| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 05/08/1996 | EP0616720B1 Method of manufacturing highly conducting composites containing only small proportions of electron conductors |
| 05/07/1996 | US5515241 Space-saving assemblies for connecting integrated circuits to circuit boards |
| 05/07/1996 | US5515086 Contact structure between flexible cable and signal receiving unit and recording apparatus using said contact structure |
| 05/07/1996 | US5514839 Weldable flexible circuit termination for high temperature applications |
| 05/07/1996 | US5514729 Conductive polyepoxide for traces (wires) on circuit board |
| 05/07/1996 | US5514451 Conductive via fill inks for ceramic multilayer circuit boards on support substrates |
| 05/07/1996 | US5514449 Interconnect substrate comprising a metal-polymer composite incorporating microelectronic circuitry |
| 05/07/1996 | US5514414 Acid flux for solders |
| 05/07/1996 | US5514326 Ceramic sheets and copper pastes to form films for multilayer elements |
| 05/07/1996 | US5514294 Limonene and tetrahydrofurfuryl alcohol cleaning agent |
| 05/07/1996 | US5514258 Substrate plating device having laminar flow |
| 05/07/1996 | US5514243 Dry etching apparatus |
| 05/07/1996 | US5513430 Method for manufacturing a probe |
| 05/03/1996 | CA2161915A1 Optical module circuit board having flexible structure |
| 05/02/1996 | WO1996012830A1 Laser method for plating vias |
| 05/02/1996 | WO1996012777A1 Etching plastics with nitrosyls |
| 05/02/1996 | WO1996012571A1 Cleaning agent, method and equipment |
| 05/02/1996 | DE4438777A1 Verfahren zur Herstellung elektrischer Schaltungsträger A process for producing electrical circuit carriers |
| 05/02/1996 | DE4438299A1 Two-pin electronic component e.g. electrolytic capacitor, battery or diode, for mounting on flat conductor circuit board |
| 05/02/1996 | DE4438053A1 Electrically conductive structure mfg. for integrated optical circuit |
| 05/02/1996 | DE19540122A1 Verfahren zur Verringerung der Initiationszeit in einem stromlosen Bad A method for reducing the initiation time in an electroless plating bath |
| 05/01/1996 | EP0710062A1 Multilayer printed wiring board and its manufacture, and transferring plate and its manufacture |
| 05/01/1996 | EP0710061A1 Method and device for hermetic protection of electronic circuit |
| 05/01/1996 | EP0710060A1 Process for fabrication of plastic supports, device for fabrication of such a support and application of the process for production of integrated circuit cards |
| 05/01/1996 | EP0710058A2 Inhibiting short-circuits between electrically conductive paths |
| 05/01/1996 | EP0709886A1 Anisotropic film conductor for microconnections |
| 05/01/1996 | EP0709883A1 Semiconductor package fabricated by using tape automated bonding |
| 05/01/1996 | EP0709866A2 Manufacturing method and manufacturing apparatus for ceramic electronic components |
| 05/01/1996 | EP0709804A1 Process of fabricating contactless cards |
| 05/01/1996 | EP0709494A2 Method of surface-roughening treatment of copper foil |
| 05/01/1996 | EP0709490A1 Plating method by means of an electroless gold plating solution and system therefor |
| 05/01/1996 | EP0708847A1 Method for metallising non-conductive substrates |
| 05/01/1996 | EP0708707A1 Method of laminate manufacture |
| 05/01/1996 | EP0597090B1 Swash plate piston pump/motor |
| 04/30/1996 | US5513099 Circuit board repair and rework apparatus |
| 04/30/1996 | US5513077 Power distribution center for motor vehicle, provided with printed circuit boards, printed circuit webs and intermediate insulations arranged in layers |
| 04/30/1996 | US5513076 Multi-level assemblies for interconnecting integrated circuits |
| 04/30/1996 | US5512786 Package for housing semiconductor elements |
| 04/30/1996 | US5512781 Semiconductor package device for super high-frequency band |
| 04/30/1996 | US5512712 Printed wiring board having indications thereon covered by insulation |
| 04/30/1996 | US5512711 Multilayer ceramic substrates |
| 04/30/1996 | US5512418 Infra-red sensitive aqueous wash-off photoimaging element |
| 04/30/1996 | US5512381 Copper sheet having one surface adhered to fiber reinforced polymer layer and other surface covered by protective sheet until exposure to form circuit patterns |
| 04/30/1996 | US5512360 PTFE reinforced compliant adhesive and method of fabricating same |
| 04/30/1996 | US5512353 Conductive layers of copper or an alloy containing copper; ceramic layers comprise a complex oxide or an oxide solid solution containing copper |
| 04/30/1996 | US5512335 Fluid treatment device with vibrational energy means |
| 04/30/1996 | US5512224 Methods for making circuit boards by vacuum impregnation |
| 04/30/1996 | US5512162 Method for photo-forming small shaped metal containing articles from porous precursors |
| 04/30/1996 | US5512154 Apparatus for selectively electroplating apertured metal or metallized products |
| 04/30/1996 | US5511719 Process of joining metal members |
