| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 04/09/1997 | EP0670760A4 Electrical connector. |
| 04/09/1997 | EP0613608B1 Electromagnetic interference control in multilayer structures |
| 04/09/1997 | EP0485588B1 Electrodeposited copper foil and process for making same using electrolyte solutions having low chloride ion concentrations |
| 04/09/1997 | CN1147268A High temp. resistant antistatic pressure-sensitive adhesive tape |
| 04/09/1997 | CN1147025A Copper and copper alloy micro-etching agent |
| 04/09/1997 | CN1034521C Ternary azeotropic compositions of 1,1,1,2,3,4,4,5,5,5-decafluoropentane and trans-1,2-dichloroethylene with methanol or ethanol |
| 04/09/1997 | CN1034520C Binary azeotropic compositions of (CF3CHFCHFCF2CF3) with methanol or ethanol or isopropanol |
| 04/09/1997 | CN1034519C Ternary azeotropic compositions of dichloro-pentafluoropropane and trans-1,2-dichloroethylene with methanol or ethanol or isopropanol |
| 04/09/1997 | CN1034481C No-clean soldering flux and method using the same and use thereof |
| 04/08/1997 | US5619067 Semiconductor device package side-by-side stacking and mounting system |
| 04/08/1997 | US5619018 Low weight multilayer printed circuit board |
| 04/08/1997 | US5619017 Microelectronic bonding with lead motion |
| 04/08/1997 | US5618896 Coatings; adhesives; thermal stability; higher glass transition temperatures |
| 04/08/1997 | US5618636 Low thermal expansion polyimide films are formed as insulation and surface protection films stacked with multilayered metal films; wiring board |
| 04/08/1997 | US5618611 Metallization of ferrites through surface reduction |
| 04/08/1997 | US5618454 Multi-wavelength programmable laser processing mechanisms and apparatus utilizing design data translation system |
| 04/08/1997 | US5618400 Electroplating process |
| 04/08/1997 | US5618369 Coextrusion of melts of polypropylene homopolymers and copolymers to form films, stretching, heat setting; base layer contains migrating additives |
| 04/08/1997 | US5618189 Solder medium for circuit interconnection |
| 04/08/1997 | US5617990 Shield and method for selective wave soldering |
| 04/08/1997 | US5617989 Solder leveling apparatus and method |
| 04/08/1997 | US5617629 Process for production of printed circuit boards and use thereby |
| 04/08/1997 | CA2097806C Electroacoustic transducer mounting apparatus |
| 04/08/1997 | CA2077499C Pattern structure of a printed circuit board |
| 04/03/1997 | WO1997012504A1 Method for surface mounting a heatsink to a printed circuit board |
| 04/03/1997 | WO1997012503A1 Electronic assembly with semi-crystalline copolymer adhesive |
| 04/03/1997 | WO1997012397A1 Microelectronic assemblies including z-axis conductive films |
| 04/03/1997 | WO1997012388A1 Apparatus and method for making laminated electrical and electronic devices |
| 04/03/1997 | CA2205810A1 Microelectronic assemblies including z-axis conductive films |
| 04/02/1997 | EP0766507A1 Circuit board having a window adapted to receive a single in-line package module |
| 04/02/1997 | EP0766503A2 Multi-layered printed circuit board, and grid array package adopting the same |
| 04/02/1997 | EP0766344A2 Jumper connector |
| 04/02/1997 | EP0766304A2 Method for coating heterogeneous substrates with homogeneous layers |
| 04/02/1997 | EP0765534A1 High impact digital crash data recorder |
| 04/02/1997 | EP0721682A4 Connector device for electrically interconnecting printed circuit board like members |
| 04/02/1997 | EP0605445B1 Coating compositions |
| 04/02/1997 | EP0595881B1 Use of halogenated-free cleaning agents for removal of flux and solder from electronic and electrical assemblies |
| 04/02/1997 | CN1146848A Copper foil and high-density multi-layered printed circuit board using the copper foil for inner layer circuit |
| 04/02/1997 | CN1146748A Composite article and method for making same |
| 04/02/1997 | CN1146707A Printed-circuit board |
| 04/02/1997 | CN1146635A Terminal for electronic elements and making method |
| 04/01/1997 | US5617300 Connecting method of printed substrate and apparatus |
| 04/01/1997 | US5617298 Collinear terminated transmission line structure |
| 04/01/1997 | US5617297 Encapsulation filler technology for molding active electronics components such as IC cards or PCMCIA cards |
| 04/01/1997 | US5617294 Apparatus for removing heat from an integrated circuit package that is attached to a printed circuit board |
| 04/01/1997 | US5616962 Semiconductor integrated circuit devices having particular terminal geometry |
| 04/01/1997 | US5616960 Multilayered interconnection substrate having a resin wall formed on side surfaces of a contact hole |
| 04/01/1997 | US5616956 Circuit substrate including insulating layer of aluminum nitride and electrically conductive layer of conductive component, aluminum nitride and other components, and semiconductor device containing same |
