 02/06/1997 | DE19528632A1 Steuergerät bestehend aus mindestens zwei Gehäuseteilen Control device consisting of at least two housing parts |
| 02/06/1997 | CA2227192A1 Heterogeneous photo-initiators, photopolymerisable compositions and their use |
| 02/06/1997 | CA2227179A1 Copper foil for the manufacture of printed circuits and method of producing same |
| 02/05/1997 | EP0757407A1 Films and coatings having anisotropic conductive pathways therein |
| 02/05/1997 | EP0757388A1 Electronic circuit board in thick film technology |
| 02/05/1997 | EP0757386A2 Systems interconnected by bumps of joining material |
| 02/05/1997 | EP0757119A2 Cleaning method and cleaning apparatus |
| 02/05/1997 | EP0757118A1 Microetching composition for copper or copper alloy |
| 02/05/1997 | EP0757025A1 Process for forming a film on a ceramic substrate |
| 02/05/1997 | EP0756540A1 Composite article and method for making same |
| 02/05/1997 | EP0715773A4 Cross-connect system |
| 02/05/1997 | EP0446367B1 Control device |
| 02/05/1997 | CN1142252A Pretreatment solution for electroless plating, electroless plating bath and electroless plating method |
| 02/05/1997 | CN1142204A Ammonia-free deposition of copper by disproportionation |
| 02/05/1997 | CN1142169A Circuit-board card and production method thereof |
| 02/05/1997 | CN1033989C Connection using zebra stripe and structure thereof |
| 02/04/1997 | US5600530 Electrostatic chuck |
| 02/04/1997 | US5600295 Thermal fuse and method for the activation thereof |
| 02/04/1997 | US5600285 Monolithic stripline crossover coupler having a pyramidal grounding structure |
| 02/04/1997 | US5600179 Package for packaging a semiconductor device suitable for being connected to a connection object by soldering |
| 02/04/1997 | US5600178 Semiconductor package having interdigitated leads |
| 02/04/1997 | US5600103 Circuit devices and fabrication method of the same |
| 02/04/1997 | US5600102 Solder preform wrappable around a printed circuit card edge |
| 02/04/1997 | US5600101 Multilayer electronic component and method of manufacturing the same |
| 02/04/1997 | US5600100 Electrical device, in particular steering column switch for automotive vehicles |
| 02/04/1997 | US5600099 Chemically grafted electrical devices |
| 02/04/1997 | US5599747 Method of making circuitized substrate |
| 02/04/1997 | US5599744 Method of forming a microcircuit via interconnect |
| 02/04/1997 | US5599739 Barrier layer treatments for tungsten plug |
| 02/04/1997 | US5599595 Printed plastic circuits and contacts and method for making same |
| 02/04/1997 | US5599592 Irradiation plastic piece surface with excimer laser, immersing irradiated piece into electroless plating metal bath, free of palladium to form metal film, heat treating metal film to diffuse metal film in plastic piece |
| 02/04/1997 | US5599585 Vapor deposition or sputtering of metals onto non-woven fibrous webs while cooling |
| 02/04/1997 | US5599582 Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier |
| 02/04/1997 | US5599414 Method of manufacturing multilayered ceramic structures |
| 02/04/1997 | US5599413 Method of producing a ceramic electronic device |
| 02/04/1997 | US5599398 Process and machine for cleaning parts |
| 02/04/1997 | US5599201 Circuit assembly having stamped circuitry with a wire trap |
| 02/04/1997 | US5599144 Low friction flute tungsten carbon microdrill |
| 02/04/1997 | US5599046 Lottery ticket structure with circuit elements |
| 02/04/1997 | US5598967 Method and structure for attaching a circuit module to a circuit board |
| 02/04/1997 | US5598757 Method for shearing panels |
| 02/04/1997 | US5598627 Method of making a wire harness |
| 02/04/1997 | CA2149024C Wave-soldering using a shroud for a gas |
| 02/04/1997 | CA2090215C Dimple interconnect for flat cables and printed wiring boards |
| 02/02/1997 | CA2182463A1 Epoxy-containing waterborne photoimageable composition |
| 02/02/1997 | CA2182432A1 Films and coatings having anisiotropic conductive pathways therein |
| 01/30/1997 | WO1997003544A1 Conductive connection and process for producing it |
| 01/30/1997 | WO1997003482A1 Separable electrical connector assembly having a planar array of conductive protrusions |
| 01/30/1997 | WO1997003144A1 Adhesives containing electrically conductive agents |
| 01/30/1997 | WO1997003143A1 Screen printable adhesive compositions |
| 01/30/1997 | WO1997002953A1 Printing method and apparatus |
| 01/30/1997 | WO1997002733A2 Microwave/millimeter wave circuit structure with discrete flip-chip mounted elements, and method of fabricating the same |
| 01/30/1997 | DE19628702A1 Flußmittelfreie Kontaktierung von Bauelementen Flux-contacting devices |
| 01/30/1997 | CA2224378A1 Adhesives containing electrically conductive agents |
| 01/29/1997 | EP0756443A1 Multi-layer structures containing an adhesion promoting layer |
| 01/29/1997 | EP0756442A2 Method of soldening components to a carrier foil |
| 01/29/1997 | EP0756298A2 Electronic inductive device and method for manufacturing |
| 01/29/1997 | EP0756294A1 Mount for supporting a high frequency transformer over a component on a substrate in a hybrid module and method of assembling the hybrid module |
| 01/29/1997 | EP0755979A2 Thermosetting resin compositions and their use for thin film wiring boards |
| 01/29/1997 | EP0755957A1 Nonhalogenated poly(arylene ethers) |