| 04/30/1996 | US5511306 Masking of circuit board vias to reduce heat-induced board and chip carrier package warp during wavesolder process |
| 04/26/1996 | CA2161302A1 Seal protection method and device for an electronic circuit |
| 04/25/1996 | WO1996012393A1 Process for coating electrically non-conducting surfaces with connected metal structures |
| 04/25/1996 | WO1996012392A1 Process for manufacturing electrical circuit bases |
| 04/25/1996 | WO1996012051A1 Process for separating metal coatings |
| 04/25/1996 | WO1996011751A1 Noble metal coating method by immersion |
| 04/25/1996 | DE4438799A1 Verfahren zum Beschichten elektrisch nichtleitender Oberflächen mit Metallstrukturen Process for coating electrically non-conductive surfaces with metal structures |
| 04/25/1996 | DE4438791A1 Deposition of metal layers on polyimide substrates |
| 04/25/1996 | DE19508835C1 Making blind holes in double-sided circuit boards for through-hole connection |
| 04/25/1996 | CA2203172A1 Process for manufacturing electrical circuit bases |
| 04/25/1996 | CA2203171A1 Process for coating electrically non-conducting surfaces with connected metal structures |
| 04/25/1996 | CA2203024A1 Process for plating metal coatings |
| 04/25/1996 | CA2161155A1 Carbon dioxide-based fluxing media for non-voc, no-clean soldering |
| 04/24/1996 | EP0708583A1 Electronic apparatus and its manufacture |
| 04/24/1996 | EP0708582A1 Electrically conductive paste materials and applications |
| 04/24/1996 | EP0708581A2 A process for the electroless deposition of metal on a substrate |
| 04/24/1996 | EP0708459A1 Coaxial vias in an electronic substrate |
| 04/24/1996 | EP0708372A1 A single resist layer lift-off process for forming patterned layers on a substrate |
| 04/24/1996 | EP0708369A1 Solvent system for forming films of photoimageable compositions |
| 04/24/1996 | EP0707746A1 Flex circuit connector |
| 04/24/1996 | EP0707524A1 Solderable anisotropically conductive composition and method of using same |
| 04/24/1996 | EP0686073A4 No-clean, low-residue, volatile organic compound free soldering flux and method of use |
| 04/24/1996 | EP0668808A4 No-clean soldering flux and method using the same. |
| 04/24/1996 | EP0667962B1 Printed circuit board testing device with foil adapter |
| 04/24/1996 | EP0544915B1 Package structure of semiconductor device and manufacturing method therefor |
| 04/24/1996 | CN1121337A Clamping-stretching system for stencils for screen printers, with printing table for pc boards |
| 04/24/1996 | CN1121280A Electric member having leads |
| 04/24/1996 | CN1121186A A liquid crystal display device having veideo signal driving circuit mounted on one side |
| 04/24/1996 | CN1121090A Method of adhesion to a polymide surface by formation of covalent bonds |
| 04/23/1996 | US5510958 Electronic circuit module having improved cooling arrangement |
| 04/23/1996 | US5510956 Electronic part unit or assembly having a plurality of electronic parts enclosed within a metal enclosure member mounted on a wiring layer |
| 04/23/1996 | US5510628 Using diamine as cell adhesion promoter |
| 04/23/1996 | US5510580 Printed circuit board with landless blind hole for connecting an upper wiring pattern to a lower wiring pattern |
| 04/23/1996 | US5510425 Polyimides, thermosetting resin compositions containing the polyimides, formed articles of the resin compositions, and production process of the polyimides |
| 04/23/1996 | US5510216 Using ligatrig material, electroless metallization catalysts and electroless plating solution |
| 04/23/1996 | US5510139 Process for assembly and bonding of electronic components on an insulating support |
| 04/23/1996 | US5510138 Formulating hot melt coating composition which is solid or semisolid at room temperature, heating to melt, depositing on substrate, allowing to cool and solidify to form conformal protective coating |
| 04/23/1996 | US5510112 Composition for enhancing the biodegradation of biodegradable organic wastes |
| 04/23/1996 | US5510010 Copper article with protective coating |
| 04/23/1996 | US5509815 Solder medium for circuit interconnection |
| 04/23/1996 | US5509599 Method for securing a hybrid circuit on a printed circuit board |
| 04/23/1996 | US5509597 Apparatus and method for automatic monitoring and control of a soldering process |
| 04/23/1996 | US5509557 Roughening metal sheet surface, laminating to dielectric, seeding to activate, electroless plating |
| 04/23/1996 | US5509553 Direct etch processes for the manufacture of high density multichip modules |
| 04/23/1996 | US5509204 Method of forming a flat flexible jumper |
| 04/23/1996 | US5509203 Method for manufacturing a sheet formed connector for inspection of an integrated circuit |
| 04/23/1996 | US5509200 Method of making laminar stackable circuit board structure |
| 04/23/1996 | US5509197 Method of making substrate edge connector |
| 04/23/1996 | US5509196 Method of fabricating a flex laminate package |
| 04/21/1996 | CA2159234A1 Electrically conductive paste materials and applications |