| 04/01/1997 | US5616670 Pressure sensitive adhesives with good oily surface adhesion |
| 04/01/1997 | US5616422 Metallized substrate |
| 04/01/1997 | US5616421 Metal matrix composites containing electrical insulators |
| 04/01/1997 | US5616256 Printed wiring board and process for producing thereof |
| 04/01/1997 | US5616230 Method for direct-electroplating an electrically nonconductive substrate |
| 04/01/1997 | US5616206 Method for arranging conductive particles on electrodes of substrate |
| 04/01/1997 | US5616164 Methods for making metal particle spherical and removing oxide film solder paste and soldering method |
| 04/01/1997 | US5616067 CO2 nozzle and method for cleaning pressure-sensitive surfaces |
| 04/01/1997 | US5616053 Continuous molded electrical connector |
| 04/01/1997 | US5616050 Flexible circuit connector |
| 04/01/1997 | US5616035 Electrical connector |
| 04/01/1997 | US5615827 Flux composition and corresponding soldering method |
| 04/01/1997 | US5615825 Fluorinated fluxless soldering |
| 04/01/1997 | US5615824 Method of making an electrical connection |
| 04/01/1997 | US5615823 Soldering ball mounting apparatus and method |
| 04/01/1997 | US5615477 Method for interconnecting a flip chip to a printed circuit substrate |
| 04/01/1997 | US5615470 Process for producing plastic laminates with metal laminae |
| 03/27/1997 | WO1997011591A1 Flexible circuits with bumped interconnection capability |
| 03/27/1997 | WO1997011590A2 Method of detecting the position and displacement of layers on multilayered circuit boards |
| 03/27/1997 | WO1997011589A1 Coating for the structured production of conductors on the surface of electrically insulating substrates |
| 03/27/1997 | WO1997011377A1 Machine for the opposite control of printed circuits |
| 03/27/1997 | WO1997011210A1 Method for producing electrodeposited copper foil and copper foil obtained by same |
| 03/27/1997 | WO1997011209A2 Process and device for treating holes or recesses in workpieces with liquid treatment agents |
| 03/27/1997 | WO1997011134A1 Coating compositions |
| 03/27/1997 | WO1997006656A3 Method of manufacturing devices comprising a base with a conductor pattern of electrical conductors |
| 03/27/1997 | DE19638681A1 Manufacturing method for electrical distribution box for mutual connection of cable harnesses |
| 03/27/1997 | DE19535705A1 Double-sided circuit board with multiple connection pads |
| 03/27/1997 | DE19535068A1 Beschichtung zur strukturierten Erzeugung von Leiterbahnen auf der Oberfläche von elektrisch isolierenden Substraten Coating for the structured production of conductor tracks on the surface of electrically insulating substrates |
| 03/27/1997 | CA2231865A1 Machine for the opposite control of printed circuits |
| 03/27/1997 | CA2231612A1 Coating compositions |
| 03/27/1997 | CA2229023A1 Method and device for treating holes or recesses extending into workpieces with liquid treatment media |
| 03/26/1997 | EP0765110A1 Circuit board and method of making |
| 03/26/1997 | EP0765053A2 Printed circuit board, printed circuit board used for flat panel display drive circuit, and flat panel display device |
| 03/26/1997 | EP0765010A2 Anti-wicking board to board connector |
| 03/26/1997 | EP0764393A1 A low cost, high performance package for microwave circuits in the up to 90 ghz frequency range using bga i/o rf port format and ceramic substrate technology |
| 03/26/1997 | EP0764352A1 Microelectronic contacts and assemblies |
| 03/26/1997 | EP0764342A1 Electrostatic chuck |
| 03/26/1997 | EP0764148A1 Process for preparing biscyanoacrylates |
| 03/26/1997 | EP0708847B1 Method for metallising non-conductive substrates |
| 03/26/1997 | EP0674808B1 Electrical interconnect structures |
| 03/26/1997 | EP0668830A4 Self tooling, molded electronics packaging. |
| 03/26/1997 | CN1146134A Assembly for mounting components to flexible cables |
| 03/26/1997 | CN1145849A Multi-layer structures containing adhesion promoting layer |
| 03/26/1997 | CN1034386C Method and apparatus of gas shrouded wave soldering |
| 03/25/1997 | US5615387 Method and apparatus for reworking printed circuit boards using surface coating and selective removal of an electrically conductive material |
| 03/25/1997 | US5615088 Flexible printed circuit device |
| 03/25/1997 | US5615031 Fine sphere, a spherical spacer for a liquid crystal display element and a liquid crystal element using the same |
| 03/25/1997 | US5614698 Circuit board apparatus with integral, edge-readable bar code structure, and associated methods |
| 03/25/1997 | US5614324 Multi-layer structures containing a silane adhesion promoting layer |
| 03/25/1997 | US5614264 Fluid delivery apparatus and method |
| 03/25/1997 | US5614252 Integrated circuits |
| 03/25/1997 | US5614114 Laser system and method for plating vias |